JPH01125554U - - Google Patents

Info

Publication number
JPH01125554U
JPH01125554U JP1988020265U JP2026588U JPH01125554U JP H01125554 U JPH01125554 U JP H01125554U JP 1988020265 U JP1988020265 U JP 1988020265U JP 2026588 U JP2026588 U JP 2026588U JP H01125554 U JPH01125554 U JP H01125554U
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
sealing frame
electronic component
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988020265U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988020265U priority Critical patent/JPH01125554U/ja
Publication of JPH01125554U publication Critical patent/JPH01125554U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP1988020265U 1988-02-18 1988-02-18 Pending JPH01125554U (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988020265U JPH01125554U (cs) 1988-02-18 1988-02-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988020265U JPH01125554U (cs) 1988-02-18 1988-02-18

Publications (1)

Publication Number Publication Date
JPH01125554U true JPH01125554U (cs) 1989-08-28

Family

ID=31236485

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988020265U Pending JPH01125554U (cs) 1988-02-18 1988-02-18

Country Status (1)

Country Link
JP (1) JPH01125554U (cs)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61247059A (ja) * 1985-04-24 1986-11-04 Mitsubishi Electric Corp 混成集積回路装置の製造方法
JPS6239034A (ja) * 1985-08-14 1987-02-20 Matsushita Electric Works Ltd 半導体チツプキヤリアの製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61247059A (ja) * 1985-04-24 1986-11-04 Mitsubishi Electric Corp 混成集積回路装置の製造方法
JPS6239034A (ja) * 1985-08-14 1987-02-20 Matsushita Electric Works Ltd 半導体チツプキヤリアの製造方法

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