JPH01100694U - - Google Patents
Info
- Publication number
- JPH01100694U JPH01100694U JP1987196874U JP19687487U JPH01100694U JP H01100694 U JPH01100694 U JP H01100694U JP 1987196874 U JP1987196874 U JP 1987196874U JP 19687487 U JP19687487 U JP 19687487U JP H01100694 U JPH01100694 U JP H01100694U
- Authority
- JP
- Japan
- Prior art keywords
- powder
- additive metal
- gold powder
- gold
- metal powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/011—Apparatus therefor
- H10W72/0113—Apparatus for manufacturing die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
Landscapes
- Die Bonding (AREA)
Description
第１図は本考案の一実施例を説明するための容
器の側面図、第２図は本考案の一実施例の使用方
法を説明する場合のシリンジの断面図である。 １……Ａｕ粉末、２……Ｓｉ粉末、３……純水
、４……容器、５……リードフレーム、６……シ
リンジ。
器の側面図、第２図は本考案の一実施例の使用方
法を説明する場合のシリンジの断面図である。 １……Ａｕ粉末、２……Ｓｉ粉末、３……純水
、４……容器、５……リードフレーム、６……シ
リンジ。
Claims (1)
- 金粉末と、該金粉末と共晶合金を形成する添加
金属粉末と、前記金粉末と添加金属粉末とを混合
しかつ金粉末と添加金属粉末とで共晶合金が形成
される温度より低い温度で蒸発する溶液とを含む
ことを特徴とする半導体チツプのマウント用ソル
ダー材。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987196874U JPH01100694U (ja) | 1987-12-24 | 1987-12-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987196874U JPH01100694U (ja) | 1987-12-24 | 1987-12-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01100694U true JPH01100694U (ja) | 1989-07-06 |
Family
ID=31487464
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987196874U Pending JPH01100694U (ja) | 1987-12-24 | 1987-12-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01100694U (ja) |
-
1987
- 1987-12-24 JP JP1987196874U patent/JPH01100694U/ja active Pending