JPS6090867U - 電気的接続手段を有する配線基板 - Google Patents

電気的接続手段を有する配線基板

Info

Publication number
JPS6090867U
JPS6090867U JP1983182803U JP18280383U JPS6090867U JP S6090867 U JPS6090867 U JP S6090867U JP 1983182803 U JP1983182803 U JP 1983182803U JP 18280383 U JP18280383 U JP 18280383U JP S6090867 U JPS6090867 U JP S6090867U
Authority
JP
Japan
Prior art keywords
wiring board
electrical connection
connection means
material layer
wiring pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1983182803U
Other languages
English (en)
Inventor
泰造 檜垣
川井　由男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Casio Computer Co Ltd
Original Assignee
Casio Computer Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Casio Computer Co Ltd filed Critical Casio Computer Co Ltd
Priority to JP1983182803U priority Critical patent/JPS6090867U/ja
Priority to KR2019840003391U priority patent/KR890000596Y1/ko
Priority to GB08429524A priority patent/GB2150361B/en
Publication of JPS6090867U publication Critical patent/JPS6090867U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0425—Solder powder or solder coated metal powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
図面はすべて本考案の電気的接続手段を有する配線基板
に関するものであり、第１図は配線基板とこの配線基板
に取付ける各種電子部品の分解斜視図、第２図は配線基
板に被着された接続材層の拡大断面図、第３図は配線基
板の接続端子と電子部品の端子を接続した状態の要部拡
大断面図、第４図〜第７図は配線基板に各種電子部品を
取付けた状態を示し、第４図は表示体を、第５図は半導
体集積回路素子を、第６図は副配線基板を、第７図はチ
ップ部品をそれぞれ配線基板に取付けた状態の断面図で
ある。 １・・・・・・配線基板、２・・・・・・配線パターン
、２ａ。 ２ｂ、２ｃ、２ｄ・・・・・・接続端子、３．　３ａ、
　　３ｂ、　３ｃ、　３ｄ・・・・・・接続材層、４・
・・・・・ホットメルト型接着材、５・・・・・・導電
性粒子。

Claims (1)

    【実用新案登録請求の範囲】
  1. 樹脂フィルムからなる配線基板に所定の配線パターンを
    設け、この配線パターンの一部にまたは配線パターンを
    延長して複数の接続端子を設け、前記複数の接続端子全
    体に亘って、常態ではすべての方向に対して実質的に絶
    縁性を示すが、熱圧着により溶融して圧着された部分が
    厚さ方向にのみ導電性を示す接続材層を略一様な厚さに
    被着するとともに、前記接続材層を乾燥固化したことを
    特徴とする電気的接続手段を有する配線基板。
JP1983182803U 1983-11-26 1983-11-26 電気的接続手段を有する配線基板 Pending JPS6090867U (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP1983182803U JPS6090867U (ja) 1983-11-26 1983-11-26 電気的接続手段を有する配線基板
KR2019840003391U KR890000596Y1 (ko) 1983-11-26 1984-04-13 배선기판
GB08429524A GB2150361B (en) 1983-11-26 1984-11-22 Circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983182803U JPS6090867U (ja) 1983-11-26 1983-11-26 電気的接続手段を有する配線基板

Publications (1)

Publication Number Publication Date
JPS6090867U true JPS6090867U (ja) 1985-06-21

Family

ID=16124696

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983182803U Pending JPS6090867U (ja) 1983-11-26 1983-11-26 電気的接続手段を有する配線基板

Country Status (3)

Country Link
JP (1) JPS6090867U (ja)
KR (1) KR890000596Y1 (ja)
GB (1) GB2150361B (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH025375A (ja) * 1988-06-24 1990-01-10 Toshiba Corp 電子部品の実装方法
DE4206700A1 (de) * 1992-03-04 1993-09-16 Vdo Schindling Kontaktierung

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2068645A (en) * 1980-01-31 1981-08-12 Rogers Corp Electrical interconnection

Also Published As

Publication number Publication date
GB2150361B (en) 1988-01-27
GB2150361A (en) 1985-06-26
KR890000596Y1 (ko) 1989-03-11
GB8429524D0 (en) 1985-01-03
KR850004578U (ko) 1985-07-22

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