JPH0114699B2 - - Google Patents

Info

Publication number
JPH0114699B2
JPH0114699B2 JP56190373A JP19037381A JPH0114699B2 JP H0114699 B2 JPH0114699 B2 JP H0114699B2 JP 56190373 A JP56190373 A JP 56190373A JP 19037381 A JP19037381 A JP 19037381A JP H0114699 B2 JPH0114699 B2 JP H0114699B2
Authority
JP
Japan
Prior art keywords
cleaning
processing
wafer
tank
treatment tank
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56190373A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5892225A (ja
Inventor
Tadayoshi Yoda
Mamoru Maeda
Mikio Takagi
Shuichi Myamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP56190373A priority Critical patent/JPS5892225A/ja
Publication of JPS5892225A publication Critical patent/JPS5892225A/ja
Publication of JPH0114699B2 publication Critical patent/JPH0114699B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0416—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels

Landscapes

  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP56190373A 1981-11-27 1981-11-27 ウエハ洗浄装置 Granted JPS5892225A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56190373A JPS5892225A (ja) 1981-11-27 1981-11-27 ウエハ洗浄装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56190373A JPS5892225A (ja) 1981-11-27 1981-11-27 ウエハ洗浄装置

Publications (2)

Publication Number Publication Date
JPS5892225A JPS5892225A (ja) 1983-06-01
JPH0114699B2 true JPH0114699B2 (de) 1989-03-14

Family

ID=16257092

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56190373A Granted JPS5892225A (ja) 1981-11-27 1981-11-27 ウエハ洗浄装置

Country Status (1)

Country Link
JP (1) JPS5892225A (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60110194A (ja) * 1983-11-18 1985-06-15 株式会社ニコン 基板の洗浄装置
JP4717631B2 (ja) * 2005-12-26 2011-07-06 富士通株式会社 ウエハ洗浄装置およびウエハの洗浄方法
JP2010074140A (ja) * 2008-08-22 2010-04-02 Toshiba Corp 基板処理装置および基板処理方法

Also Published As

Publication number Publication date
JPS5892225A (ja) 1983-06-01

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