JPH01107148U - - Google Patents

Info

Publication number
JPH01107148U
JPH01107148U JP1988000883U JP88388U JPH01107148U JP H01107148 U JPH01107148 U JP H01107148U JP 1988000883 U JP1988000883 U JP 1988000883U JP 88388 U JP88388 U JP 88388U JP H01107148 U JPH01107148 U JP H01107148U
Authority
JP
Japan
Prior art keywords
integrated circuit
conductive plate
cooling pipe
heat conductive
holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1988000883U
Other languages
English (en)
Other versions
JPH0543482Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988000883U priority Critical patent/JPH0543482Y2/ja
Publication of JPH01107148U publication Critical patent/JPH01107148U/ja
Application granted granted Critical
Publication of JPH0543482Y2 publication Critical patent/JPH0543482Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例に係る集積回路の冷
却構造を示す断面図、第２図は他の実施例に係る
集積回路の冷却構造を示す断面図である。また第
３図は従来の集積回路の冷却構造を示す断面図で
ある。 １：プリント配線板、２：集積回路ケース、３
：熱放出面、４，１４：熱伝導板、４ａ，１４ａ
：保持部、４ｂ，１４ｂ：押圧部、５：冷却パイ
プ、７：半田。

Claims (1)

    【実用新案登録請求の範囲】
  1. 内部に集積回路チツプを有する集積回路ケース
    と、内部に冷媒通路を有する冷却パイプと、該冷
    却パイプを挿入保持する保持部を有しかつその片
    側又は両側が上記集積回路ケースの熱放出面と接
    触するスプリング形状の良熱伝導性熱伝導板と、
    上記集積回路及び熱伝導板を実装固定するプリン
    ト配線板とを備えてなることを特徴とする集積回
    路の冷却構造。
JP1988000883U 1988-01-08 1988-01-08 Expired - Lifetime JPH0543482Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988000883U JPH0543482Y2 (ja) 1988-01-08 1988-01-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988000883U JPH0543482Y2 (ja) 1988-01-08 1988-01-08

Publications (2)

Publication Number Publication Date
JPH01107148U true JPH01107148U (ja) 1989-07-19
JPH0543482Y2 JPH0543482Y2 (ja) 1993-11-02

Family

ID=31200286

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988000883U Expired - Lifetime JPH0543482Y2 (ja) 1988-01-08 1988-01-08

Country Status (1)

Country Link
JP (1) JPH0543482Y2 (ja)

Also Published As

Publication number Publication date
JPH0543482Y2 (ja) 1993-11-02

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