JP5196703B2 - 接着フィルム - Google Patents

接着フィルム Download PDF

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Publication number
JP5196703B2
JP5196703B2 JP2004007492A JP2004007492A JP5196703B2 JP 5196703 B2 JP5196703 B2 JP 5196703B2 JP 2004007492 A JP2004007492 A JP 2004007492A JP 2004007492 A JP2004007492 A JP 2004007492A JP 5196703 B2 JP5196703 B2 JP 5196703B2
Authority
JP
Japan
Prior art keywords
resin layer
resin
temperature
connection
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2004007492A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005200521A5 (2
JP2005200521A (ja
Inventor
憲明 工藤
恭志 阿久津
秀次 波木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Priority to JP2004007492A priority Critical patent/JP5196703B2/ja
Priority to TW093139608A priority patent/TWI265188B/zh
Priority to PCT/JP2004/019527 priority patent/WO2005068573A1/ja
Priority to KR1020067014078A priority patent/KR101151133B1/ko
Publication of JP2005200521A publication Critical patent/JP2005200521A/ja
Publication of JP2005200521A5 publication Critical patent/JP2005200521A5/ja
Application granted granted Critical
Publication of JP5196703B2 publication Critical patent/JP5196703B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
    • C09J2301/162—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer the carrier being a laminate constituted by plastic layers only
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/41—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the carrier layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/074—Connecting or disconnecting of anisotropic conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/322—Multilayered die-attach connectors, e.g. a coating on a top surface of a core
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Insulated Conductors (AREA)
  • Laminated Bodies (AREA)
  • Wire Bonding (AREA)
JP2004007492A 2004-01-15 2004-01-15 接着フィルム Expired - Lifetime JP5196703B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2004007492A JP5196703B2 (ja) 2004-01-15 2004-01-15 接着フィルム
TW093139608A TWI265188B (en) 2004-01-15 2004-12-20 Adhesive films and method for manufacturing adhesive film
PCT/JP2004/019527 WO2005068573A1 (ja) 2004-01-15 2004-12-27 接着フィルム、接着フィルムの製造方法
KR1020067014078A KR101151133B1 (ko) 2004-01-15 2004-12-27 접착 필름, 및 접착 필름의 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004007492A JP5196703B2 (ja) 2004-01-15 2004-01-15 接着フィルム

Publications (3)

Publication Number Publication Date
JP2005200521A JP2005200521A (ja) 2005-07-28
JP2005200521A5 JP2005200521A5 (2) 2006-12-28
JP5196703B2 true JP5196703B2 (ja) 2013-05-15

Family

ID=34792183

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004007492A Expired - Lifetime JP5196703B2 (ja) 2004-01-15 2004-01-15 接着フィルム

Country Status (4)

Country Link
JP (1) JP5196703B2 (2)
KR (1) KR101151133B1 (2)
TW (1) TWI265188B (2)
WO (1) WO2005068573A1 (2)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4735229B2 (ja) * 2005-12-12 2011-07-27 住友ベークライト株式会社 異方導電性フィルム
JP5093482B2 (ja) 2007-06-26 2012-12-12 ソニーケミカル＆インフォメーションデバイス株式会社 異方性導電材料、接続構造体及びその製造方法
WO2009001605A1 (ja) * 2007-06-26 2008-12-31 Sony Chemical & Information Device Corporation 異方性導電材料、接続構造体及びその製造方法
JP5311772B2 (ja) * 2007-06-27 2013-10-09 デクセリアルズ株式会社 接着フィルム
JP2009194359A (ja) * 2008-01-16 2009-08-27 Hitachi Chem Co Ltd 回路接続用接着フィルム、これを用いた回路部材の接続構造及び回路部材の接続方法
KR20120039753A (ko) * 2009-08-05 2012-04-25 아지노모토 가부시키가이샤 필름
JP5631654B2 (ja) 2010-07-28 2014-11-26 デクセリアルズ株式会社 実装体の製造方法及び接続方法
JP5369163B2 (ja) * 2011-10-19 2013-12-18 三菱電機株式会社 絶縁シートおよび半導体装置
WO2013073847A1 (ko) * 2011-11-14 2013-05-23 주식회사 엘지화학 접착 필름
US9490048B2 (en) * 2012-03-29 2016-11-08 Cam Holding Corporation Electrical contacts in layered structures
EP2851406A4 (en) * 2012-05-14 2015-12-23 Lg Chemical Ltd METHOD FOR PRODUCING AN ADHESIVE ARTICLE
JP5880283B2 (ja) * 2012-05-29 2016-03-08 富士通セミコンダクター株式会社 半導体装置の製造方法
JP2015079586A (ja) * 2013-10-15 2015-04-23 デクセリアルズ株式会社 異方性導電フィルム
US20150371916A1 (en) * 2014-06-23 2015-12-24 Rohm And Haas Electronic Materials Llc Pre-applied underfill
PH12017501262B1 (en) 2015-01-13 2023-02-08 Dexerials Corp Anisotropic conductive film
KR101999913B1 (ko) * 2015-05-27 2019-07-12 데쿠세리아루즈 가부시키가이샤 이방 도전성 필름 및 접속 구조체
JP6750197B2 (ja) * 2015-07-13 2020-09-02 デクセリアルズ株式会社 異方性導電フィルム及び接続構造体
JP6988482B2 (ja) * 2016-01-29 2022-01-05 昭和電工マテリアルズ株式会社 接着剤フィルム及びその製造方法、接着剤テープ、並びに接着剤フィルム用リール
US20240079345A1 (en) * 2021-01-19 2024-03-07 Showa Denko Materials Co., Ltd. Electroconductive member, method for manufacturing electronic device, connection structure, and electronic device
KR20230056826A (ko) * 2021-10-20 2023-04-28 에이치엔에스하이텍 (주) 도전입자의 유동성을 제어한 이방도전성 접착필름
KR20230056827A (ko) * 2021-10-20 2023-04-28 에이치엔에스하이텍 (주) 도전입자의 유동성을 제어한 이방도전성 접착필름의 제조방법

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Also Published As

Publication number Publication date
KR101151133B1 (ko) 2012-06-01
WO2005068573A1 (ja) 2005-07-28
KR20060123491A (ko) 2006-12-01
TWI265188B (en) 2006-11-01
JP2005200521A (ja) 2005-07-28
TW200525004A (en) 2005-08-01

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