JPH01139367U - - Google Patents
Info
- Publication number
- JPH01139367U JPH01139367U JP3578788U JP3578788U JPH01139367U JP H01139367 U JPH01139367 U JP H01139367U JP 3578788 U JP3578788 U JP 3578788U JP 3578788 U JP3578788 U JP 3578788U JP H01139367 U JPH01139367 U JP H01139367U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- metal plate
- substrate
- communication path
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims 2
- 229910000679 solder Inorganic materials 0.000 claims 1
- 239000000463 material Substances 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Description
第１図は本考案に係る配線板の要部における斜
視図、第２図は同じく要部の平面図、第３図は第
２図Ａ―Ａ線上における断面図、第４図は本考案
に係る配線板の別の実施例における平面図、第５
図は従来のこの種の配線板の斜視図、第６図は同
じく要部の断面図である。
１……基板、１０１……金属板、１０２……絶
縁層、２１……端子、２１１，２１２……挾持片
、４……連通路、５……接着材。
Fig. 1 is a perspective view of the main parts of the wiring board according to the present invention, Fig. 2 is a plan view of the main parts, Fig. 3 is a sectional view taken along line A-A in Fig. 2, and Fig. 4 is a perspective view of the main parts of the wiring board according to the present invention. Plan view of another embodiment of the wiring board, No. 5
The figure is a perspective view of a conventional wiring board of this type, and FIG. 6 is a sectional view of the main parts. DESCRIPTION OF SYMBOLS 1... Substrate, 101... Metal plate, 102... Insulating layer, 21... Terminal, 211, 212... Holding piece, 4... Communication path, 5... Adhesive material.
Claims (1)
体パターンを形成した基板と、先端部に間隔を隔
てて分岐させた一対の挾持片を有し、前記一対の
挾持片により前記基板を両面側から挾み込んで前
記金属板を前記導体パターンの少なくとも１つに
導通させる端子とを備える配線板において、前記
基板に両面側で連通する連通路を設け、前記連通
路に充填された接着材により、前記金属板側の前
記挾持片を前記基板に固着したことを特徴とする
配線板。 (2) 前記連通路は貫通孔でなり、前記貫通孔の
上に前記金属板側の前記挾持片を位置させたこと
を特徴とする実用新案登録請求の範囲第１項に記
載の配線板。 (3) 前記連通路は前記導体パターンの領域内に
開口する貫通孔でなり、前記貫通孔の上に前記金
属板側の前記挾持片を位置させたことを特徴とす
る実用新案登録請求の範囲第１項に記載の配線板
。 (4) 前記接着材は半田または導電性ペーストで
なることを特徴とする実用新案登録請求の範囲第
１項、第２項または第３項に記載の配線板。[Claims for Utility Model Registration] (1) A substrate having an insulating layer on a metal plate and a conductive pattern formed on the insulating layer, and a pair of clamping pieces branched at a distance from each other at the tip, A wiring board comprising a terminal that sandwiches the substrate from both sides by the pair of clamping pieces and connects the metal plate to at least one of the conductor patterns, wherein a communication path communicating with the substrate on both sides is provided. . A wiring board, wherein the clamping piece on the metal plate side is fixed to the substrate by an adhesive filled in the communication path. (2) The wiring board according to claim 1, wherein the communication path is a through hole, and the holding piece on the metal plate side is positioned above the through hole. (3) The scope of the utility model registration claim, characterized in that the communication path is a through hole opening in the area of the conductor pattern, and the holding piece on the metal plate side is positioned above the through hole. The wiring board according to item 1. (4) The wiring board according to claim 1, 2, or 3, wherein the adhesive is made of solder or conductive paste.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3578788U JPH01139367U (en) | 1988-03-17 | 1988-03-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3578788U JPH01139367U (en) | 1988-03-17 | 1988-03-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01139367U true JPH01139367U (en) | 1989-09-22 |
Family
ID=31262424
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3578788U Pending JPH01139367U (en) | 1988-03-17 | 1988-03-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01139367U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62108594A (en) * | 1985-11-06 | 1987-05-19 | 株式会社日立製作所 | Hybrid integrated circuit |
-
1988
- 1988-03-17 JP JP3578788U patent/JPH01139367U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62108594A (en) * | 1985-11-06 | 1987-05-19 | 株式会社日立製作所 | Hybrid integrated circuit |