JP6306581B2 - 半導体ウエハー表面保護粘着フィルム及びその製造方法 - Google Patents

半導体ウエハー表面保護粘着フィルム及びその製造方法 Download PDF

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Publication number
JP6306581B2
JP6306581B2 JP2015521546A JP2015521546A JP6306581B2 JP 6306581 B2 JP6306581 B2 JP 6306581B2 JP 2015521546 A JP2015521546 A JP 2015521546A JP 2015521546 A JP2015521546 A JP 2015521546A JP 6306581 B2 JP6306581 B2 JP 6306581B2
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Japan
Prior art keywords
base film
tensile
sensitive adhesive
pressure
film
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JP2015521546A
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English (en)
Japanese (ja)
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JP2015527439A (ja
Inventor
キム・ミンジョン
チョ・ヒュンジュ
ソ・ジュヨン
イ・チェグワン
キム・ジャンスン
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LG Chem Ltd
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LG Chem Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C09J2433/006—Presence of (meth)acrylic polymer in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2475/00—Presence of polyurethane
    • C09J2475/006—Presence of polyurethane in the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7422—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Dicing (AREA)
JP2015521546A 2012-07-10 2013-07-10 半導体ウエハー表面保護粘着フィルム及びその製造方法 Active JP6306581B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020120074865A KR101539133B1 (ko) 2012-07-10 2012-07-10 반도체 웨이퍼 표면보호 점착필름 및 그의 제조방법
KR10-2012-0074865 2012-07-10
PCT/KR2013/006127 WO2014010933A1 (fr) 2012-07-10 2013-07-10 Film semi-adhésif de protection de surface de tranche de semi-conducteur et son procédé de fabrication

Publications (2)

Publication Number Publication Date
JP2015527439A JP2015527439A (ja) 2015-09-17
JP6306581B2 true JP6306581B2 (ja) 2018-04-04

Family

ID=49916304

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015521546A Active JP6306581B2 (ja) 2012-07-10 2013-07-10 半導体ウエハー表面保護粘着フィルム及びその製造方法

Country Status (5)

Country Link
JP (1) JP6306581B2 (fr)
KR (1) KR101539133B1 (fr)
CN (1) CN104428874B (fr)
TW (1) TWI560256B (fr)
WO (1) WO2014010933A1 (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101932489B1 (ko) * 2014-07-30 2018-12-27 주식회사 엘지화학 광경화성 점접착제 조성물, 점접착 필름 및 점접착 필름의 제조 방법
KR102345923B1 (ko) 2017-05-18 2022-01-03 가부시기가이샤 디스코 웨이퍼를 프로세싱하는데 사용하기 위한 보호 시팅, 웨이퍼에 대한 핸들링 시스템, 및 웨이퍼 및 보호 시팅의 조합체
KR102155493B1 (ko) * 2017-05-29 2020-09-14 주식회사 엘지화학 다층 마킹 필름
WO2019036887A1 (fr) * 2017-08-22 2019-02-28 Arkema France Oligomères d'uréthane à fonction allyle et compositions associées destinés à des revêtements, et adhésifs
KR102465207B1 (ko) * 2018-09-19 2022-11-09 삼성디스플레이 주식회사 보호 필름 및 그것을 포함하는 전자 기기
WO2021200617A1 (fr) * 2020-03-30 2021-10-07 リンテック株式会社 Feuille adhésive
JPWO2021200616A1 (fr) * 2020-03-30 2021-10-07
JP7717053B2 (ja) * 2020-03-30 2025-08-01 リンテック株式会社 粘着シート
KR102473246B1 (ko) * 2020-09-29 2022-12-02 주식회사 연우 방수테이프 및 이의 제조방법
KR102280585B1 (ko) * 2021-01-15 2021-07-23 씰테크 주식회사 반도체 패키지용 이형 필름 및 그 제조 방법
CN117597408A (zh) * 2021-06-29 2024-02-23 华为技术有限公司 光学胶及其制备方法、显示屏与终端设备
CN115340830B (zh) * 2022-09-20 2023-07-25 威士达半导体科技(张家港)有限公司 一种半导体材料加工用切割胶带

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH024736A (ja) * 1988-06-22 1990-01-09 Hitachi Maxell Ltd ポリカーボネートポリオール、芳香族ポリカーボネートポリウレタン樹脂、コーティング材、キャストフィルム、磁気記録媒体
US5820958A (en) * 1997-07-01 1998-10-13 Swallow; Kevin W. Non-cracking, smooth, and flat patch for wall cracks
JPH11189762A (ja) * 1997-12-26 1999-07-13 Nippon Kayaku Co Ltd 粘着シート基材用樹脂組成物、粘着シート用基材及びそれを用いた粘着シート
JP2000309615A (ja) * 1999-04-26 2000-11-07 Shin Etsu Chem Co Ltd 光硬化性樹脂組成物及び光ファイバー用被覆材
JP5192622B2 (ja) * 2001-02-06 2013-05-08 アキレス株式会社 ダイシング用基体フィルム
JP4812963B2 (ja) * 2001-05-18 2011-11-09 リンテック株式会社 半導体ウエハ加工用粘着シートおよび半導体ウエハの加工方法
JP2005150235A (ja) * 2003-11-12 2005-06-09 Three M Innovative Properties Co 半導体表面保護シート及び方法
KR100922226B1 (ko) * 2007-12-10 2009-10-20 주식회사 엘지화학 접착 필름, 다이싱 다이본딩 필름 및 반도체 장치
JP5367990B2 (ja) * 2008-01-25 2013-12-11 リンテック株式会社 レーザーダイシングシートおよびチップ体の製造方法
JP5367996B2 (ja) * 2008-03-21 2013-12-11 リンテック株式会社 粘着シートの基材フィルムおよび粘着シート
WO2009131363A2 (fr) * 2008-04-21 2009-10-29 (주)Lg화학 Film adhésif et procédé d'amincissement de plaquette utilisant ledit film
KR101114358B1 (ko) * 2008-04-21 2012-03-14 주식회사 엘지화학 점착 필름 및 이를 사용한 백라인딩 방법
JP4851613B2 (ja) * 2009-12-22 2012-01-11 古河電気工業株式会社 半導体ウエハ表面保護用粘着テープ
KR101682720B1 (ko) * 2010-07-16 2016-12-06 주식회사 엘지화학 반도체 웨이퍼 가공 방법
JP5548109B2 (ja) * 2010-11-30 2014-07-16 リンテック株式会社 粘着シート用基材フィルムの製造方法、粘着シート用基材フィルムおよび粘着シート

Also Published As

Publication number Publication date
CN104428874A (zh) 2015-03-18
JP2015527439A (ja) 2015-09-17
TW201402770A (zh) 2014-01-16
KR101539133B1 (ko) 2015-07-23
KR20140015686A (ko) 2014-02-07
WO2014010933A1 (fr) 2014-01-16
CN104428874B (zh) 2017-04-05
TWI560256B (en) 2016-12-01

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