JPS6420770U - - Google Patents
Info
- Publication number
- JPS6420770U JPS6420770U JP11562487U JP11562487U JPS6420770U JP S6420770 U JPS6420770 U JP S6420770U JP 11562487 U JP11562487 U JP 11562487U JP 11562487 U JP11562487 U JP 11562487U JP S6420770 U JPS6420770 U JP S6420770U
- Authority
- JP
- Japan
- Prior art keywords
- board
- circuit pattern
- printed circuit
- board body
- resin layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 claims description 3
- 229920003002 synthetic resin Polymers 0.000 claims description 3
- 239000000057 synthetic resin Substances 0.000 claims description 3
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
第１図はこの考案の一実施例を示すプリント回
路基板の要部断面図、第２図は他の実施例を示す
プリント回路基板の要部断面図、第３図はこの考
案のプリント回路基板を製造する射出成形金型の
要部断面図、第４図は型締め状態を示す金型の一
部拡大断面図、第５図は回路用フイルムの要部斜
視図である。
１０…プリント回路基板、１０Ａ…基板本体、
１１…基板材、１３…回路パターン、１５…保護
合成樹脂層、１７…配線孔、２０…プリント回路
基板、２０Ａ…基板本体、２１…基板材、２３…
回路パターン、２５…保護合成樹脂層、２７…配
線孔、２９…端子ピン、３０…固定型、４０…孔
用コア、５０…可動型、６０…回路用フイルム、
６１…回路パターン、Ｃ…キヤビテイ。
Fig. 1 is a sectional view of the main parts of a printed circuit board showing one embodiment of this invention, Fig. 2 is a sectional view of the main parts of a printed circuit board showing another embodiment, and Fig. 3 is a printed circuit board of this invention. FIG. 4 is a partially enlarged sectional view of the mold showing the mold clamping state, and FIG. 5 is a perspective view of the main part of the circuit film. 10...Printed circuit board, 10A...board body,
DESCRIPTION OF SYMBOLS 11... Board material, 13... Circuit pattern, 15... Protective synthetic resin layer, 17... Wiring hole, 20... Printed circuit board, 20A... Board body, 21... Board material, 23...
Circuit pattern, 25... Protective synthetic resin layer, 27... Wiring hole, 29... Terminal pin, 30... Fixed type, 40... Core for hole, 50... Movable type, 60... Circuit film,
61...Circuit pattern, C...Cavity.
Claims (1)
合成樹脂層が一体に被覆されて基板本体が形成さ
れているとともに、前記基板本体に前記回路パタ
ーンに達する配線孔が形成されていることを特徴
とするプリント回路基板。 A board body is formed by integrally covering the surface of a board material with a circuit pattern formed thereon with a protective synthetic resin layer, and a wiring hole reaching the circuit pattern is formed in the board body. printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11562487U JPS6420770U (en) | 1987-07-28 | 1987-07-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11562487U JPS6420770U (en) | 1987-07-28 | 1987-07-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6420770U true JPS6420770U (en) | 1989-02-01 |
Family
ID=31357454
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11562487U Pending JPS6420770U (en) | 1987-07-28 | 1987-07-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6420770U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60240184A (en) * | 1984-05-14 | 1985-11-29 | 松下電器産業株式会社 | Method of mounting electronic part on printed board |
-
1987
- 1987-07-28 JP JP11562487U patent/JPS6420770U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60240184A (en) * | 1984-05-14 | 1985-11-29 | 松下電器産業株式会社 | Method of mounting electronic part on printed board |