JPH01115129A - 光学素子の製造方法 - Google Patents
光学素子の製造方法Info
- Publication number
- JPH01115129A JPH01115129A JP62272835A JP27283587A JPH01115129A JP H01115129 A JPH01115129 A JP H01115129A JP 62272835 A JP62272835 A JP 62272835A JP 27283587 A JP27283587 A JP 27283587A JP H01115129 A JPH01115129 A JP H01115129A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- mixed liquid
- optical element
- chip
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62272835A JPH01115129A (ja) | 1987-10-28 | 1987-10-28 | 光学素子の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62272835A JPH01115129A (ja) | 1987-10-28 | 1987-10-28 | 光学素子の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01115129A true JPH01115129A (ja) | 1989-05-08 |
| JPH0524675B2 JPH0524675B2 (cs) | 1993-04-08 |
Family
ID=17519437
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62272835A Granted JPH01115129A (ja) | 1987-10-28 | 1987-10-28 | 光学素子の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01115129A (cs) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008208380A (ja) * | 2008-05-26 | 2008-09-11 | Nippon Electric Glass Co Ltd | 発光色変換部材 |
| JP2008255362A (ja) * | 2008-05-26 | 2008-10-23 | Nippon Electric Glass Co Ltd | 発光色変換部材 |
| DE102008005936A1 (de) * | 2008-01-24 | 2009-07-30 | Osram Opto Semiconductors Gmbh | Optoelektronische Anordnung |
| JP2015087218A (ja) * | 2013-10-30 | 2015-05-07 | 愛三工業株式会社 | 液量検出装置 |
-
1987
- 1987-10-28 JP JP62272835A patent/JPH01115129A/ja active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102008005936A1 (de) * | 2008-01-24 | 2009-07-30 | Osram Opto Semiconductors Gmbh | Optoelektronische Anordnung |
| JP2008208380A (ja) * | 2008-05-26 | 2008-09-11 | Nippon Electric Glass Co Ltd | 発光色変換部材 |
| JP2008255362A (ja) * | 2008-05-26 | 2008-10-23 | Nippon Electric Glass Co Ltd | 発光色変換部材 |
| JP2015087218A (ja) * | 2013-10-30 | 2015-05-07 | 愛三工業株式会社 | 液量検出装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0524675B2 (cs) | 1993-04-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8247263B2 (en) | Method for producing an optical, radiation-emitting component and optical, radiation-emitting component | |
| CN108133670A (zh) | 集成封装led显示模块封装方法及led显示模块 | |
| CN104078555A (zh) | Led模压封装工艺 | |
| GB2280062B (en) | Method of packaging a power semiconductor device and package produced by the method | |
| US4230754A (en) | Bonding electronic component to molded package | |
| CN102856478B (zh) | 功率型发光二极管、发光二极管支架及其制备方法 | |
| JPH1117073A (ja) | 光結合半導体装置および封止用樹脂組成物 | |
| CN109777039B (zh) | 一种片式led封装用环氧树脂组合物胶饼及其制备方法和封装工艺 | |
| KR102125023B1 (ko) | 광반도체 소자 밀봉용 에폭시 수지 조성물 및 그 제조 방법 | |
| CN110429170A (zh) | 一种用紫外光固化的芯片器件封装工艺 | |
| JPH0524675B2 (cs) | ||
| CN111849366A (zh) | Led模压封装胶片的使用方法 | |
| JPH0311757A (ja) | 半導体装置およびその製造方法 | |
| JP3266680B2 (ja) | 発光ダイオードの製造方法 | |
| CN209344122U (zh) | 一种量子点led封装器件 | |
| CN105968360B (zh) | 一种有机硅三元封装材料及其制备方法 | |
| JPH0462188B2 (cs) | ||
| TWI883430B (zh) | 影像感測器模組的製造方法 | |
| JPH03201470A (ja) | 光半導体装置 | |
| CN103022316A (zh) | 一种大功率led灯及其封装方法 | |
| JPS5821358A (ja) | 半導体装置の封止方法 | |
| CN107086262A (zh) | 紫外光发光二极管封装方法 | |
| JPS60103650A (ja) | 発光ダイオ−ド | |
| CN108129800A (zh) | 一种量子点胶体固化成型制备led透镜的工艺 | |
| CN112420892A (zh) | 一种使用硅氮烷进行粘结的紫外led灯珠及其制备方法 |