JPH01129846U - - Google Patents
Info
- Publication number
- JPH01129846U JPH01129846U JP1988024168U JP2416888U JPH01129846U JP H01129846 U JPH01129846 U JP H01129846U JP 1988024168 U JP1988024168 U JP 1988024168U JP 2416888 U JP2416888 U JP 2416888U JP H01129846 U JPH01129846 U JP H01129846U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- lead frame
- adjacent unit
- outer leads
- lead frames
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図ａおよび第１図ｂは本考案実施例のリー
ドフレームの斜視図、第２図ａ乃至第２図ｅは同
のリードフレームの製造工程図、第３図は通常の
リードフレームを示す図、第４図は通常の半導体
装置を示す図、第５図ａおよび第５図ｂは従来例
のリードフレームのアウターリードを示す断面図
である。
１……リードフレーム、２……半導体チツプ、
３……ワイヤ、４……封止材料、１１……ダイパ
ツド、１２……インナーリード、１３……タイバ
ー、１４……アウターリード、１５，１６……サ
イドバー、１７……サポートバー、１８……メツ
キ層、２０……橋絡部、２１……スリツト、ｄ…
…抜きダレ、ｂ……抜きバリ。
Figures 1a and 1b are perspective views of a lead frame according to an embodiment of the present invention, Figures 2a to 2e are manufacturing process diagrams of the same lead frame, and Figure 3 shows a normal lead frame. 4A and 4B are views showing an ordinary semiconductor device, and FIGS. 5A and 5B are sectional views showing the outer leads of a conventional lead frame. 1...Lead frame, 2...Semiconductor chip,
3... Wire, 4... Sealing material, 11... Die pad, 12... Inner lead, 13... Tie bar, 14... Outer lead, 15, 16... Side bar, 17... Support bar, 18... ...Made layer, 20...Bridge part, 21...Slit, d...
...Pulling sag, b...Pulling burr.
Claims (1)
フレームのタイバーに連結し、互いに隣接する単
位リードフレームのアウターリードが同一平面内
で互いにかみあうように形成したリードフレーム
において、 アウターリードをコイニングし幅方向断面の形
状がほぼ四角形となるようにするとともに、アウ
ターリードの先端が橋絡されるタイバーとの橋絡
部に応力緩和用の開口部を形成するようにしたこ
とを特徴とするリードフレーム。[Claims for Utility Model Registration] A lead frame in which the tips of the outer leads are connected to the tie bars of adjacent unit lead frames so that the outer leads of the adjacent unit lead frames engage with each other in the same plane. The lead is coined so that the cross-sectional shape in the width direction is almost square, and an opening for stress relief is formed at the bridge between the tip of the outer lead and the tie bar. lead frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988024168U JPH0650989Y2 (en) | 1988-02-25 | 1988-02-25 | Lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988024168U JPH0650989Y2 (en) | 1988-02-25 | 1988-02-25 | Lead frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01129846U true JPH01129846U (en) | 1989-09-04 |
| JPH0650989Y2 JPH0650989Y2 (en) | 1994-12-21 |
Family
ID=31243785
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988024168U Expired - Lifetime JPH0650989Y2 (en) | 1988-02-25 | 1988-02-25 | Lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0650989Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010098156A1 (en) * | 2009-02-25 | 2010-09-02 | 三洋電機株式会社 | Frame package type light emitting device and method of manufacturing the same |
-
1988
- 1988-02-25 JP JP1988024168U patent/JPH0650989Y2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010098156A1 (en) * | 2009-02-25 | 2010-09-02 | 三洋電機株式会社 | Frame package type light emitting device and method of manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0650989Y2 (en) | 1994-12-21 |