JPS63140649U - - Google Patents
Info
- Publication number
- JPS63140649U JPS63140649U JP1987033630U JP3363087U JPS63140649U JP S63140649 U JPS63140649 U JP S63140649U JP 1987033630 U JP1987033630 U JP 1987033630U JP 3363087 U JP3363087 U JP 3363087U JP S63140649 U JPS63140649 U JP S63140649U
- Authority
- JP
- Japan
- Prior art keywords
- light
- resin
- light receiving
- receiving element
- outer peripheral
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Description
第１図及び第２図は本考案受光装置の一実施例
を示し、第１図は平面図、第２図は第１図の―
線断面図、第３図及び第４図は従来装置を示し
、第３図は平面図、第４図は第３図の―′線
断面図、を夫々示している。 １……受光素子、１ａ……受光面、５……モー
ルド樹脂、５ａ……入射面、５ｂ……外周面、６
……凹所。
を示し、第１図は平面図、第２図は第１図の―
線断面図、第３図及び第４図は従来装置を示し
、第３図は平面図、第４図は第３図の―′線
断面図、を夫々示している。 １……受光素子、１ａ……受光面、５……モー
ルド樹脂、５ａ……入射面、５ｂ……外周面、６
……凹所。
Claims (1)
- 受光すべき光の入射を許容する入射面が受光素
子の受光面に対し傾斜した樹脂封止型の受光装置
であつて、上記入射面は受光素子を樹脂封止する
モールド樹脂の外周面から窪んだ凹所に設けられ
ると共に、上記外周面は受光素子の受光面と平行
であることを特徴とした受光装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987033630U JPH0632695Y2 (ja) | 1987-03-06 | 1987-03-06 | 受光装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987033630U JPH0632695Y2 (ja) | 1987-03-06 | 1987-03-06 | 受光装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63140649U true JPS63140649U (ja) | 1988-09-16 |
| JPH0632695Y2 JPH0632695Y2 (ja) | 1994-08-24 |
Family
ID=30841415
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987033630U Expired - Lifetime JPH0632695Y2 (ja) | 1987-03-06 | 1987-03-06 | 受光装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0632695Y2 (ja) |
-
1987
- 1987-03-06 JP JP1987033630U patent/JPH0632695Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0632695Y2 (ja) | 1994-08-24 |