JPH01115238U - - Google Patents
Info
- Publication number
- JPH01115238U JPH01115238U JP1988010394U JP1039488U JPH01115238U JP H01115238 U JPH01115238 U JP H01115238U JP 1988010394 U JP1988010394 U JP 1988010394U JP 1039488 U JP1039488 U JP 1039488U JP H01115238 U JPH01115238 U JP H01115238U
- Authority
- JP
- Japan
- Prior art keywords
- melting point
- point solder
- pellet
- semiconductor device
- metal substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
Landscapes
- Die Bonding (AREA)
Description
第１図は、本考案に係る半導体装置の要部の断
面図である。 １……金属基板、２……高融点半田、３……低
融点半田、４……ペレツト。
面図である。 １……金属基板、２……高融点半田、３……低
融点半田、４……ペレツト。
Claims (1)
- 金属基板上に、高融点半田と低融点半田を順次
積層溶着して、ペレツトを取付けたことを特徴と
する半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988010394U JPH01115238U (ja) | 1988-01-28 | 1988-01-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988010394U JPH01115238U (ja) | 1988-01-28 | 1988-01-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01115238U true JPH01115238U (ja) | 1989-08-03 |
Family
ID=31218018
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988010394U Pending JPH01115238U (ja) | 1988-01-28 | 1988-01-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01115238U (ja) |
-
1988
- 1988-01-28 JP JP1988010394U patent/JPH01115238U/ja active Pending