JP5095143B2 - 発光素子の製造方法 - Google Patents

発光素子の製造方法 Download PDF

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Publication number
JP5095143B2
JP5095143B2 JP2006186054A JP2006186054A JP5095143B2 JP 5095143 B2 JP5095143 B2 JP 5095143B2 JP 2006186054 A JP2006186054 A JP 2006186054A JP 2006186054 A JP2006186054 A JP 2006186054A JP 5095143 B2 JP5095143 B2 JP 5095143B2
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JP
Japan
Prior art keywords
light emitting
film
etching
emitting structures
manufacturing
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Expired - Fee Related
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JP2006186054A
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English (en)
Japanese (ja)
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JP2007019511A (ja
Inventor
賢帝 李
俊碩 河
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Electronics Inc
LG Innotek Co Ltd
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LG Electronics Inc
LG Innotek Co Ltd
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Application filed by LG Electronics Inc, LG Innotek Co Ltd filed Critical LG Electronics Inc
Publication of JP2007019511A publication Critical patent/JP2007019511A/ja
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Publication of JP5095143B2 publication Critical patent/JP5095143B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/018—Bonding of wafers

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  • Led Devices (AREA)
JP2006186054A 2005-07-05 2006-07-05 発光素子の製造方法 Expired - Fee Related JP5095143B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020050060091A KR100606551B1 (ko) 2005-07-05 2005-07-05 발광소자 제조방법
KR10-2005-0060091 2005-07-05

Publications (2)

Publication Number Publication Date
JP2007019511A JP2007019511A (ja) 2007-01-25
JP5095143B2 true JP5095143B2 (ja) 2012-12-12

Family

ID=37074609

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006186054A Expired - Fee Related JP5095143B2 (ja) 2005-07-05 2006-07-05 発光素子の製造方法

Country Status (6)

Country Link
US (1) US7435606B2 (fr)
EP (2) EP1783841A3 (fr)
JP (1) JP5095143B2 (fr)
KR (1) KR100606551B1 (fr)
CN (1) CN100448043C (fr)
DE (1) DE602006005867D1 (fr)

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KR20070047114A (ko) * 2005-11-01 2007-05-04 주식회사 엘지화학 플렉서블 기판을 구비한 소자의 제조방법 및 이에 의해제조된 플렉서블 기판을 구비한 소자
KR100752717B1 (ko) 2006-09-20 2007-08-29 삼성전기주식회사 수직구조 질화갈륨계 발광 다이오드 소자의 제조방법
US8097478B2 (en) * 2007-06-29 2012-01-17 Showa Denko K.K. Method for producing light-emitting diode
DE102007043902A1 (de) 2007-09-14 2009-03-19 Osram Opto Semiconductors Gmbh Verfahren zum Vereinzeln metallisierter Halbleiterbauelemente
WO2009119847A1 (fr) * 2008-03-28 2009-10-01 京セラ株式会社 Dispositif optique et procédé de fabrication d'un dispositif optique
US8236582B2 (en) * 2008-07-24 2012-08-07 Philips Lumileds Lighting Company, Llc Controlling edge emission in package-free LED die
US10147843B2 (en) 2008-07-24 2018-12-04 Lumileds Llc Semiconductor light emitting device including a window layer and a light-directing structure
DE102008049535A1 (de) * 2008-09-29 2010-04-08 Osram Opto Semiconductors Gmbh LED-Modul und Herstellungsverfahren
JP4799606B2 (ja) * 2008-12-08 2011-10-26 株式会社東芝 光半導体装置及び光半導体装置の製造方法
JP4994401B2 (ja) 2009-02-04 2012-08-08 エンパイア テクノロジー ディベロップメント エルエルシー 半導体デバイスの製造方法
WO2011069242A1 (fr) * 2009-12-09 2011-06-16 Cooledge Lighting Inc. Appareil permettant le transfert de dés de semi-conducteurs et procédé de fabrication dudit appareil
US20110151588A1 (en) * 2009-12-17 2011-06-23 Cooledge Lighting, Inc. Method and magnetic transfer stamp for transferring semiconductor dice using magnetic transfer printing techniques
US8334152B2 (en) * 2009-12-18 2012-12-18 Cooledge Lighting, Inc. Method of manufacturing transferable elements incorporating radiation enabled lift off for allowing transfer from host substrate
US8652860B2 (en) 2011-01-09 2014-02-18 Bridgelux, Inc. Packaging photon building blocks having only top side connections in a molded interconnect structure
US9461023B2 (en) * 2011-10-28 2016-10-04 Bridgelux, Inc. Jetting a highly reflective layer onto an LED assembly
JP5985322B2 (ja) 2012-03-23 2016-09-06 株式会社東芝 半導体発光装置及びその製造方法
TWI528578B (zh) * 2012-03-28 2016-04-01 鴻海精密工業股份有限公司 發光二極體製造方法
US9608016B2 (en) 2012-05-17 2017-03-28 Koninklijke Philips N.V. Method of separating a wafer of semiconductor devices
KR102301870B1 (ko) * 2014-12-26 2021-09-15 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 소자 및 발광 소자 패키지
CN112582509B (zh) * 2019-09-30 2022-07-08 成都辰显光电有限公司 微发光二极管芯片及显示面板
KR20220068059A (ko) 2020-11-18 2022-05-25 에스케이하이닉스 주식회사 반도체 메모리 장치 및 그 제조방법

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JPH01115174A (ja) * 1987-10-28 1989-05-08 Nec Corp 発光ダイオードアレイ
JPH02251181A (ja) * 1989-03-24 1990-10-08 Oki Electric Ind Co Ltd 発光ダイオード装置
JP2720635B2 (ja) * 1991-06-27 1998-03-04 日本電気株式会社 半導体発光素子の製造方法
JPH06318731A (ja) * 1993-03-12 1994-11-15 Sharp Corp 半導体発光装置
JP3724834B2 (ja) * 1995-03-09 2005-12-07 三菱電機株式会社 半導体レーザ装置の製造方法
DE19629920B4 (de) * 1995-08-10 2006-02-02 LumiLeds Lighting, U.S., LLC, San Jose Licht-emittierende Diode mit einem nicht-absorbierenden verteilten Braggreflektor
JPH10275936A (ja) 1997-03-28 1998-10-13 Rohm Co Ltd 半導体発光素子の製法
JPH11220165A (ja) 1998-01-30 1999-08-10 Toshiba Corp 半導体発光素子の製造方法
JP2000260760A (ja) 1999-03-11 2000-09-22 Toshiba Corp ウェーハ及び半導体装置の製造方法
US6355497B1 (en) * 2000-01-18 2002-03-12 Xerox Corporation Removable large area, low defect density films for led and laser diode growth
US7053413B2 (en) * 2000-10-23 2006-05-30 General Electric Company Homoepitaxial gallium-nitride-based light emitting device and method for producing
DE10221858A1 (de) * 2002-02-25 2003-09-11 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Halbleiterbauelement und Verfahren zur Herstellung desselben
US8294172B2 (en) * 2002-04-09 2012-10-23 Lg Electronics Inc. Method of fabricating vertical devices using a metal support film
US20030189215A1 (en) * 2002-04-09 2003-10-09 Jong-Lam Lee Method of fabricating vertical structure leds
US6818532B2 (en) * 2002-04-09 2004-11-16 Oriol, Inc. Method of etching substrates
JP2004165226A (ja) * 2002-11-08 2004-06-10 Toyoda Gosei Co Ltd Ｉｉｉ族窒化物系化合物半導体発光素子の製造方法
DE10253911A1 (de) * 2002-09-30 2004-04-08 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Halbleiterbauelement und Verfahren zu dessen Herstellung
JP4143732B2 (ja) * 2002-10-16 2008-09-03 スタンレー電気株式会社 車載用波長変換素子
JP4295669B2 (ja) * 2003-05-22 2009-07-15 パナソニック株式会社 半導体素子の製造方法
US7019330B2 (en) * 2003-08-28 2006-03-28 Lumileds Lighting U.S., Llc Resonant cavity light emitting device
JP4834951B2 (ja) * 2003-09-29 2011-12-14 ソニー株式会社 Ｌｅｄ素子形成方法
US6884646B1 (en) * 2004-03-10 2005-04-26 Uni Light Technology Inc. Method for forming an LED device with a metallic substrate
JP2007535804A (ja) * 2004-03-15 2007-12-06 ティンギ テクノロジーズ プライベート リミテッド 半導体デバイスの製造
US7064356B2 (en) * 2004-04-16 2006-06-20 Gelcore, Llc Flip chip light emitting diode with micromesas and a conductive mesh

Also Published As

Publication number Publication date
US7435606B2 (en) 2008-10-14
EP1748499A2 (fr) 2007-01-31
EP1748499A3 (fr) 2007-02-28
DE602006005867D1 (de) 2009-05-07
CN1933196A (zh) 2007-03-21
EP1783841A2 (fr) 2007-05-09
JP2007019511A (ja) 2007-01-25
EP1783841A3 (fr) 2007-05-23
KR100606551B1 (ko) 2006-08-01
US20070020789A1 (en) 2007-01-25
CN100448043C (zh) 2008-12-31
EP1748499B1 (fr) 2009-03-25

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