JP5092004B2 - 吸着テーブル - Google Patents

吸着テーブル Download PDF

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Publication number
JP5092004B2
JP5092004B2 JP2010226093A JP2010226093A JP5092004B2 JP 5092004 B2 JP5092004 B2 JP 5092004B2 JP 2010226093 A JP2010226093 A JP 2010226093A JP 2010226093 A JP2010226093 A JP 2010226093A JP 5092004 B2 JP5092004 B2 JP 5092004B2
Authority
JP
Japan
Prior art keywords
stage
leak
suction
substrate
porous plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2010226093A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012076204A (ja
Inventor
康智 岡島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Priority to JP2010226093A priority Critical patent/JP5092004B2/ja
Priority to TW100126758A priority patent/TWI449120B/zh
Priority to KR1020110092434A priority patent/KR101242420B1/ko
Priority to CN201110290655.3A priority patent/CN102446799B/zh
Publication of JP2012076204A publication Critical patent/JP2012076204A/ja
Application granted granted Critical
Publication of JP5092004B2 publication Critical patent/JP5092004B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
JP2010226093A 2010-10-05 2010-10-05 吸着テーブル Expired - Fee Related JP5092004B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2010226093A JP5092004B2 (ja) 2010-10-05 2010-10-05 吸着テーブル
TW100126758A TWI449120B (zh) 2010-10-05 2011-07-28 Adsorption platform
KR1020110092434A KR101242420B1 (ko) 2010-10-05 2011-09-14 흡착 테이블
CN201110290655.3A CN102446799B (zh) 2010-10-05 2011-09-21 吸附台

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010226093A JP5092004B2 (ja) 2010-10-05 2010-10-05 吸着テーブル

Publications (2)

Publication Number Publication Date
JP2012076204A JP2012076204A (ja) 2012-04-19
JP5092004B2 true JP5092004B2 (ja) 2012-12-05

Family

ID=46009183

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010226093A Expired - Fee Related JP5092004B2 (ja) 2010-10-05 2010-10-05 吸着テーブル

Country Status (4)

Country Link
JP (1) JP5092004B2 (zh)
KR (1) KR101242420B1 (zh)
CN (1) CN102446799B (zh)
TW (1) TWI449120B (zh)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5943742B2 (ja) 2012-07-04 2016-07-05 三菱電機株式会社 半導体試験治具およびそれを用いた半導体試験方法
JP5899423B2 (ja) * 2012-11-30 2016-04-06 パナソニックＩｐマネジメント株式会社 部品実装装置及び吸着ツール
JP6154173B2 (ja) * 2013-04-03 2017-06-28 株式会社ナノテム 真空吸着装置及び吸着プレート
KR101468664B1 (ko) * 2013-07-18 2014-12-04 에버테크노 주식회사 인쇄회로기판용 노광장치의 기판흡착장치
CN104858806B (zh) * 2014-02-26 2022-03-01 盛美半导体设备(上海)股份有限公司 真空夹具
JP6474205B2 (ja) * 2014-05-16 2019-02-27 川崎重工業株式会社 吸着定盤及び溶接ロボットシステム
CN104192347A (zh) * 2014-09-18 2014-12-10 弘森电子(上海)有限公司 一种网版式贴膜装置
JP6815138B2 (ja) * 2016-09-06 2021-01-20 株式会社ディスコ 吸引保持システム
JP6934335B2 (ja) * 2017-07-03 2021-09-15 日本特殊陶業株式会社 真空吸着部材
TWI638759B (zh) * 2018-04-17 2018-10-21 威光自動化科技股份有限公司 異形薄片物件的負壓吸附器
JP2020115238A (ja) * 2020-04-17 2020-07-30 堺ディスプレイプロダクト株式会社 フレキシブル発光デバイスの製造方法および製造装置
KR102363046B1 (ko) * 2021-08-18 2022-02-15 주식회사 21세기 펨토초 레이저를 이용한 박막시트 적층용 상부금형의 마이크로 홀 가공방법
KR102809842B1 (ko) * 2023-04-10 2025-05-16 안천복 진공척

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04142548A (ja) * 1990-10-03 1992-05-15 Ricoh Co Ltd 高分子フィルム基板の位置合わせ装置
JPH07214442A (ja) * 1994-01-28 1995-08-15 Roland D G Kk バキューム・テーブル
JP2000332087A (ja) * 1999-05-25 2000-11-30 Sony Corp 基板吸着装置
JP2004154920A (ja) * 2002-11-08 2004-06-03 Central Glass Co Ltd ガラス基板を吸着保持して研磨するための吸着パッド
JP2005032959A (ja) * 2003-07-11 2005-02-03 Nikon Corp 真空チャック、研磨装置、露光装置、及び半導体デバイスの製造方法
JP5028914B2 (ja) 2006-08-28 2012-09-19 パナソニック株式会社 プリプレグシートの固定方法及びそれに用いるプリプレグシートの固定装置
JP4851282B2 (ja) * 2006-09-21 2012-01-11 株式会社ディスコ 切削装置
JP2008132562A (ja) * 2006-11-28 2008-06-12 Kyocera Corp 真空チャックおよびこれを用いた真空吸着装置
JP4956302B2 (ja) * 2007-07-05 2012-06-20 株式会社タンケンシールセーコウ カーボン製吸着体及びその製造方法
CN100555597C (zh) * 2007-12-25 2009-10-28 中国电子科技集团公司第四十五研究所 晶片吸附机构
TWI439351B (zh) * 2008-09-29 2014-06-01 日東電工股份有限公司 Adsorption tablets

Also Published As

Publication number Publication date
JP2012076204A (ja) 2012-04-19
TW201218308A (en) 2012-05-01
TWI449120B (zh) 2014-08-11
CN102446799A (zh) 2012-05-09
KR101242420B1 (ko) 2013-03-12
KR20120035853A (ko) 2012-04-16
CN102446799B (zh) 2015-07-15

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