JPH01103885A - Led surface illuminating device - Google Patents
Led surface illuminating deviceInfo
- Publication number
- JPH01103885A JPH01103885A JP62261463A JP26146387A JPH01103885A JP H01103885 A JPH01103885 A JP H01103885A JP 62261463 A JP62261463 A JP 62261463A JP 26146387 A JP26146387 A JP 26146387A JP H01103885 A JPH01103885 A JP H01103885A
- Authority
- JP
- Japan
- Prior art keywords
- led
- transparent resin
- lamp house
- led chip
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/853—Encapsulations characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
- H10H20/856—Reflecting means
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Led Device Packages (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、LEDにより均一なバック照明を行うように
したLED面光源装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an LED surface light source device that provides uniform back illumination using LEDs.
従来、この種LED面光源装置は、例えば第3図に示す
ように構成されている。即ち、このLED面光源装置1
において、先ず上面2aが印刷等により白色にされてい
るプリント基板等の板材2の上面2a上に、適宜な間隔
、例えば1011前後の間隔をおいて複数の(図面では
二個の)LED素子3を取り付けて金線3°によりワイ
ヤボンディングすることにより実装する。次に、板材2
の上面2aの周囲に沿って、枠状ランプハウス4を接着
剤等により取り付ける。この枠状ランプハウス4は、そ
の内側面の中間の高さに上向きの段部4aと該段部4a
の上側に上方に向かって拡大するテーバ部4bとを備え
ている。続いて、該ランプハウス4内の段部4aに、ア
クリル樹脂、ポリカーボネイト、ポリエステル等の透明
シート5を水平に載置する。この透明シート5は、その
表面の上記LED素子3に対応する位置に前取てシルク
印刷の如き印刷等により形成された白色反射部6を備え
ており、さらにその白色反射部6を備えていない部分に
は複数の透孔7が設けられている。Conventionally, this type of LED surface light source device is configured as shown in FIG. 3, for example. That is, this LED surface light source device 1
First, on the top surface 2a of a plate material 2 such as a printed circuit board whose top surface 2a is made white by printing or the like, a plurality of (two in the drawing) LED elements 3 are placed at an appropriate interval, for example, an interval of about 1011. It is mounted by attaching and wire bonding with gold wire at 3 degrees. Next, plate material 2
A frame-shaped lamp house 4 is attached along the periphery of the upper surface 2a with adhesive or the like. This frame-shaped lamp house 4 has an upwardly directed step portion 4a at the middle height of its inner surface.
It is provided with a tapered portion 4b that expands upwardly on the upper side. Subsequently, a transparent sheet 5 made of acrylic resin, polycarbonate, polyester, etc. is placed horizontally on the stepped portion 4a within the lamp house 4. This transparent sheet 5 is provided with a white reflective part 6 formed by printing such as silk printing in front at a position corresponding to the LED element 3 on its surface, and is not further provided with the white reflective part 6. A plurality of through holes 7 are provided in the portion.
次に、前記ランプハウス4の内側空間内に、その上部に
空間Sを残すように上記透明シート5の上方まで透明樹
脂を充填し硬化させて透明樹脂層8を形成する。この際
、透明樹脂層8は、該透明シート5に設けられた透孔7
を通って該透明シート5の下方にも進入し、これにより
透明樹脂層8中に上記透明シート5が一体成形されるこ
とになる。最後に、該ランプハウス4上にその全体を覆
うように光拡散板9を貼着することにより、LED面光
源装置1が完成する。Next, a transparent resin is filled in the inner space of the lamp house 4 up to the upper part of the transparent sheet 5 so as to leave a space S above it, and is hardened to form a transparent resin layer 8. At this time, the transparent resin layer 8 has through holes 7 provided in the transparent sheet 5.
It also enters below the transparent sheet 5 through the transparent resin layer 8, whereby the transparent sheet 5 is integrally molded into the transparent resin layer 8. Finally, the LED surface light source device 1 is completed by pasting the light diffusing plate 9 on the lamp house 4 so as to cover the entire lamp house 4.
しかしながら、上述のように構成されたLED面光源装
置1においては、透明シート5上に備えられた白色反射
部6とLED素子3との位置合わせが容易でなく、また
透明樹脂層8が透明シート5の透孔7を通って該透明シ
ート5の下方へ流れにくくなると共に、ランプハウス4
の内側面に透明シート5を受けるための段部4aが備え
られていることから、ランプハウス4の内側面による反
射効率があまり良くなく、さらに板材2の上面2aに裸
のLEDチップであるLED素子3が在るため、透明シ
ート5を段部4aに載置する際の作業性が悪い等の欠点
があった。However, in the LED surface light source device 1 configured as described above, it is not easy to align the white reflective portion 6 provided on the transparent sheet 5 and the LED elements 3, and the transparent resin layer 8 is 5 through the through holes 7 of the transparent sheet 5, and the lamp house 4 becomes difficult to flow downward through the transparent sheet 5.
Since the inner surface of the lamp house 4 is provided with a stepped portion 4a for receiving the transparent sheet 5, the reflection efficiency by the inner surface of the lamp house 4 is not very good. Due to the presence of the element 3, there were drawbacks such as poor workability when placing the transparent sheet 5 on the stepped portion 4a.
本発明は、以上の点に鑑み、LED素子とその上方に配
置されるべき白色反射板との位置合わせが簡単であり、
また透明樹脂が充填すべきすべての場所に対して流れ易
いと共に、ランプハウスの反射効率が向上され、さらに
構成及び組立てが簡単なLED面光源装置を提供するこ
とを目的としている。In view of the above points, the present invention allows easy alignment of the LED element and the white reflector to be placed above it,
Another object of the present invention is to provide an LED surface light source device in which the transparent resin flows easily to all the places to be filled, the reflection efficiency of the lamp house is improved, and the structure and assembly are simple.
〔問題点を解決するための手段及び作用〕上記目的は、
本発明によれば、上面を印刷等により白色としたプリン
ト基板等の板材と、この板材の上面に適宜な間隔をおい
て配設され且つ予めチップ基板上にLEDチップを配置
して透明樹脂により樹脂モールドしたチップLEDの上
面に白色反射部を形成して構成された複数のLED素子
と、上記板材の上面の周囲に沿って取り付けられた枠状
ランプハウスと、該ランプハウスの内側空間内にその上
部に空間を残すように充填され硬化した透明樹脂層と、
上記ランプハウス上にその全体を覆うように貼着された
光拡散板とを含んでいるLED面光源装置によって達成
される。[Means and actions for solving the problem] The above purpose is:
According to the present invention, a plate material such as a printed circuit board whose upper surface is white by printing or the like, and an LED chip is arranged on the upper surface of this plate material at an appropriate interval and is made of transparent resin by placing LED chips on the chip substrate in advance. A plurality of LED elements each having a white reflective part formed on the upper surface of a resin-molded chip LED, a frame-shaped lamp house attached along the periphery of the upper surface of the plate, and an inner space of the lamp house. A transparent resin layer that is filled and hardened so as to leave a space above it,
This is achieved by an LED surface light source device including a light diffusing plate attached to the lamp house so as to cover the entire lamp house.
この発明によれば、LEDチップの上方に配置されるべ
き白色反射部が前以てLEDチップと一体的に形成され
ているので、該白色反射部はLEDチップに対して改め
て位置合わせすることなく極めて正確に位置決めされて
おり、また樹脂モールドする際の透明樹脂の流れを妨げ
るものが全くないので、該透明樹脂は良好に所定の範囲
に流れ得ると共に、枠状ランプハウスの内側面が従来の
ように段部を有しておらず反射面としてのみ形成されて
いることから、この内側面は極めて良好な反射効率を与
えるようになっており、さらに従来の場合のように透明
シートを必要としないことから、製造工程が減少してコ
ストが低減されることとなる。According to this invention, since the white reflective part to be disposed above the LED chip is formed integrally with the LED chip in advance, the white reflective part does not need to be repositioned with respect to the LED chip. Because the positioning is extremely accurate and there is nothing that impedes the flow of the transparent resin during resin molding, the transparent resin can flow well within the predetermined range, and the inner surface of the frame-shaped lamp house is Since it does not have a step and is formed only as a reflective surface, this inner surface provides extremely good reflection efficiency, and also eliminates the need for a transparent sheet as in the conventional case. This reduces the number of manufacturing steps and reduces costs.
以下、図面に示した一実施例に基づいて本発明をさらに
説明する。The present invention will be further explained below based on an embodiment shown in the drawings.
第1図は本発明によるLED面光源装置の断面図であり
、このLED面光源装置11は、例えば以下に説明する
ようにして製造される。FIG. 1 is a sectional view of an LED surface light source device according to the present invention, and this LED surface light source device 11 is manufactured, for example, as described below.
即ち、先ず、上面12aが印刷等により白色にされてい
るプリント基板等の板材12の上面12a上に、適宜な
間隔例えばl0IIIII+前後の間隔をおいて複数の
(第1図においては二個の)LED素子13を配設する
。ここで、LED素子13は、前以てチップ基板13a
上にLEDチップ13bを取り付けて金線13cにより
ワイヤボンディングすることにより実装し、その後透明
樹脂13dにより樹脂モールドすることによりチップL
ED13’ を形成し、最後にこのチップLED13”
の平坦な上面にシルク印刷の如き印刷等により形成さ
れた光拡散性を有する白色反射部13eを備えることに
より形成されている。That is, first, on the upper surface 12a of a plate material 12 such as a printed circuit board whose upper surface 12a is made white by printing or the like, a plurality of (two in FIG. An LED element 13 is arranged. Here, the LED element 13 is mounted on a chip substrate 13a in advance.
The LED chip 13b is mounted on top and mounted by wire bonding with a gold wire 13c, and then the chip L is molded with a transparent resin 13d.
ED13' and finally this chip LED13"
A white reflecting portion 13e having light diffusing properties is formed by printing such as silk printing on the flat upper surface of the mirror.
次に、板材12の上面12aの周囲に沿って、枠状ラン
プハウス14を接着剤等により取り付ける。この例では
枠状ランプハウス14は、その内側面に上方に向かって
拡大するテーパ部14aを備えている。Next, the frame-shaped lamp house 14 is attached along the periphery of the upper surface 12a of the plate material 12 using an adhesive or the like. In this example, the frame-shaped lamp house 14 includes a tapered portion 14a that expands upward on its inner surface.
続いて、このランプハウス14の内側空間内に、その上
部に空間Sを残すように透明樹脂を充填し硬化させて、
透明樹脂層15を形成する。その際1、透明樹脂層15
は、上記LED素子13の側方にも回り込み、これによ
り透明樹脂層15中にLED素子13が一体成形される
ことになる。最後に、ランプハウス14上にその全体を
覆うように光拡散板16を貼着することにより、LED
面光源装置11が完成する。Next, a transparent resin is filled into the inner space of the lamp house 14 so as to leave a space S above it, and is cured.
A transparent resin layer 15 is formed. At that time 1, transparent resin layer 15
also extends around the sides of the LED element 13, whereby the LED element 13 is integrally molded in the transparent resin layer 15. Finally, by pasting the light diffusing plate 16 on the lamp house 14 so as to cover the entire lamp house 14, the LED
The surface light source device 11 is completed.
本発明によるLED面光源装置は以上のように構成され
ており、このLED面光源装置11におけるLED素子
13から発する光は、第2図に示すように拡散される。The LED surface light source device according to the present invention is constructed as described above, and the light emitted from the LED elements 13 in this LED surface light source device 11 is diffused as shown in FIG. 2.
即ち、LED素子13.のLEDチップ13bから出た
光線り、は、透明樹脂13dを通ってその上面に形成さ
れた白色反射部13eに到達し、そこで反射及び拡散さ
れ、反射光は板材12の上面12aで反射拡散され、透
明樹脂層15を透過して光拡散板16に到達し、該光拡
散板16を裏面から照明することになる。また、LED
素子131 のLEDチップ13bから出た光線L2は
、透明樹脂層15を透過して該透明樹脂層15の表面で
多くが反射された後、板材12の表面12aで反射拡散
され、再び透明樹脂層15を透過して光拡散板16に到
達し、該光拡散板16を照明することになる。さらに、
LED素子13.のLEDチップ13bから出た光線L
3は、透明樹脂層15を透過し、臨界角を越えることが
らその表面で全反射された後、LED素子13の上面に
形成された白色反射部13eにより反射拡散され、透明
樹脂層15を透過して光拡散板16に到達し、この場合
も該光拡散板16を照明することになる。このような光
拡散板16の照明が各LED素子13により行われ、か
くして光拡散板16のほぼ均一な照明が得られる。That is, LED element 13. The light beam emitted from the LED chip 13b passes through the transparent resin 13d and reaches the white reflective part 13e formed on the top surface, where it is reflected and diffused, and the reflected light is reflected and diffused by the top surface 12a of the plate material 12. The light passes through the transparent resin layer 15 to reach the light diffusing plate 16, and illuminates the light diffusing plate 16 from the back side. Also, LED
The light ray L2 emitted from the LED chip 13b of the element 131 passes through the transparent resin layer 15, is mostly reflected on the surface of the transparent resin layer 15, is reflected and diffused on the surface 12a of the plate material 12, and is reflected again on the transparent resin layer. 15 to reach the light diffusing plate 16, and the light diffusing plate 16 is illuminated. moreover,
LED element 13. The light ray L emitted from the LED chip 13b of
3 passes through the transparent resin layer 15, is totally reflected on its surface because it exceeds a critical angle, is reflected and diffused by the white reflective part 13e formed on the top surface of the LED element 13, and is transmitted through the transparent resin layer 15. The light then reaches the light diffusing plate 16, and in this case as well, the light diffusing plate 16 is illuminated. Such illumination of the light diffusing plate 16 is performed by each LED element 13, and thus substantially uniform illumination of the light diffusing plate 16 is obtained.
以上述べたように、本発明によれば、上面を印刷等によ
り白色としたプリント基板等の板材と、該板材の上面に
適宜な間隔をおいて配設され且つ予めチップ基板上にL
EDチップを配置して透明樹脂により樹脂モールドした
チップLEDの上面に白色反射部を形成して構成された
複数のLED素子と、上記板材の上面の周囲に沿って取
り付けられた枠状ランプハウスと、該ランプハウスの内
側空間内にその上部に空間を残すように充填され硬化し
た透明樹脂層と、上記ランプハウス上にその全体を覆う
ように貼着された光拡散板とを含むようにLED面光源
装置を構成したから、LEDチップの上方に配置される
べき白色反射部が前板てLEDチップと一体的に形成さ
れているので、該白色反射部はLEDチップに対して改
めて位置合わせすることなく極めて正確に位置決めされ
ており、また佃脂モールドする際の透明樹脂の流れを妨
げるものが全くないので、該透明樹脂は良好に所定の範
囲に流れ得ると共に、枠状ランプハウスの内側面が従来
のように段部を有しておらず反射面としてのみ形成され
ていることから、該内側面は極めて良好な反射効率を与
えることができる。As described above, according to the present invention, a plate material such as a printed circuit board whose upper surface is colored white by printing or the like, and a L
A plurality of LED elements configured by forming a white reflective part on the upper surface of the chip LED in which ED chips are arranged and molded with transparent resin, and a frame-shaped lamp house attached along the periphery of the upper surface of the plate material. , a transparent resin layer filled and cured so as to leave a space above the inner space of the lamp house, and a light diffusing plate stuck on the lamp house so as to cover the entirety of the LED. Since the surface light source device has been constructed, the white reflective part that should be placed above the LED chip is formed integrally with the front plate, so the white reflective part must be repositioned with respect to the LED chip. In addition, since there is nothing that obstructs the flow of the transparent resin during tsukusou molding, the transparent resin can flow well within the predetermined range, and the inner surface of the frame-shaped lamp house. Since the inner surface does not have a stepped portion as in the conventional case and is formed only as a reflective surface, the inner surface can provide extremely good reflection efficiency.
さらに本発明によれば、従来の場合のように透明シート
を必要としないことから、製造工程が城少してコストが
低減されることとなる。Further, according to the present invention, since a transparent sheet is not required as in the conventional case, the manufacturing process is simplified and costs are reduced.
第1図は本発明によるLED面光源装置の一実施例を示
す部分断面図、第2図は第1図の実施例の一部を拡大し
て示す断面図である。
第3図は従来のLED面光源装置の一例を示す断面図で
ある。
1l−−−−−L E D面光源装置; 12− 板
材; 13−L E D素子; 13a −チップ基板
; 13b−L E Dチップ;13c −−一金線;
13d−透明樹脂部; 13e −白色反射部; 1
4− 枠状ランプハウス; 15−透明樹脂層;16
− 光拡散板。
特許出願人:スタンレー電気株式会社
代 理 人:弁理士 平 山 −室FIG. 1 is a partial sectional view showing an embodiment of an LED surface light source device according to the present invention, and FIG. 2 is an enlarged sectional view showing a part of the embodiment of FIG. 1. FIG. 3 is a sectional view showing an example of a conventional LED surface light source device. 1l---LED surface light source device; 12-plate material; 13-LED element; 13a-chip substrate; 13b-LED chip; 13c--solid gold wire;
13d - Transparent resin part; 13e - White reflective part; 1
4- Frame lamp house; 15- Transparent resin layer; 16
− Light diffuser. Patent applicant: Stanley Electric Co., Ltd. Representative: Patent attorney Hirayama - Office
Claims (1)
と、該板材の上面に適宜な間隔をおいて配設され且つ予
めチップ基板上にLEDチップを配置して透明樹脂によ
り樹脂モールドしたチップLEDの上面に白色反射部を
形成して構成された複数のLED素子と、上記板材の上
面の周囲に沿って取り付けられた枠状ランプハウスと、
該ランプハウスの内側空間内にその上部に空間を残すよ
うに充填されて硬化した透明樹脂層と、上記ランプハウ
ス上にその全体を覆うように貼着された光拡散板とを含
んでいることを特徴とする、LED面光源装置。A board material such as a printed circuit board whose upper surface is white by printing etc., and a chip LED which is arranged on the upper surface of the board material at an appropriate interval, and in which LED chips are placed on the chip board in advance and resin molded with transparent resin. a plurality of LED elements each having a white reflective portion formed on the top surface; a frame-shaped lamp house attached along the periphery of the top surface of the plate;
A transparent resin layer filled and cured so as to leave a space above the inner space of the lamp house, and a light diffusing plate attached to the lamp house so as to cover the entire lamp house. An LED surface light source device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62261463A JPH01103885A (en) | 1987-10-16 | 1987-10-16 | Led surface illuminating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62261463A JPH01103885A (en) | 1987-10-16 | 1987-10-16 | Led surface illuminating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01103885A true JPH01103885A (en) | 1989-04-20 |
| JPH0576195B2 JPH0576195B2 (en) | 1993-10-22 |
Family
ID=17362246
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62261463A Granted JPH01103885A (en) | 1987-10-16 | 1987-10-16 | Led surface illuminating device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01103885A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11121808A (en) * | 1997-10-15 | 1999-04-30 | Idec Izumi Corp | LED display device |
| JP2004304041A (en) * | 2003-03-31 | 2004-10-28 | Citizen Electronics Co Ltd | Light emitting diode |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006119357A (en) * | 2004-10-21 | 2006-05-11 | Koha Co Ltd | Display device |
-
1987
- 1987-10-16 JP JP62261463A patent/JPH01103885A/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11121808A (en) * | 1997-10-15 | 1999-04-30 | Idec Izumi Corp | LED display device |
| JP2004304041A (en) * | 2003-03-31 | 2004-10-28 | Citizen Electronics Co Ltd | Light emitting diode |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0576195B2 (en) | 1993-10-22 |
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