JPH029443U - - Google Patents
Info
- Publication number
- JPH029443U JPH029443U JP1988087701U JP8770188U JPH029443U JP H029443 U JPH029443 U JP H029443U JP 1988087701 U JP1988087701 U JP 1988087701U JP 8770188 U JP8770188 U JP 8770188U JP H029443 U JPH029443 U JP H029443U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- heat dissipation
- insertion hole
- conductive material
- attached
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Description
第１図は本考案に係るＩＣチツプ放熱構造の実
施例を示す断面図、第２図は第１図の中央縦断面
図である。 １……ＩＣチツプ、２……回路基板、１０……
挿通孔、１２……伝導材、１３……放熱フイン。
施例を示す断面図、第２図は第１図の中央縦断面
図である。 １……ＩＣチツプ、２……回路基板、１０……
挿通孔、１２……伝導材、１３……放熱フイン。
Claims (1)
- ＩＣチツプが取付けられる回路基板に挿通孔を
穿孔し、この挿通孔に熱伝導性の良好な材質で形
成された伝導材を挿通して、伝導材の一端をＩＣ
チツプに当接すると共に他端に放熱フインを取付
けてなるＩＣチツプ放熱構造。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988087701U JPH029443U (ja) | 1988-06-30 | 1988-06-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988087701U JPH029443U (ja) | 1988-06-30 | 1988-06-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH029443U true JPH029443U (ja) | 1990-01-22 |
Family
ID=31312302
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988087701U Pending JPH029443U (ja) | 1988-06-30 | 1988-06-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH029443U (ja) |
-
1988
- 1988-06-30 JP JP1988087701U patent/JPH029443U/ja active Pending