JPH0110207Y2 - - Google Patents
Info
- Publication number
- JPH0110207Y2 JPH0110207Y2 JP1982091603U JP9160382U JPH0110207Y2 JP H0110207 Y2 JPH0110207 Y2 JP H0110207Y2 JP 1982091603 U JP1982091603 U JP 1982091603U JP 9160382 U JP9160382 U JP 9160382U JP H0110207 Y2 JPH0110207 Y2 JP H0110207Y2
- Authority
- JP
- Japan
- Prior art keywords
- ceramic substrate
- heat sink
- recording head
- adhesively fixed
- adhesive surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
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- Electronic Switches (AREA)
Description
【考案の詳細な説明】
本考案は、熱印刷装置の印刷ヘツドであつて、
表面に複数個の発熱抵抗体を配列してなる感熱記
録ヘツドに関するものである。[Detailed Description of the Invention] The present invention is a printing head for a thermal printing device, which includes:
This invention relates to a heat-sensitive recording head having a plurality of heating resistors arranged on its surface.
従来の感熱記録ヘツドの構成を第１図に示す。
ヒートシンク１には、発熱抵抗体を備えたセラミ
ツク基板２を接着剤３により接着固定している。
接着剤３の固化は、特性上100℃以上の高温雰囲
気で行なう。このため固化後常温までヘツドを冷
却すると、ヒートシンク１の熱膨張係数は、セラ
ミツク基板２の熱膨張係数より大きく、ヒートシ
ンク１は、セラミツク基板２よりも大きく収縮す
るため、そりが生じ記録画に悪影響を与えてい
た。本考案は、上記した欠点をなくして印字ムラ
がない、安定した感熱記録ヘツドを提供するにあ
る。 The structure of a conventional thermal recording head is shown in FIG.
A ceramic substrate 2 provided with a heating resistor is adhesively fixed to the heat sink 1 with an adhesive 3.
Due to its characteristics, the adhesive 3 is solidified in a high temperature atmosphere of 100° C. or higher. Therefore, when the head is cooled to room temperature after solidification, the coefficient of thermal expansion of the heat sink 1 is greater than that of the ceramic substrate 2, and the heat sink 1 contracts more than the ceramic substrate 2, causing warpage and adversely affecting the recorded image. was giving. The object of the present invention is to eliminate the above-mentioned drawbacks and provide a stable thermal recording head that is free from uneven printing.
このため、本考案は、２枚のセラミツク基板を
セラミツク基板との接着面を長手方向に対しＶ字
形のテーパ状としたヒートシンクのＶ字形のそれ
ぞれの接着面にそれぞれ１枚づつ接着固定したこ
とを特徴とする。 Therefore, in the present invention, two ceramic substrates are bonded and fixed one by one to each V-shaped adhesive surface of a heat sink whose adhesive surface with the ceramic substrate is tapered in a V-shape in the longitudinal direction. Features.
第２図は、本考案によるヒートシンクの斜視図
である。図において１は、ヒートシンク、１１は
テーパ部を示す。第３図は、従来のヒートシンク
１にセラミツク基板２を100℃以上にて接着固定
し、常温まで冷却した時のソリ状態を示し、第４
図は、本考案によるヒートシンク１にセラミツク
基板２を100℃以上にて接着固定し常温まで冷却
した時のソリ状態を示す。ヒートシンク１の材質
としてアルミニウムを用いた場合の第３図による
従来のそり量および本考案による第４図のそり量
を第５図に示す。第５図におけるそり量は、ヒー
トシンク１、およびセラミツク基板２の材質形
状、熱膨張特性ならびに接着剤の固化温度等に影
響を受けるが、種々の特性を考慮し第２図に示す
ヒートシンク１のテーパ部１１の高さを決定する
ものである。 FIG. 2 is a perspective view of a heat sink according to the present invention. In the figure, 1 indicates a heat sink, and 11 indicates a tapered portion. Figure 3 shows the warping state when a ceramic substrate 2 is adhesively fixed to a conventional heat sink 1 at a temperature of 100°C or higher and cooled to room temperature.
The figure shows the warping state when a ceramic substrate 2 is adhesively fixed to a heat sink 1 according to the present invention at a temperature of 100°C or higher and cooled to room temperature. FIG. 5 shows the conventional warpage amount shown in FIG. 3 and the warpage amount according to the present invention shown in FIG. 4 when aluminum is used as the material of the heat sink 1. The amount of warpage in FIG. 5 is influenced by the material shape, thermal expansion characteristics, and solidification temperature of the adhesive of the heat sink 1 and the ceramic substrate 2, but the taper of the heat sink 1 shown in FIG. This determines the height of the section 11.
以上記述したごとく、２枚のセラミツク基板
を、セラミツク基板との接着面を長手方向に対し
Ｖ字形のテーパ状としたヒートシンクのＶ字形の
それぞれの接着面にそれぞれ１枚づつ接着固定し
たことにより、相互の熱膨張特性差によるそりの
影響を防止することが可能となり、記録画のむら
をなくすことができる。 As described above, by adhesively fixing two ceramic substrates one by one to each V-shaped adhesive surface of a heat sink whose adhesive surface with the ceramic substrate is tapered in a V-shape in the longitudinal direction, It becomes possible to prevent the influence of warpage due to mutual differences in thermal expansion characteristics, and it is possible to eliminate unevenness in recorded images.
第１図は、従来の感熱記録ヘツドの斜視図、第
２図は、本考案に用いるヒートシンクの斜視図、
第３図は、従来の感熱記録ヘツドを示す正面図、
第４図は、本考案の感熱記録ヘツドを示す正面
図、第５図は、第３図および第４図に示すセラミ
ツク基板上の長手方向のそり量を示す線図であ
る。
１…ヒートシンク、２…セラミツク基板、３…
接着剤、４…発熱抵抗体、１１…テーパ部。
FIG. 1 is a perspective view of a conventional thermal recording head, and FIG. 2 is a perspective view of a heat sink used in the present invention.
FIG. 3 is a front view showing a conventional thermal recording head;
FIG. 4 is a front view showing the heat-sensitive recording head of the present invention, and FIG. 5 is a diagram showing the amount of warpage in the longitudinal direction on the ceramic substrate shown in FIGS. 3 and 4. 1... Heat sink, 2... Ceramic substrate, 3...
Adhesive, 4... Heat generating resistor, 11... Taper part.
Claims (1)
ク基板を、前記セラミツク基板よりも熱膨張係数
の大きいヒートシンクに高温雰囲気下で固化する
接着剤により接着固定してなる感熱記録ヘツドに
おいて、２枚の前記セラミツク基板を、前記セラ
ミツク基板との接着面を長手方向に対しＶ字形の
テーパ状とした該ヒートシンクのＶ字形のそれぞ
れの接着面にそれぞれ１枚ずつ接着固定したこと
を特徴とする感熱記録ヘツド。 In a thermal recording head, a ceramic substrate having a plurality of heating resistors arranged on its surface is adhesively fixed to a heat sink having a coefficient of thermal expansion larger than that of the ceramic substrate using an adhesive that hardens in a high temperature atmosphere. A heat-sensitive recording head characterized in that one ceramic substrate is adhesively fixed to each V-shaped adhesive surface of the heat sink whose adhesive surface with the ceramic substrate is tapered in a V-shape in the longitudinal direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9160382U JPS58194044U (en) | 1982-06-21 | 1982-06-21 | thermal recording head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9160382U JPS58194044U (en) | 1982-06-21 | 1982-06-21 | thermal recording head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58194044U JPS58194044U (en) | 1983-12-23 |
| JPH0110207Y2 true JPH0110207Y2 (en) | 1989-03-23 |
Family
ID=30099928
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9160382U Granted JPS58194044U (en) | 1982-06-21 | 1982-06-21 | thermal recording head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58194044U (en) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5452549A (en) * | 1977-10-03 | 1979-04-25 | Matsushita Electric Ind Co Ltd | Thermal head |
| JPS5852127Y2 (en) * | 1977-12-05 | 1983-11-28 | 松下電器産業株式会社 | thermal head |
| JPS55105351U (en) * | 1979-01-18 | 1980-07-23 |
-
1982
- 1982-06-21 JP JP9160382U patent/JPS58194044U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58194044U (en) | 1983-12-23 |
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