JPH01113347U - - Google Patents

Info

Publication number
JPH01113347U
JPH01113347U JP1988009219U JP921988U JPH01113347U JP H01113347 U JPH01113347 U JP H01113347U JP 1988009219 U JP1988009219 U JP 1988009219U JP 921988 U JP921988 U JP 921988U JP H01113347 U JPH01113347 U JP H01113347U
Authority
JP
Japan
Prior art keywords
ccd
area sensor
light
transparent resin
transparent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988009219U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988009219U priority Critical patent/JPH01113347U/ja
Publication of JPH01113347U publication Critical patent/JPH01113347U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Facsimile Scanning Arrangements (AREA)

Description

【図面の簡単な説明】
第1図は、本考案の実施例によるCCD素子の
積重状態を示す概略断面図、第2図は、同上正面
図、第3図は、従来例によるCCD素子の積重状
態を示す概略断面図である。 1……透明モールド樹脂、1a……受光領域、
1b……周縁部、2……CCDエリアセンサー、
2a……受光面、3……リードフレーム。

Claims (1)

    【実用新案登録請求の範囲】
  1. CCDエリアセンサーを透明モールド樹脂で封
    止してなるCCD素子において、CCDエリアセ
    ンサーの受光面側を覆う透明樹脂の表面を、少な
    くとも該CCDエリアセンサー上方の受光領域に
    該当する部分を周縁部より稍低く形成したことを
    特徴とする透明樹脂封止型CCD素子。
JP1988009219U 1988-01-26 1988-01-26 Pending JPH01113347U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988009219U JPH01113347U (ja) 1988-01-26 1988-01-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988009219U JPH01113347U (ja) 1988-01-26 1988-01-26

Publications (1)

Publication Number Publication Date
JPH01113347U true JPH01113347U (ja) 1989-07-31

Family

ID=31215774

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988009219U Pending JPH01113347U (ja) 1988-01-26 1988-01-26

Country Status (1)

Country Link
JP (1) JPH01113347U (ja)

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