JPH01138793A - Ceramic multilayer circuit substrate - Google Patents
Ceramic multilayer circuit substrateInfo
- Publication number
- JPH01138793A JPH01138793A JP29714987A JP29714987A JPH01138793A JP H01138793 A JPH01138793 A JP H01138793A JP 29714987 A JP29714987 A JP 29714987A JP 29714987 A JP29714987 A JP 29714987A JP H01138793 A JPH01138793 A JP H01138793A
- Authority
- JP
- Japan
- Prior art keywords
- paste
- ceramic
- multilayer circuit
- metal
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 43
- 239000000758 substrate Substances 0.000 title description 3
- 229910052751 metal Inorganic materials 0.000 claims abstract description 29
- 239000002184 metal Substances 0.000 claims abstract description 29
- 239000000843 powder Substances 0.000 claims abstract description 18
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 7
- 229910052802 copper Inorganic materials 0.000 claims abstract description 5
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 3
- 238000010304 firing Methods 0.000 claims description 7
- 239000004020 conductor Substances 0.000 abstract description 24
- 229910052709 silver Inorganic materials 0.000 abstract description 8
- 238000000034 method Methods 0.000 abstract description 4
- 239000003638 chemical reducing agent Substances 0.000 abstract description 3
- 150000002739 metals Chemical class 0.000 abstract description 2
- 239000012266 salt solution Substances 0.000 abstract description 2
- 238000005245 sintering Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002923 metal particle Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Conductive Materials (AREA)
Abstract
Description
【発明の詳細な説明】
不エール浬し１月」乞
［産業上の利用分野］
本発明は電子機器に使用されるセラミック多層回路基板
に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a ceramic multilayer circuit board used in electronic equipment.
［従来の技術］
一般にセラミック多層回路基板はＷまたはＭｏを導体と
する高アルミナ系の高温焼成（１５００℃以上）の多層
回路基板を用いているが、アルミナは比誘電率が高く、
導通抵抗も高いため、信号伝播遅延時間も長くなりコン
ピュータ等の高速化、高性能化の障害となっていた。[Prior Art] Ceramic multilayer circuit boards generally use high-alumina-based multilayer circuit boards fired at high temperatures (1500°C or higher) with W or Mo as conductors, but alumina has a high dielectric constant;
Since the conduction resistance is also high, the signal propagation delay time is also long, which is an obstacle to increasing the speed and performance of computers.
このため、高温焼成多層回路基板に代わるものとして、
基板材料は、例えば特開昭６０−２６０４６５号公報、
特開昭６０−２２７３１１号公報等には低融点ガラスに
アルミナを添加したセラミックやＡ Ｉ ２０３−３
ｉ０２−ＣａＯ−１０２−ＣａＯ−系セラミック等を用
い、さらに導体は、例えばＡｇ 、Ａｇ−Ｐｄ 、 Ｃ
ｕ等の低抵抗金属を用い、これらを多層に積層した低温
焼成セラミック多層回路基板の開発が進められている。Therefore, as an alternative to high-temperature fired multilayer circuit boards,
The substrate material is, for example, Japanese Patent Application Laid-open No. 60-260465,
Japanese Unexamined Patent Publication No. 60-227311 etc. disclose ceramics made by adding alumina to low melting point glass and A I 203-3.
i02-CaO-102-CaO- based ceramic etc. are used, and the conductor is, for example, Ag, Ag-Pd, C
Development of low-temperature fired ceramic multilayer circuit boards in which low-resistance metals such as u are used and these are laminated in multiple layers is progressing.
この一般的な製造方法を第２図にフローチャートで示し
た。そこで使用されているスルホール用導体ペーストは
■導通抵抗が低いこと、■セラミックの焼成は８００℃
〜１０００℃で焼結可能なこと、■できるだけ安価なこ
と等を考慮して金属成分が決められている０例えば、酸
化雰囲気（空気）焼成ではＡｇ、Ａｇ−Ｐｄで、中性お
よび還元雰囲気ではＣｕである。This general manufacturing method is shown in a flowchart in FIG. The conductive paste for through-holes used there has ■low conduction resistance, and ■ceramic firing temperature is 800℃.
The metal components are determined taking into account that it can be sintered at ~1000℃, and that it is as inexpensive as possible0. For example, Ag and Ag-Pd are used for firing in an oxidizing atmosphere (air), and in neutral and reducing atmospheres. It is Cu.
このような金属粉末は通常平均０．１μ〜５μ程度の球
状ないし粒状粉体であり、スルホール用導体ペーストは
前述した金属粉末と有機ビヒクルを三本ロールなどでよ
く混合混練して作製される。Such metal powder is usually a spherical or granular powder with an average size of about 0.1 μm to 5 μm, and the through-hole conductor paste is prepared by thoroughly mixing and kneading the above-mentioned metal powder and organic vehicle using a triple roll or the like.
こうして作製された導体ペーストを用いて第２図に示し
たフローチャートのように多層回路基板を作製すると、
スルホール内へ充填したＡｇ、Ａｇ−ＰｄおよびＣｕの
熱膨張係数がセラミックに比べて著しく大きいため、温
度変化によってスルホール内の金属粒子とセラミックと
の間に大きな引張応力あるいは圧縮応力がかかり、導体
中やセラミック中にクラックの発生し、導通の信頼性を
低下させていた。When a multilayer circuit board is manufactured using the conductive paste thus prepared as shown in the flowchart shown in Fig. 2,
Because the coefficient of thermal expansion of Ag, Ag-Pd, and Cu filled into the through-hole is significantly larger than that of ceramic, large tensile or compressive stress is applied between the metal particles inside the through-hole and the ceramic due to temperature changes, causing damage in the conductor. Cracks were generated in the ceramic and reduced the reliability of conduction.
［発明が解決しようとする問題点］
本発明はスルホール導通の信頼性を向上するため、従来
の平均帆１μ〜５μ球状ないし粒状のＡｇ、Ｃｕ、Ａｇ
−Ｐｄ粉体を使用すると、導体がセラミックの焼成温度
では緻密に焼結してしまうことが導通の信頼性を低下さ
せている原因と考え、導体を多孔質状とすることにより
問題を解決しようとするものである。[Problems to be Solved by the Invention] In order to improve the reliability of through-hole conduction, the present invention uses conventional spherical or granular Ag, Cu, Ag
- When Pd powder is used, the conductor becomes densely sintered at the firing temperature of ceramics, which is thought to be the cause of the decrease in continuity reliability, and we are trying to solve the problem by making the conductor porous. That is.
１−Ｊ１１例ＪＬｐ虹
［問題点を解決するための手段１
本発明はセラミックグリンシートにスルホールを形成し
、金属成分と有機ビヒクルよりなるペーストで充填した
後、焼成して製造するセラミック多層回路基板において
、前記金属成分は重量比率で３０％以上の傳平状導体金
属粉末を含有するペーストからなることを特徴とするセ
ラミック多層回路基板である。1-J11 Example JLp Rainbow [Means for solving the problem 1 The present invention is a ceramic multilayer circuit board manufactured by forming through holes in a ceramic green sheet, filling it with a paste consisting of a metal component and an organic vehicle, and then firing it. The ceramic multilayer circuit board is characterized in that the metal component is a paste containing flat conductor metal powder in a weight ratio of 30% or more.
そして、スルホールに充填するペーストの金属成分はＡ
ｇ、Ｐｄ、 Ｐｔ、およびＣｕの少なくとも１種以上か
らなることを特徴とする。The metal component of the paste filling the through holes is A
It is characterized by being made of at least one of g, Pd, Pt, and Cu.
そして、スルホールをペーストで充填したセラミックグ
リンシートは８００℃〜１０００℃で焼成することを特
徴とする
［作用コ
通常、導体ペーストに用いられる球状あるいは粒状金属
粉末は、金属塩溶液から還元剤を用いて金属粉末を沈殿
させる等の方法で作製されたものであり、本発明で用い
る偏平状粉末は、前記の方法等で作製した球状粉末など
をボールミルなどで機械的な力で砕きあるいは延ばした
りして作製される。The ceramic green sheet filled with the through holes with the paste is characterized by being fired at 800°C to 1000°C. The flat powder used in the present invention is obtained by crushing or rolling out the spherical powder produced by the above method using mechanical force using a ball mill or the like. It is made by
また、Ａｇ−Ｐｄ共沈粉末は、Ａｇ 、 Ｐｄそれぞれ
の金属塩混合溶液に還元剤を添加して、同時に沈殿させ
粒子として作製したものである。Further, the Ag-Pd co-precipitated powder was produced as particles by adding a reducing agent to a mixed solution of metal salts of Ag and Pd, and causing simultaneous precipitation.
またＡｇ−Ｐｄ合金粉末は、ＡｇとＰｄのそれぞれの水
酸化物を水素気流中で加熱還元させる方法等で作製した
ものである。The Ag-Pd alloy powder is produced by heating and reducing hydroxides of Ag and Pd in a hydrogen stream.
導体ペースト中の金属粒子を従来の球状から偏平状の粒
子を金属成分全体の３０％以上とすることにより、セラ
ミックと一体焼結した場合、スルホール導体の金属成分
部の構造は、焼結性が悪いために空孔の多い多孔質状の
組織となって、急激な温度変化に起因する応力を緩和し
、セラミック部および導体部でのクラックの発生を防ぐ
ものと思われる。By changing the metal particles in the conductor paste from the conventional spherical shape to 30% or more of the total metal component, the structure of the metal component part of the through-hole conductor will have poor sinterability when sintered integrally with the ceramic. It is thought that this causes a porous structure with many pores, which relieves stress caused by sudden temperature changes and prevents cracks from occurring in the ceramic part and the conductor part.
なお、導体部の構造組織は多孔質ではあるが、一つのボ
アーの孔径は数μ程度であり、導通抵抗は緻密質の場合
と比較して実用上の差異はほとんど認められず、電気回
路として好ましくない配線抵抗の増加を防いでいる。Although the structure of the conductor part is porous, the pore diameter of one bore is approximately several micrometers, and there is almost no practical difference in conduction resistance compared to a dense material, so it is not suitable for use as an electrical circuit. This prevents an undesirable increase in wiring resistance.
［実施例コ 本発明の実施例を示す。[Example code] An example of the present invention is shown.
低温焼成セラミック基板はＣａ０−ＡＩ□０３−８ｉ０
２−Ｂ２０．系ガラスとアルミナ粉の混合物を用いた。Low temperature firing ceramic substrate is Ca0-AI□03-8i0
2-B20. A mixture of glass and alumina powder was used.
セラミックグリンシートは前記混合物と有機バイダー（
アクリル樹脂）、可塑剤（フタル酸ジブチル）、溶剤（
トルエンとブタノール混合）をボールミルで混合し、ド
クターブレード法にて厚み０．４ ｍｍのセラミックグ
リンシートを作製した。Ceramic green sheet is made of the above mixture and organic binder (
acrylic resin), plasticizer (dibutyl phthalate), solvent (
A mixture of toluene and butanol) was mixed in a ball mill, and a ceramic green sheet with a thickness of 0.4 mm was produced using a doctor blade method.
導体ペーストは第１表に示したそれぞれの金属成分の金
属粉末と有機バインダー（エチルセルロース、またはア
クリル樹脂）と溶剤（テレピネオール）の混合物を三本
ロールでよく混合混練して作製した。The conductor paste was prepared by thoroughly mixing and kneading a mixture of metal powder of each metal component shown in Table 1, an organic binder (ethyl cellulose or acrylic resin), and a solvent (terpineol) using a three-roll roll.
スルホールは穴径０．３ｍｍφの大きさに金型を用いて
打ち抜き、導体ペーストをスクリン印刷法でスルホール
内に充填した。The through holes were punched out using a mold to have a hole diameter of 0.3 mm, and the through holes were filled with conductive paste using a screen printing method.
実施例１，２，３，４，５，７．８は内線配線用Ａｇ導
体ペーストを印刷し、また外部に出るセラミックグリン
シート上には外部配線用Ａｇ−Ｐｄベーストを印刷した
。第１図に示したように、こうして作製した配線印刷と
スルホール内に導体が充填されたセラミックグリンシー
トを第１層とし、２，３層はスルホールのないセラミッ
クグリンシートとして、この３枚を加熱圧着して積層し
た。次いで、空気雰囲気中の９００℃で焼成してセラミ
ック多層回路基板とした。In Examples 1, 2, 3, 4, 5, and 7.8, an Ag conductor paste for internal wiring was printed, and an Ag-Pd base for external wiring was printed on the ceramic green sheet exposed to the outside. As shown in Figure 1, the first layer is the printed wiring and the ceramic green sheet with the conductor filled in the through holes, the second and third layers are ceramic green sheets without through holes, and these three sheets are heated. They were crimped and laminated. Next, it was fired at 900° C. in an air atmosphere to obtain a ceramic multilayer circuit board.
実施例６は実施例１と同様に作製したセラミックグリン
シートを用い、スルホール導体ベースｌ−とじてＣｕペ
ースト、また内部配線および外部配線はＣｕペーストを
印刷し、前述と同様に３枚を加熱圧着して積層し、加湿
Ｎ２を主体とした中性雰囲気の９００℃で焼成し多層回
路基板とした。In Example 6, ceramic green sheets prepared in the same manner as in Example 1 were used, and the through-hole conductor base L- was printed with Cu paste, and the internal wiring and external wiring were printed with Cu paste, and the three sheets were heat-pressed in the same manner as described above. They were laminated and fired at 900° C. in a neutral atmosphere mainly containing humidified N2 to obtain a multilayer circuit board.
こうして得た試験片を用いて信頼性試験として、温度サ
イクル試験（条件は一４０℃〜＋１５０℃、１００サイ
クル）を行って、導通抵抗の変化率、またセラミックお
よび導体周辺のクラック発生の有無を調べた。その結果
を第１表に示した。A temperature cycle test (conditions: -40°C to +150°C, 100 cycles) was performed as a reliability test using the test piece obtained in this way, and the rate of change in conduction resistance and the presence or absence of cracks around the ceramic and conductor were evaluated. Examined. The results are shown in Table 1.
これに対して、比較のため（比較例１−３）、導体ペー
ストは第１表に示した金属塩溶液から還元剤を用いて金
属粉末を沈殿させる等の方法で作製された球状のそれぞ
れの金属成分の金属粉末を用い、そのほかは比較例１，
２は実施例１と、また比較例３は実施例６同様の作製方
法および試験方法で行った。その結果も第１表に示した
。On the other hand, for comparison (Comparative Examples 1-3), conductor pastes were prepared using spherical pastes prepared by precipitating metal powder from a metal salt solution shown in Table 1 using a reducing agent. Comparative Example 1 was used except for the use of metal powder as a metal component.
Comparative Example 2 was performed using the same manufacturing method and testing method as Example 6. The results are also shown in Table 1.
実施例の全ては導体周辺および導体中にクラックの発生
はなく、また、導通抵抗の変化率は±０．５％以下であ
った。一方比較例の全てはセラミック中にクラックが発
生し、それにより導通抵抗が２層以」１増大した。In all of the examples, no cracks occurred around or in the conductor, and the rate of change in conduction resistance was ±0.5% or less. On the other hand, in all of the comparative examples, cracks occurred in the ceramic, and as a result, the conduction resistance increased by 1'' for two or more layers.
なお、本発明はスルホールと必要な配線を有する１層の
回路基板であっても良いことは当然であり、スルホール
導体を形成する必要があるセラミック多層回路基板を作
製する全てに利用できる。It goes without saying that the present invention may be applied to a single-layer circuit board having through-holes and necessary wiring, and can be used for all productions of ceramic multilayer circuit boards that require the formation of through-hole conductors.
また、セラミックグリンシートの代わりにセラミック絶
縁体ペーストを用いて多層化する、いわゆる印刷積層多
層回路基板にも応用できる。It can also be applied to so-called printed laminated multilayer circuit boards that are multilayered using ceramic insulating paste instead of ceramic green sheets.
へ〇発明の効果
本発明によれば、スルホール導体およびその周辺にクラ
ックの発生のない高信頼性のセラミック多層回路基板を
低温焼成で得ることができた。Effects of the Invention According to the present invention, it was possible to obtain a highly reliable ceramic multilayer circuit board free of cracks in the through-hole conductors and their surroundings by firing at a low temperature.
第１図は本発明の１実施例を示すセラミック多層回路基
板の断面図
第２図はセラミック多層回路基板の工程のフローチャー
ト
ド・・セラミックグリンシート ２・・・スルホール
３・・・外層導体 ４・・・内層導体特許
出願人 鳴海製陶株式会社
第１図Fig. 1 is a cross-sectional view of a ceramic multilayer circuit board showing one embodiment of the present invention. Fig. 2 is a flowchart of the process of a ceramic multilayer circuit board...Ceramic green sheet 2...Through hole 3...Outer layer conductor 4. ...Inner layer conductor patent applicant Narumi Seito Co., Ltd. Figure 1
Claims (3)
金属成分と有機ビヒクルよりなるペーストで充填した後
、焼成して製造するセラミック多層回路基板において、
前記金属成分は重量比率で３０％以上の偏平状導体金属
粉末を含有するペーストからなることを特徴とするセラ
ミック多層回路基板。(1) Forming through holes in the ceramic green sheet,
A ceramic multilayer circuit board manufactured by filling with a paste consisting of a metal component and an organic vehicle and then firing it,
A ceramic multilayer circuit board, wherein the metal component is a paste containing flat conductive metal powder in a weight ratio of 30% or more.
、Ｐｄ、Ｐｔ、およびＣｕの少なくとも１種以上からな
ることを特徴とする特許請求の範囲第１項記載のセラミ
ック多層回路基板。(2) The metal component of the paste filling the through holes is Ag.
The ceramic multilayer circuit board according to claim 1, characterized in that the ceramic multilayer circuit board is made of at least one of Pd, Pt, and Cu.
ンシートは８００℃〜１０００℃で焼成したことを特徴
とする特許請求の範囲第１項記載のセラミック多層回路
基板。(3) The ceramic multilayer circuit board according to claim 1, wherein the ceramic green sheet with the through holes filled with paste is fired at 800°C to 1000°C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29714987A JPH01138793A (en) | 1987-11-25 | 1987-11-25 | Ceramic multilayer circuit substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29714987A JPH01138793A (en) | 1987-11-25 | 1987-11-25 | Ceramic multilayer circuit substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01138793A true JPH01138793A (en) | 1989-05-31 |
| JPH0530317B2 JPH0530317B2 (en) | 1993-05-07 |
Family
ID=17842835
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29714987A Granted JPH01138793A (en) | 1987-11-25 | 1987-11-25 | Ceramic multilayer circuit substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01138793A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5723073A (en) * | 1995-03-30 | 1998-03-03 | Sumitomo Metal (Smi) Electronics Devices Inc. | Conductive paste containing 2-tetradecanol and ceramic circuit substrate using the same |
| JP2009033152A (en) * | 2007-07-03 | 2009-02-12 | Ngk Insulators Ltd | Ceramic structure, and manufacturing method thereof |
| EP1981320A4 (en) * | 2006-01-23 | 2011-03-02 | Hitachi Metals Ltd | CONDUCTIVE PASTE, MULTILAYER CERAMIC SUBSTRATE, AND METHOD FOR MANUFACTURING MULTILAYER CERAMIC SUBSTRATE |
-
1987
- 1987-11-25 JP JP29714987A patent/JPH01138793A/en active Granted
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5723073A (en) * | 1995-03-30 | 1998-03-03 | Sumitomo Metal (Smi) Electronics Devices Inc. | Conductive paste containing 2-tetradecanol and ceramic circuit substrate using the same |
| DE19611239B4 (en) * | 1995-03-30 | 2005-10-06 | Murata Manufacturing Co. Ltd. | Conductive paste |
| EP1981320A4 (en) * | 2006-01-23 | 2011-03-02 | Hitachi Metals Ltd | CONDUCTIVE PASTE, MULTILAYER CERAMIC SUBSTRATE, AND METHOD FOR MANUFACTURING MULTILAYER CERAMIC SUBSTRATE |
| US8501299B2 (en) | 2006-01-23 | 2013-08-06 | Hitachi Metals, Ltd. | Conductive paste, multilayer ceramic substrate and its production method |
| JP2009033152A (en) * | 2007-07-03 | 2009-02-12 | Ngk Insulators Ltd | Ceramic structure, and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0530317B2 (en) | 1993-05-07 |
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