JPH0325268U - - Google Patents
Info
- Publication number
- JPH0325268U JPH0325268U JP8605589U JP8605589U JPH0325268U JP H0325268 U JPH0325268 U JP H0325268U JP 8605589 U JP8605589 U JP 8605589U JP 8605589 U JP8605589 U JP 8605589U JP H0325268 U JPH0325268 U JP H0325268U
- Authority
- JP
- Japan
- Prior art keywords
- front edge
- wiring board
- printed wiring
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011888 foil Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims description 2
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図乃至第６図は本考案実施例を示す。第１
図は、要部切欠平面図、第２図は、同上側面図、
第３図は、拡大側面図、第４図は、第３図拡大底
面図、第５図は、プリント配線基板の熱湾曲状態
を示す要部拡大側面図、第６図は、プリント配線
基板の溶融半田との接触状態を示す要部拡大側面
図、第７図は、従来例の半田付時の様子を示す部
分拡大側面図である。
１……プリント基板、１′……前端縁、２……
切込み、３……Ｖ字溝、４……金属箔片。
1 to 6 show embodiments of the present invention. 1st
The figure is a cutaway plan view of the main part, Figure 2 is a side view of the same as above,
FIG. 3 is an enlarged side view, FIG. 4 is an enlarged bottom view of FIG. FIG. 7 is an enlarged side view of a main part showing a state of contact with molten solder, and FIG. 7 is a partially enlarged side view showing a state of soldering in a conventional example. 1...Printed circuit board, 1'...front edge, 2...
Cut, 3... V-shaped groove, 4... Metal foil piece.
Claims (1)
板の移送方向前端縁上面に、該前端縁と平行に数
条のＶ字溝を凹設すると共に、該プリント基板の
搬送コンベアにて保持される領域の前端両側境界
部に夫々切込みを設け、該プリント基板前端縁の
溶融半田と対面する面に上記両切込み間の範囲に
該プリント基板の進行方向に伸びる平行な複数の
金属箔片を添設することを特徴とするプリント配
線基板。 Several V-shaped grooves are recessed in the upper surface of the front edge of the printed wiring board in the transfer direction in the dip soldering device in parallel with the front edge, and both sides of the front edge of the area where the printed wiring board is held by the conveyor. A notch is provided at each boundary, and a plurality of parallel metal foil pieces extending in the direction of travel of the printed circuit board are attached to the front edge of the printed circuit board on the surface facing the molten solder in the range between the two notches. printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8605589U JPH0325268U (en) | 1989-07-20 | 1989-07-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8605589U JPH0325268U (en) | 1989-07-20 | 1989-07-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0325268U true JPH0325268U (en) | 1991-03-15 |
Family
ID=31635473
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8605589U Pending JPH0325268U (en) | 1989-07-20 | 1989-07-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0325268U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007227539A (en) * | 2006-02-22 | 2007-09-06 | Toyota Motor Corp | Jet soldering method |
-
1989
- 1989-07-20 JP JP8605589U patent/JPH0325268U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007227539A (en) * | 2006-02-22 | 2007-09-06 | Toyota Motor Corp | Jet soldering method |