TWI390616B - Semiconductor wafer manufacturing method - Google Patents

Semiconductor wafer manufacturing method Download PDF

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Publication number
TWI390616B
TWI390616B TW094136410A TW94136410A TWI390616B TW I390616 B TWI390616 B TW I390616B TW 094136410 A TW094136410 A TW 094136410A TW 94136410 A TW94136410 A TW 94136410A TW I390616 B TWI390616 B TW I390616B
Authority
TW
Taiwan
Prior art keywords
polishing
bevel
wafer
polishing step
cloth
Prior art date
Application number
TW094136410A
Other languages
English (en)
Chinese (zh)
Other versions
TW200620447A (en
Inventor
加藤忠弘
關澤正義
岡田守
木嶋久
Original Assignee
信越半導體股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 信越半導體股份有限公司 filed Critical 信越半導體股份有限公司
Publication of TW200620447A publication Critical patent/TW200620447A/zh
Application granted granted Critical
Publication of TWI390616B publication Critical patent/TWI390616B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • H10P90/128—Preparing bulk and homogeneous wafers by edge treatment, e.g. chamfering

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
TW094136410A 2004-10-27 2005-10-18 Semiconductor wafer manufacturing method TWI390616B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004312195A JP4748968B2 (ja) 2004-10-27 2004-10-27 半導体ウエーハの製造方法

Publications (2)

Publication Number Publication Date
TW200620447A TW200620447A (en) 2006-06-16
TWI390616B true TWI390616B (zh) 2013-03-21

Family

ID=36227646

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094136410A TWI390616B (zh) 2004-10-27 2005-10-18 Semiconductor wafer manufacturing method

Country Status (5)

Country Link
US (1) US7507146B2 (2)
EP (1) EP1808887B1 (2)
JP (1) JP4748968B2 (2)
TW (1) TWI390616B (2)
WO (1) WO2006046403A1 (2)

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US8323072B1 (en) * 2007-03-21 2012-12-04 3M Innovative Properties Company Method of polishing transparent armor
JP5149020B2 (ja) * 2008-01-23 2013-02-20 株式会社ディスコ ウエーハの研削方法
KR100999361B1 (ko) * 2008-08-04 2010-12-09 주식회사 실트론 웨이퍼 제조 방법
JP2010141218A (ja) * 2008-12-15 2010-06-24 Ebara Corp ウェハのベベル部形状管理方法
EP2213415A1 (en) * 2009-01-29 2010-08-04 S.O.I. TEC Silicon Device for polishing the edge of a semiconductor substrate
DE102009030292B4 (de) * 2009-06-24 2011-12-01 Siltronic Ag Verfahren zum beidseitigen Polieren einer Halbleiterscheibe
DE102009037281B4 (de) * 2009-08-12 2013-05-08 Siltronic Ag Verfahren zur Herstellung einer polierten Halbleiterscheibe
JP5423384B2 (ja) 2009-12-24 2014-02-19 株式会社Ｓｕｍｃｏ 半導体ウェーハおよびその製造方法
US8952496B2 (en) 2009-12-24 2015-02-10 Sumco Corporation Semiconductor wafer and method of producing same
DE102010014874A1 (de) * 2010-04-14 2011-10-20 Siltronic Ag Verfahren zur Herstellung einer Halbleiterscheibe
JP5472073B2 (ja) * 2010-12-16 2014-04-16 信越半導体株式会社 半導体ウェーハ及びその製造方法
JP5479390B2 (ja) * 2011-03-07 2014-04-23 信越半導体株式会社 シリコンウェーハの製造方法
DE102011076954A1 (de) 2011-06-06 2012-03-15 Siltronic Ag Fertigungsablauf für Halbleiterscheiben mit Rückseiten-Getter
JP2013008769A (ja) * 2011-06-23 2013-01-10 Sumitomo Electric Ind Ltd 炭化珪素基板の製造方法
US8721392B2 (en) * 2011-06-28 2014-05-13 Corning Incorporated Glass edge finishing method
JP2014167996A (ja) * 2013-02-28 2014-09-11 Ebara Corp 研磨装置および研磨方法
US8896964B1 (en) 2013-05-16 2014-11-25 Seagate Technology Llc Enlarged substrate for magnetic recording medium
JP2015140270A (ja) * 2014-01-28 2015-08-03 グローバルウェーハズ・ジャパン株式会社 シリコンウェーハ
JP6045542B2 (ja) * 2014-09-11 2016-12-14 信越半導体株式会社 半導体ウェーハの加工方法、貼り合わせウェーハの製造方法、及びエピタキシャルウェーハの製造方法
JP6206388B2 (ja) * 2014-12-15 2017-10-04 信越半導体株式会社 シリコンウェーハの研磨方法
JP6540430B2 (ja) * 2015-09-28 2019-07-10 東京エレクトロン株式会社 基板処理方法及び基板処理装置
US10600634B2 (en) * 2015-12-21 2020-03-24 Globalwafers Co., Ltd. Semiconductor substrate polishing methods with dynamic control
JP6614978B2 (ja) * 2016-01-14 2019-12-04 株式会社荏原製作所 研磨装置及び研磨方法
JP6589762B2 (ja) * 2016-07-13 2019-10-16 株式会社Sumco 両面研磨装置
JP6920849B2 (ja) * 2017-03-27 2021-08-18 株式会社荏原製作所 基板処理方法および装置
JP6825733B1 (ja) * 2020-02-19 2021-02-03 信越半導体株式会社 半導体ウェーハの製造方法
CN115229602A (zh) * 2022-09-22 2022-10-25 苏州恒嘉晶体材料有限公司 一种圆片倒角磨削机构及使用方法
CN116540345A (zh) * 2023-04-23 2023-08-04 贰陆光学（苏州）有限公司 一种宽光谱半透过半反射的标准具、制备方法及其应用

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Also Published As

Publication number Publication date
TW200620447A (en) 2006-06-16
JP4748968B2 (ja) 2011-08-17
US7507146B2 (en) 2009-03-24
WO2006046403A1 (ja) 2006-05-04
EP1808887B1 (en) 2011-11-30
US20080096474A1 (en) 2008-04-24
JP2006128269A (ja) 2006-05-18
EP1808887A4 (en) 2009-02-18
EP1808887A1 (en) 2007-07-18

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