JPH01137598U - - Google Patents

Info

Publication number
JPH01137598U
JPH01137598U JP1988034683U JP3468388U JPH01137598U JP H01137598 U JPH01137598 U JP H01137598U JP 1988034683 U JP1988034683 U JP 1988034683U JP 3468388 U JP3468388 U JP 3468388U JP H01137598 U JPH01137598 U JP H01137598U
Authority
JP
Japan
Prior art keywords
wiring board
flange
chip package
cooling
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1988034683U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0642388Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988034683U priority Critical patent/JPH0642388Y2/ja
Publication of JPH01137598U publication Critical patent/JPH01137598U/ja
Application granted granted Critical
Publication of JPH0642388Y2 publication Critical patent/JPH0642388Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1988034683U 1988-03-15 1988-03-15 マルチチップ・パッケージ Expired - Lifetime JPH0642388Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988034683U JPH0642388Y2 (ja) 1988-03-15 1988-03-15 マルチチップ・パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988034683U JPH0642388Y2 (ja) 1988-03-15 1988-03-15 マルチチップ・パッケージ

Publications (2)

Publication Number Publication Date
JPH01137598U true JPH01137598U (cs) 1989-09-20
JPH0642388Y2 JPH0642388Y2 (ja) 1994-11-02

Family

ID=31261374

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988034683U Expired - Lifetime JPH0642388Y2 (ja) 1988-03-15 1988-03-15 マルチチップ・パッケージ

Country Status (1)

Country Link
JP (1) JPH0642388Y2 (cs)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011211195A (ja) * 2010-03-29 2011-10-20 Hamilton Sundstrand Corp 冷却板アセンブリ、および冷却板アセンブリの製造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6380427B2 (ja) * 2016-02-29 2018-08-29 株式会社安川電機 リニアモータ

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59200495A (ja) * 1983-04-27 1984-11-13 株式会社日立製作所 マルチチツプ・モジユ−ル

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59200495A (ja) * 1983-04-27 1984-11-13 株式会社日立製作所 マルチチツプ・モジユ−ル

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011211195A (ja) * 2010-03-29 2011-10-20 Hamilton Sundstrand Corp 冷却板アセンブリ、および冷却板アセンブリの製造方法

Also Published As

Publication number Publication date
JPH0642388Y2 (ja) 1994-11-02

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