JPH01104053U - - Google Patents

Info

Publication number
JPH01104053U
JPH01104053U JP1987200323U JP20032387U JPH01104053U JP H01104053 U JPH01104053 U JP H01104053U JP 1987200323 U JP1987200323 U JP 1987200323U JP 20032387 U JP20032387 U JP 20032387U JP H01104053 U JPH01104053 U JP H01104053U
Authority
JP
Japan
Prior art keywords
emitting diode
diode chips
light emitting
fixed
lead terminals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987200323U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987200323U priority Critical patent/JPH01104053U/ja
Publication of JPH01104053U publication Critical patent/JPH01104053U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Description

【図面の簡単な説明】
第１図はこの考案の一実施例の縦断面図、第２
図は第１図の部分拡大図、第３図は第１図の横断
面図、第４図は第１図に示す実施例の等価回路図
、第５図はこの考案の他の実施例を示す第３図対
応図、第６図は従来の１個の発光ダイオードチツ
プを内蔵した発光素子を示す縦断面図、第７図は
従来の２個の発光ダイオードチツプを内蔵する単
色発光素子の縦断面図、第８図は第７図の拡大図
、第９図は第７図の等価回路図、第１０図は従来
の４個の発光ダイオードチツプを内蔵する単色発
光素子の横断面図である。 １〜４……発光ダイオードチツプ、６ａ〜６ｃ
……リード端子、７ａ，７ｂ……Ａｕワイヤ、８
……透光性モールド部材。

Claims (1)

  1. 【実用新案登録請求の範囲】 ３本のリード端子と、それらの一方の端部にそ
    れぞれ電気的に接続されて固定される４個の発光
    ダイオードチツプと、３本のリード端子の発光ダ
    イオードチツプ固定側を一体に覆う透光性モール
    ド部材からなり、 ２個の発光ダイオードチツプは、互いに極性の
    異なる側がリード端子に接続されるように前記リ
    ード端子のうちの１本に固定され、他の２個の発
    光ダイオードチツプは、互いに極性の異なる側が
    リード端子に接続されるように他の２本のリード
    端子のそれぞれに固定され、前記４個のダイオー
    ドが導電性ワイヤによつて順方向に直列接続され
    たことを特徴とする単色発光素子。
JP1987200323U 1987-12-28 1987-12-28 Pending JPH01104053U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987200323U JPH01104053U (ja) 1987-12-28 1987-12-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987200323U JPH01104053U (ja) 1987-12-28 1987-12-28

Publications (1)

Publication Number Publication Date
JPH01104053U true JPH01104053U (ja) 1989-07-13

Family

ID=31490736

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987200323U Pending JPH01104053U (ja) 1987-12-28 1987-12-28

Country Status (1)

Country Link
JP (1) JPH01104053U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101515366B1 (ko) * 2014-12-19 2015-04-28 주식회사 대영이앤아이 이중계 쌍심형 led 및 그 제조 방법과 이를 이용한 철도 신호기

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101515366B1 (ko) * 2014-12-19 2015-04-28 주식회사 대영이앤아이 이중계 쌍심형 led 및 그 제조 방법과 이를 이용한 철도 신호기

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