JPH0524675B2 - - Google Patents

Info

Publication number
JPH0524675B2
JPH0524675B2 JP62272835A JP27283587A JPH0524675B2 JP H0524675 B2 JPH0524675 B2 JP H0524675B2 JP 62272835 A JP62272835 A JP 62272835A JP 27283587 A JP27283587 A JP 27283587A JP H0524675 B2 JPH0524675 B2 JP H0524675B2
Authority
JP
Japan
Prior art keywords
epoxy resin
chip
mixed liquid
sol
glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62272835A
Other languages
English (en)
Japanese (ja)
Other versions
JPH01115129A (ja
Inventor
Shoji Usuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Idec Corp
Original Assignee
Idec Izumi Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Idec Izumi Corp filed Critical Idec Izumi Corp
Priority to JP62272835A priority Critical patent/JPH01115129A/ja
Publication of JPH01115129A publication Critical patent/JPH01115129A/ja
Publication of JPH0524675B2 publication Critical patent/JPH0524675B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP62272835A 1987-10-28 1987-10-28 光学素子の製造方法 Granted JPH01115129A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62272835A JPH01115129A (ja) 1987-10-28 1987-10-28 光学素子の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62272835A JPH01115129A (ja) 1987-10-28 1987-10-28 光学素子の製造方法

Publications (2)

Publication Number Publication Date
JPH01115129A JPH01115129A (ja) 1989-05-08
JPH0524675B2 true JPH0524675B2 (cs) 1993-04-08

Family

ID=17519437

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62272835A Granted JPH01115129A (ja) 1987-10-28 1987-10-28 光学素子の製造方法

Country Status (1)

Country Link
JP (1) JPH01115129A (cs)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008005936A1 (de) * 2008-01-24 2009-07-30 Osram Opto Semiconductors Gmbh Optoelektronische Anordnung
JP2008208380A (ja) * 2008-05-26 2008-09-11 Nippon Electric Glass Co Ltd 発光色変換部材
JP5190680B2 (ja) * 2008-05-26 2013-04-24 日本電気硝子株式会社 発光色変換部材
JP6100140B2 (ja) * 2013-10-30 2017-03-22 愛三工業株式会社 液量検出装置

Also Published As

Publication number Publication date
JPH01115129A (ja) 1989-05-08

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