JP7536452B2 - 基材上に装飾ニッケルコーティングを堆積させるためのニッケル電気メッキ浴 - Google Patents

基材上に装飾ニッケルコーティングを堆積させるためのニッケル電気メッキ浴 Download PDF

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JP7536452B2
JP7536452B2 JP2019570966A JP2019570966A JP7536452B2 JP 7536452 B2 JP7536452 B2 JP 7536452B2 JP 2019570966 A JP2019570966 A JP 2019570966A JP 2019570966 A JP2019570966 A JP 2019570966A JP 7536452 B2 JP7536452 B2 JP 7536452B2
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acid
nickel
electroplating bath
range
total concentration
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JP2020524746A (ja
JP2020524746A5 (pl
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フィリップ・ヴァヒター
ラジャセカラン・ニーラメガム
フィリップ・ハルトマン
クラウス－ディーター・シュルツ
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アトテック ドイチェランド ゲーエムベーハー ウント コ カーゲー
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C25D3/14—Electroplating: Baths therefor from solutions of nickel or cobalt from baths containing acetylenic or heterocyclic compounds
    • C25D3/18—Heterocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C25D3/14—Electroplating: Baths therefor from solutions of nickel or cobalt from baths containing acetylenic or heterocyclic compounds
    • C25D3/16—Acetylenic compounds

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
JP2019570966A 2017-06-23 2018-06-18 基材上に装飾ニッケルコーティングを堆積させるためのニッケル電気メッキ浴 Active JP7536452B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023065082A JP7723696B2 (ja) 2017-06-23 2023-04-12 基材上に装飾ニッケルコーティングを堆積させるためのニッケル電気メッキ浴

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP17177732.9 2017-06-23
EP17177732 2017-06-23
PCT/EP2018/066090 WO2018234229A1 (en) 2017-06-23 2018-06-18 NICKEL ELECTROPLACING BATH FOR DEPOSITION OF A DECORATIVE NICKEL COATING ON A SUBSTRATE

Related Child Applications (1)

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JP2023065082A Division JP7723696B2 (ja) 2017-06-23 2023-04-12 基材上に装飾ニッケルコーティングを堆積させるためのニッケル電気メッキ浴

Publications (3)

Publication Number Publication Date
JP2020524746A JP2020524746A (ja) 2020-08-20
JP2020524746A5 JP2020524746A5 (pl) 2021-07-29
JP7536452B2 true JP7536452B2 (ja) 2024-08-20

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JP2019570966A Active JP7536452B2 (ja) 2017-06-23 2018-06-18 基材上に装飾ニッケルコーティングを堆積させるためのニッケル電気メッキ浴
JP2023065082A Active JP7723696B2 (ja) 2017-06-23 2023-04-12 基材上に装飾ニッケルコーティングを堆積させるためのニッケル電気メッキ浴

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JP2023065082A Active JP7723696B2 (ja) 2017-06-23 2023-04-12 基材上に装飾ニッケルコーティングを堆積させるためのニッケル電気メッキ浴

Country Status (10)

Country Link
EP (2) EP3642396B1 (pl)
JP (2) JP7536452B2 (pl)
CN (2) CN121538691A (pl)
DK (1) DK3642396T3 (pl)
ES (1) ES2890664T3 (pl)
HU (1) HUE056778T2 (pl)
PL (1) PL3642396T3 (pl)
PT (1) PT3642396T (pl)
TW (1) TWI762661B (pl)
WO (1) WO2018234229A1 (pl)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11408085B2 (en) 2019-04-15 2022-08-09 Atotech Deutschland Gmbh Galvanic nickel or nickel alloy electroplating bath for depositing a semi-bright nickel or semi-bright nickel alloy coating
CN116083987A (zh) * 2022-11-25 2023-05-09 盐城吉瓦新材料科技有限公司 一种具有保护层的电镀金刚线及其制备工艺
US20250137156A1 (en) * 2023-10-26 2025-05-01 Macdermid Enthone Inc. Boric acid-free satin nickel

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001172790A (ja) 1999-12-16 2001-06-26 Tokyo Metropolis 電気ニッケルめっき浴。
US20060096868A1 (en) 2004-11-10 2006-05-11 Siona Bunce Nickel electroplating bath designed to replace monovalent copper strike solutions

Family Cites Families (22)

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Publication number Priority date Publication date Assignee Title
GB1541118A (en) * 1976-12-03 1979-02-21 Bnf Metals Tech Centre Nickel plating
JPS5562188A (en) * 1978-06-19 1980-05-10 Oosakashi Bright black nickel electroplating bath
DD154615B1 (de) * 1980-11-20 1987-11-25 Hans U Galgon Elektrolyt zur galvanischen adscheidung glaenzender goldlegierungen
JPS5881988A (ja) * 1981-11-06 1983-05-17 C Uyemura & Co Ltd 梨地状めつき用添加剤
JPS61163289A (ja) * 1985-01-14 1986-07-23 Nippon Kagaku Sangyo Kk ニツケル及びニツケル合金による黒色電気めつき浴
JPS63171892A (ja) * 1988-01-13 1988-07-15 C Uyemura & Co Ltd 電気めっき方法
JPH09157884A (ja) * 1995-12-12 1997-06-17 Dipsol Chem Co Ltd 非酸性ニッケルめっき浴及び該めっき浴を用いためっき方法
EP0785296B1 (en) * 1995-12-29 2000-03-15 AT&T Corp. Electroplating of nickel on nickel ferrite devices
JP4737790B2 (ja) * 1999-10-01 2011-08-03 株式会社シミズ ほう酸を含まないニッケルめっき浴
JP4455896B2 (ja) 2004-02-05 2010-04-21 学校法人神奈川大学 めっき液
JP4666134B2 (ja) 2004-09-13 2011-04-06 株式会社村田製作所 ニッケルめっき浴、及び電子部品
TW200934895A (en) * 2008-02-04 2009-08-16 Magtech Technology Co Ltd Nickel plating method with low contamination and high utilization rate
US20110114498A1 (en) * 2009-11-18 2011-05-19 Tremmel Robert A Semi-Bright Nickel Plating Bath and Method of Using Same
JP5675303B2 (ja) * 2010-11-30 2015-02-25 日東光学株式会社 ニッケルめっき浴およびこれを用いた電鋳型の製造方法
JP2012162786A (ja) 2011-02-09 2012-08-30 Kanto Gakuin 電気ニッケルめっき浴、電気ニッケルめっき方法及び電気ニッケルめっき製品
CN103132114B (zh) * 2013-03-21 2016-02-10 湖南特力液压有限公司 耐磨工件及其耐磨镀层的制造方法
EP2801640A1 (en) * 2013-05-08 2014-11-12 ATOTECH Deutschland GmbH Galvanic nickel or nickel alloy electroplating bath for depositing a semi-bright nickel or nickel alloy
JP6195745B2 (ja) * 2013-06-19 2017-09-13 地方独立行政法人東京都立産業技術研究センター 電気ニッケルめっき液、めっき液の製造方法および電気めっき方法
DE102013113129A1 (de) * 2013-11-27 2015-05-28 RIAG Oberflächentechnik AG Verfahren zur galvanischen Abscheidung von Nickel und entsprechender Elektrolyt
DE102014207778B3 (de) * 2014-04-25 2015-05-21 Kiesow Dr. Brinkmann GmbH & Co. KG Verwendung einer Mischung zur Verwendung in einem galvanischen Bad oder eines galvanischen Bades zur Herstellung einer Glanznickelschicht sowie Verfahren zur Herstellung eines Artikels mit einer Glanznickelschicht
DE102014118614A1 (de) * 2014-12-15 2016-06-16 Harting Kgaa Borsäurefreies Nickel-Bad
KR101693514B1 (ko) * 2015-12-24 2017-01-06 주식회사 포스코 전기강판용 Fe-Ni-P 합금 다층 강판 및 이의 제조방법

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001172790A (ja) 1999-12-16 2001-06-26 Tokyo Metropolis 電気ニッケルめっき浴。
US20060096868A1 (en) 2004-11-10 2006-05-11 Siona Bunce Nickel electroplating bath designed to replace monovalent copper strike solutions

Also Published As

Publication number Publication date
CN110785516A (zh) 2020-02-11
DK3642396T3 (da) 2021-10-11
TWI762661B (zh) 2022-05-01
JP2023090747A (ja) 2023-06-29
TW201905243A (zh) 2019-02-01
EP3642396B1 (en) 2021-07-28
EP3933072A1 (en) 2022-01-05
PL3642396T3 (pl) 2021-12-27
CN121538691A (zh) 2026-02-17
JP2020524746A (ja) 2020-08-20
WO2018234229A1 (en) 2018-12-27
HUE056778T2 (hu) 2022-03-28
ES2890664T3 (es) 2022-01-21
EP3642396A1 (en) 2020-04-29
PT3642396T (pt) 2021-09-10
JP7723696B2 (ja) 2025-08-14

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