JP4748968B2 - 半導体ウエーハの製造方法 - Google Patents

半導体ウエーハの製造方法 Download PDF

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Publication number
JP4748968B2
JP4748968B2 JP2004312195A JP2004312195A JP4748968B2 JP 4748968 B2 JP4748968 B2 JP 4748968B2 JP 2004312195 A JP2004312195 A JP 2004312195A JP 2004312195 A JP2004312195 A JP 2004312195A JP 4748968 B2 JP4748968 B2 JP 4748968B2
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JP
Japan
Prior art keywords
polishing
chamfered portion
wafer
chamfered
double
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004312195A
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English (en)
Japanese (ja)
Other versions
JP2006128269A (ja
JP2006128269A5 (2
Inventor
忠弘 加藤
正義 関澤
守 岡田
久 木嶋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mimasu Semiconductor Industry Co Ltd
Shin Etsu Handotai Co Ltd
Original Assignee
Mimasu Semiconductor Industry Co Ltd
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mimasu Semiconductor Industry Co Ltd, Shin Etsu Handotai Co Ltd filed Critical Mimasu Semiconductor Industry Co Ltd
Priority to JP2004312195A priority Critical patent/JP4748968B2/ja
Priority to US11/666,082 priority patent/US7507146B2/en
Priority to PCT/JP2005/018745 priority patent/WO2006046403A1/ja
Priority to EP05793132A priority patent/EP1808887B1/en
Priority to TW094136410A priority patent/TWI390616B/zh
Publication of JP2006128269A publication Critical patent/JP2006128269A/ja
Publication of JP2006128269A5 publication Critical patent/JP2006128269A5/ja
Application granted granted Critical
Publication of JP4748968B2 publication Critical patent/JP4748968B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • H10P90/128—Preparing bulk and homogeneous wafers by edge treatment, e.g. chamfering

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
JP2004312195A 2004-10-27 2004-10-27 半導体ウエーハの製造方法 Expired - Fee Related JP4748968B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2004312195A JP4748968B2 (ja) 2004-10-27 2004-10-27 半導体ウエーハの製造方法
US11/666,082 US7507146B2 (en) 2004-10-27 2005-10-12 Method for producing semiconductor wafer and semiconductor wafer
PCT/JP2005/018745 WO2006046403A1 (ja) 2004-10-27 2005-10-12 半導体ウエーハの製造方法及び半導体ウエーハ
EP05793132A EP1808887B1 (en) 2004-10-27 2005-10-12 Production method of semiconductor wafer
TW094136410A TWI390616B (zh) 2004-10-27 2005-10-18 Semiconductor wafer manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004312195A JP4748968B2 (ja) 2004-10-27 2004-10-27 半導体ウエーハの製造方法

Publications (3)

Publication Number Publication Date
JP2006128269A JP2006128269A (ja) 2006-05-18
JP2006128269A5 JP2006128269A5 (2) 2007-06-14
JP4748968B2 true JP4748968B2 (ja) 2011-08-17

Family

ID=36227646

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004312195A Expired - Fee Related JP4748968B2 (ja) 2004-10-27 2004-10-27 半導体ウエーハの製造方法

Country Status (5)

Country Link
US (1) US7507146B2 (2)
EP (1) EP1808887B1 (2)
JP (1) JP4748968B2 (2)
TW (1) TWI390616B (2)
WO (1) WO2006046403A1 (2)

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* Cited by examiner, † Cited by third party
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CN100465713C (zh) * 2005-06-20 2009-03-04 乐金显示有限公司 液晶显示设备用研磨机轮和用其制造液晶显示设备的方法
DE102006044367B4 (de) * 2006-09-20 2011-07-14 Siltronic AG, 81737 Verfahren zum Polieren einer Halbleiterscheibe und eine nach dem Verfahren herstellbare polierte Halbleiterscheibe
JP2008166805A (ja) * 2006-12-29 2008-07-17 Siltron Inc 高平坦度シリコンウェハーの製造方法
US8323072B1 (en) * 2007-03-21 2012-12-04 3M Innovative Properties Company Method of polishing transparent armor
JP5149020B2 (ja) * 2008-01-23 2013-02-20 株式会社ディスコ ウエーハの研削方法
KR100999361B1 (ko) * 2008-08-04 2010-12-09 주식회사 실트론 웨이퍼 제조 방법
JP2010141218A (ja) * 2008-12-15 2010-06-24 Ebara Corp ウェハのベベル部形状管理方法
EP2213415A1 (en) * 2009-01-29 2010-08-04 S.O.I. TEC Silicon Device for polishing the edge of a semiconductor substrate
DE102009030292B4 (de) * 2009-06-24 2011-12-01 Siltronic Ag Verfahren zum beidseitigen Polieren einer Halbleiterscheibe
DE102009037281B4 (de) * 2009-08-12 2013-05-08 Siltronic Ag Verfahren zur Herstellung einer polierten Halbleiterscheibe
JP5423384B2 (ja) 2009-12-24 2014-02-19 株式会社Ｓｕｍｃｏ 半導体ウェーハおよびその製造方法
US8952496B2 (en) 2009-12-24 2015-02-10 Sumco Corporation Semiconductor wafer and method of producing same
DE102010014874A1 (de) * 2010-04-14 2011-10-20 Siltronic Ag Verfahren zur Herstellung einer Halbleiterscheibe
JP5472073B2 (ja) * 2010-12-16 2014-04-16 信越半導体株式会社 半導体ウェーハ及びその製造方法
JP5479390B2 (ja) * 2011-03-07 2014-04-23 信越半導体株式会社 シリコンウェーハの製造方法
DE102011076954A1 (de) 2011-06-06 2012-03-15 Siltronic Ag Fertigungsablauf für Halbleiterscheiben mit Rückseiten-Getter
JP2013008769A (ja) * 2011-06-23 2013-01-10 Sumitomo Electric Ind Ltd 炭化珪素基板の製造方法
US8721392B2 (en) * 2011-06-28 2014-05-13 Corning Incorporated Glass edge finishing method
JP2014167996A (ja) * 2013-02-28 2014-09-11 Ebara Corp 研磨装置および研磨方法
US8896964B1 (en) 2013-05-16 2014-11-25 Seagate Technology Llc Enlarged substrate for magnetic recording medium
JP2015140270A (ja) * 2014-01-28 2015-08-03 グローバルウェーハズ・ジャパン株式会社 シリコンウェーハ
JP6045542B2 (ja) * 2014-09-11 2016-12-14 信越半導体株式会社 半導体ウェーハの加工方法、貼り合わせウェーハの製造方法、及びエピタキシャルウェーハの製造方法
JP6206388B2 (ja) * 2014-12-15 2017-10-04 信越半導体株式会社 シリコンウェーハの研磨方法
JP6540430B2 (ja) * 2015-09-28 2019-07-10 東京エレクトロン株式会社 基板処理方法及び基板処理装置
US10600634B2 (en) * 2015-12-21 2020-03-24 Globalwafers Co., Ltd. Semiconductor substrate polishing methods with dynamic control
JP6614978B2 (ja) * 2016-01-14 2019-12-04 株式会社荏原製作所 研磨装置及び研磨方法
JP6589762B2 (ja) * 2016-07-13 2019-10-16 株式会社Sumco 両面研磨装置
JP6920849B2 (ja) * 2017-03-27 2021-08-18 株式会社荏原製作所 基板処理方法および装置
JP6825733B1 (ja) * 2020-02-19 2021-02-03 信越半導体株式会社 半導体ウェーハの製造方法
CN115229602A (zh) * 2022-09-22 2022-10-25 苏州恒嘉晶体材料有限公司 一种圆片倒角磨削机构及使用方法
CN116540345A (zh) * 2023-04-23 2023-08-04 贰陆光学（苏州）有限公司 一种宽光谱半透过半反射的标准具、制备方法及其应用

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0185234B1 (ko) * 1991-11-28 1999-04-15 가부시키 가이샤 토쿄 세이미쯔 반도체 웨이퍼의 모떼기 방법
JPH081493A (ja) * 1994-06-17 1996-01-09 Shin Etsu Handotai Co Ltd ウェーハ面取部の鏡面研磨方法および鏡面研磨装置
JP2882458B2 (ja) * 1994-11-28 1999-04-12 株式会社東京精密 ウェーハ面取り機
JP3828176B2 (ja) * 1995-02-28 2006-10-04 コマツ電子金属株式会社 半導体ウェハの製造方法
JP3580600B2 (ja) * 1995-06-09 2004-10-27 株式会社ルネサステクノロジ 半導体装置の製造方法およびそれに使用される半導体ウエハ並びにその製造方法
JP3620554B2 (ja) * 1996-03-25 2005-02-16 信越半導体株式会社 半導体ウェーハ製造方法
JPH1190803A (ja) * 1997-09-11 1999-04-06 Speedfam Co Ltd ワークエッジの鏡面研磨装置
JPH11154655A (ja) * 1997-11-21 1999-06-08 Komatsu Electron Metals Co Ltd 半導体ウェハの製造方法
JPH11245151A (ja) * 1998-02-27 1999-09-14 Speedfam Co Ltd ワークの外周研磨装置
JP3334609B2 (ja) * 1998-05-29 2002-10-15 信越半導体株式会社 薄板縁部の加工方法および加工機
JP3328193B2 (ja) * 1998-07-08 2002-09-24 信越半導体株式会社 半導体ウエーハの製造方法
JP3664593B2 (ja) * 1998-11-06 2005-06-29 信越半導体株式会社 半導体ウエーハおよびその製造方法
JP4846915B2 (ja) * 2000-03-29 2011-12-28 信越半導体株式会社 貼り合わせウェーハの製造方法
US6962521B2 (en) * 2000-07-10 2005-11-08 Shin-Etsu Handotai Co., Ltd. Edge polished wafer, polishing cloth for edge polishing, and apparatus and method for edge polishing
JP2002299290A (ja) * 2001-03-30 2002-10-11 Mitsubishi Materials Silicon Corp 半導体ウェーハの製造方法
JP2003340695A (ja) * 2002-05-30 2003-12-02 Fujikoshi Mach Corp ウェーハの端面研磨装置
KR100797734B1 (ko) * 2003-12-05 2008-01-24 가부시키가이샤 섬코 편면 경면 웨이퍼의 제조 방법
JP2006099936A (ja) * 2004-08-30 2006-04-13 Hoya Corp 磁気ディスク用ガラス基板の製造方法、磁気ディスクの製造方法及びガラス基板用の円柱状ガラス母材

Also Published As

Publication number Publication date
TW200620447A (en) 2006-06-16
TWI390616B (zh) 2013-03-21
US7507146B2 (en) 2009-03-24
WO2006046403A1 (ja) 2006-05-04
EP1808887B1 (en) 2011-11-30
US20080096474A1 (en) 2008-04-24
JP2006128269A (ja) 2006-05-18
EP1808887A4 (en) 2009-02-18
EP1808887A1 (en) 2007-07-18

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