JP5118976B2 - 耐熱老化性ポリアミド - Google Patents

耐熱老化性ポリアミド Download PDF

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Publication number
JP5118976B2
JP5118976B2 JP2007554552A JP2007554552A JP5118976B2 JP 5118976 B2 JP5118976 B2 JP 5118976B2 JP 2007554552 A JP2007554552 A JP 2007554552A JP 2007554552 A JP2007554552 A JP 2007554552A JP 5118976 B2 JP5118976 B2 JP 5118976B2
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JP
Japan
Prior art keywords
polyethyleneimine
weight
molding material
thermoplastic molding
acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2007554552A
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English (en)
Japanese (ja)
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JP2008530290A (ja
Inventor
アイベック ペーター
エンゲルマン ヨヘン
ノイハウス ラルフ
フィッシャー ミヒャエル
ブルフマン ベルント
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BASF SE
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BASF SE
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Publication of JP2008530290A publication Critical patent/JP2008530290A/ja
Application granted granted Critical
Publication of JP5118976B2 publication Critical patent/JP5118976B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/10Metal compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/16Halogen-containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/09Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C08K5/098Metal salts of carboxylic acids
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/20Carboxylic acid amides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L21/00Compositions of unspecified rubbers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/02Polyamines

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Artificial Filaments (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
JP2007554552A 2005-02-08 2006-02-08 耐熱老化性ポリアミド Expired - Fee Related JP5118976B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102005005847A DE102005005847A1 (de) 2005-02-08 2005-02-08 Wärmealterungsbeständige Polyamide
DE102005005847.7 2005-02-08
PCT/EP2006/050763 WO2006084862A1 (de) 2005-02-08 2006-02-08 Wärmealterungsbeständige polyamide

Publications (2)

Publication Number Publication Date
JP2008530290A JP2008530290A (ja) 2008-08-07
JP5118976B2 true JP5118976B2 (ja) 2013-01-16

Family

ID=36636651

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007554552A Expired - Fee Related JP5118976B2 (ja) 2005-02-08 2006-02-08 耐熱老化性ポリアミド

Country Status (12)

Country Link
US (2) US20080262133A1 (pl)
EP (1) EP1851265B1 (pl)
JP (1) JP5118976B2 (pl)
KR (2) KR20130041392A (pl)
CN (1) CN101115786B (pl)
AT (1) ATE398645T1 (pl)
BR (1) BRPI0606914B1 (pl)
DE (2) DE102005005847A1 (pl)
ES (1) ES2306429T3 (pl)
MY (1) MY139749A (pl)
PL (1) PL1851265T3 (pl)
WO (1) WO2006084862A1 (pl)

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EP1683830A1 (en) 2005-01-12 2006-07-26 DSM IP Assets B.V. Heat stabilized moulding composition
EP1681313A1 (en) 2005-01-17 2006-07-19 DSM IP Assets B.V. Heat stabilized moulding composition
BRPI0721119A2 (pt) 2006-12-15 2015-01-27 Basf Se Dispersão polimérica aquosa, processo para a preparação da mesma, método de modificação das propriedades reológicas de uma dispersão polimérica aquosa, composição aglutinante, material de revestimento, usos de uma composição aglutinante, de uma dispersão polimérica aquosa e de pelo menos um policarbonato altamente ramificado, pasta para o revestimento de papel, e, papelão ou papel
ES2373007T3 (es) * 2007-12-18 2012-01-30 Basf Se Poliamidas termoplásticas con poliéter aminas.
US7902287B2 (en) * 2008-01-21 2011-03-08 Basf Aktiengesellschaft Polyamide resin composition and method of preparing
JP2011515523A (ja) * 2008-03-18 2011-05-19 ビーエーエスエフ ソシエタス・ヨーロピア 超分岐ポリエチレンイミンとのポリアミド−ナノ複合材料
KR20100126514A (ko) * 2008-03-18 2010-12-01 바스프 에스이 고차분지형 폴리에테르아민을 갖는 폴리아미드 나노복합체
JP2012508314A (ja) * 2008-11-11 2012-04-05 ビーエーエスエフ ソシエタス・ヨーロピア 安定化ポリアミド
DE102008058246A1 (de) 2008-11-19 2010-05-20 Basf Se Hochmolekulare Polyamide
BRPI0922909B1 (pt) * 2008-12-16 2019-06-25 Basf Se Material de moldagem termoplástico, uso de materiais de moldagem termoplásticos, e, fibras, folhas ou corpo moldado de qualquer tipo
DE102010062538A1 (de) 2009-12-17 2011-06-22 Basf Se, 67063 Verfahren zur Herstellung geschweisster Formkörper aus Polyamid-6.10
US20120181487A1 (en) * 2011-01-18 2012-07-19 Basf Se Thermoplastic molding composition
JP5759532B2 (ja) * 2011-02-22 2015-08-05 株式会社ブリヂストン ポリアミド樹脂組成物及びその製造方法並びに冷媒輸送用ホース
EP2570448A1 (de) * 2011-09-13 2013-03-20 Basf Se Verwendung von Polyethyleniminen in der Herstellung von Polyamiden
JP2015519465A (ja) 2012-06-13 2015-07-09 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーE.I.Du Pont De Nemours And Company エポキシ−カルボン酸化合物熱安定剤を含む熱可塑性溶融混合組成物
JP6416756B2 (ja) 2012-06-13 2018-10-31 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーE.I.Du Pont De Nemours And Company アミノ酸熱安定剤を含む熱可塑性溶融混合組成物
JP2015519463A (ja) 2012-06-13 2015-07-09 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーE.I.Du Pont De Nemours And Company ポリエーテルオール熱安定剤を含む熱可塑性溶融混合組成物
US8871874B2 (en) 2012-06-13 2014-10-28 E I Du Pont De Nemours And Company Thermoplastic melt-mixed composition with epoxy-amino acid compound heat stabilizer and processes for their preparation
ES2624127T3 (es) * 2012-10-10 2017-07-13 Lanxess Deutschland Gmbh Masas de moldeo
JP6169280B2 (ja) * 2013-08-21 2017-07-26 ビーエーエスエフ ソシエタス・ヨーロピアBasf Se 部材に含まれるプラスチック構成部分間の付着が改善された複合プラスチック部材
KR102224391B1 (ko) * 2013-08-21 2021-03-08 바스프 에스이 열적 노화에 대한 개선된 저항을 갖는 플라스틱 복합 부품
EP3036276B1 (de) * 2013-08-21 2017-10-11 Basf Se Verfahren zur herstellung eines compositkunststoffteils (ck)
JP2015199938A (ja) * 2014-04-03 2015-11-12 旭化成ケミカルズ株式会社 ポリアミド樹脂組成物及び成形品
CN104045922A (zh) * 2014-07-16 2014-09-17 苏州新区华士达工程塑胶有限公司 一种改良性epdm
JP6724368B2 (ja) * 2015-02-23 2020-07-15 東レ株式会社 成形品およびポリアミド樹脂組成物
US10836904B2 (en) 2016-10-18 2020-11-17 Ascend Performance Materials Operations Llc Low-halogen flame retardant polyamide compositions resistant to heat aging
JPWO2020121846A1 (ja) * 2018-12-10 2021-09-27 日本曹達株式会社 ポリアルキレンイミン変性ポリアミド4
EP3670576B8 (de) * 2018-12-19 2020-12-09 Ems-Chemie Ag Polyamid-formmassen für glasverbunde
US12312467B2 (en) 2019-03-06 2025-05-27 Basf Se Polyamide molding composition for high-gloss applications
CN115210319B (zh) * 2020-02-26 2024-12-06 巴斯夫欧洲公司 耐热聚酰胺模塑组合物
US20230129664A1 (en) * 2020-03-25 2023-04-27 Basf Se Heat-aging resistant polyamide molding compositions
JP7732756B2 (ja) * 2021-03-31 2025-09-02 旭化成株式会社 ポリアミド組成物、電装部品、及び電装部品の耐熱エージング性、流動性、及び耐イオンマイグレーション性を向上させる方法
WO2023033043A1 (ja) * 2021-09-01 2023-03-09 旭化成株式会社 ポリアミド組成物
JP7826102B2 (ja) * 2022-04-12 2026-03-09 旭化成株式会社 ポリアミド組成物
CN115594966B (zh) * 2022-09-30 2024-01-02 上海金发科技发展有限公司 一种聚酰胺复合材料及其制备方法和应用

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DE1794227A1 (de) * 1967-09-28 1971-11-18 Allied Chem Waermestabilisierte Polyamide
ES372097A1 (es) * 1968-10-09 1971-12-16 Union Carbide Canada Ltd Procedimiento para preparar una composicion de nylon que tiene receptividad mejorada para los tintes acidos.
JPS54103475A (en) * 1978-02-01 1979-08-14 Mitsubishi Plastics Ind Ltd Preparation of laminated drawn film
JPH0418426A (ja) * 1990-05-11 1992-01-22 Toyobo Co Ltd 耐ブロッキング性の優れた易接着性フィルム
JPH04202357A (ja) * 1990-11-29 1992-07-23 Toray Ind Inc 耐熱安定性の優れた難燃性ポリアミド樹脂組成物
JPH04220460A (ja) * 1990-12-20 1992-08-11 Asahi Chem Ind Co Ltd 耐熱性ポリアミド組成物
DE4305166A1 (de) * 1993-02-19 1994-08-25 Bayer Ag Thermostabile kupferhaltige Polyamidformmassen
DE4339509A1 (de) * 1993-11-22 1995-05-24 Basf Ag PPE/PA-Frommassen zur Herstellung von Formkörpern mittels Blasformen, Profilextrusion und Rohrextrusion
DE19519820A1 (de) * 1995-05-31 1996-12-05 Bayer Ag Thermostabile, witterungsbeständige Polyamidformmassen
JP3714788B2 (ja) * 1998-02-13 2005-11-09 旭化成ケミカルズ株式会社 成形特性に優れるポリアミド樹脂組成物のペレットの製造方法
JP2000344960A (ja) * 1999-03-31 2000-12-12 Chisso Corp 難燃性樹脂組成物、それを用いた難燃性シートおよびフィルム成形物
EP1065236B1 (de) * 1999-06-29 2003-09-24 Degussa AG Hochverzweigte Polyamid-Pfropfcopolymere
DE10030553A1 (de) * 2000-06-29 2002-01-10 Basf Ag Stabilisierte thermoplastische Formmassen
DE10064333A1 (de) * 2000-12-21 2002-06-27 Degussa Mehrschichtverbund mit einer EVOH-Schicht
JP4245327B2 (ja) * 2002-10-25 2009-03-25 旭化成ケミカルズ株式会社 ポリアミド樹脂組成物
EP1498445A1 (en) * 2003-07-18 2005-01-19 DSM IP Assets B.V. Heat stabilized moulding composition

Also Published As

Publication number Publication date
EP1851265A1 (de) 2007-11-07
US20120149817A1 (en) 2012-06-14
EP1851265B1 (de) 2008-06-18
ATE398645T1 (de) 2008-07-15
KR101278734B1 (ko) 2013-06-25
DE502006000958D1 (de) 2008-07-31
DE102005005847A1 (de) 2006-08-10
CN101115786A (zh) 2008-01-30
BRPI0606914B1 (pt) 2017-04-04
KR20070102739A (ko) 2007-10-19
CN101115786B (zh) 2012-06-20
WO2006084862A1 (de) 2006-08-17
ES2306429T3 (es) 2008-11-01
US20080262133A1 (en) 2008-10-23
MY139749A (en) 2009-10-30
BRPI0606914A2 (pt) 2009-12-01
JP2008530290A (ja) 2008-08-07
PL1851265T3 (pl) 2008-11-28
KR20130041392A (ko) 2013-04-24

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