JPH01157448U - - Google Patents
Info
- Publication number
- JPH01157448U JPH01157448U JP4651588U JP4651588U JPH01157448U JP H01157448 U JPH01157448 U JP H01157448U JP 4651588 U JP4651588 U JP 4651588U JP 4651588 U JP4651588 U JP 4651588U JP H01157448 U JPH01157448 U JP H01157448U
- Authority
- JP
- Japan
- Prior art keywords
- protrusion
- semiconductor package
- bent
- lead
- lead pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 11
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の半導体デバイスの正面断面図
。第２図は本考案の半導体デバイスの側面部のリ
ードピン拡大図。第３図は従来の半導体デバイス
の正面断面図。第４図は本考案の半導体デバイス
の正面断面図。第５図は本考案の半導体デバイス
の正面断面図。
１……半導体パツケージ、２……リードピン、
３……突起、４……微少突起、５……穴、６……
モールド部、７……突起、８……凹部、９……リ
ードピン、１１……微少突起、１２……突起、１
３……微少突起、１４……突起。
FIG. 1 is a front sectional view of the semiconductor device of the present invention. FIG. 2 is an enlarged view of the lead pins on the side surface of the semiconductor device of the present invention. FIG. 3 is a front sectional view of a conventional semiconductor device. FIG. 4 is a front sectional view of the semiconductor device of the present invention. FIG. 5 is a front sectional view of the semiconductor device of the present invention. 1...Semiconductor package, 2...Lead pin,
3... Protrusion, 4... Minute protrusion, 5... Hole, 6...
Mold part, 7... Protrusion, 8... Recess, 9... Lead pin, 11... Minute protrusion, 12... Protrusion, 1
3...Minute protrusion, 14...Protrusion.
Claims (1)
記半導体パツケージの裏面内方向に折曲した半導
体デバイスにおいて、 前記リードピン折曲部内方向に位置する半導体
パツケージにリードピンの折曲形状に沿つて突起
を設けるとともに、前記突起に少なくとも１ケの
微少突起を設け、前記リードピンの微少突起に対
応する位置に穴を開けることを特徴とする半導体
デバイス。[Claims for Utility Model Registration] In a semiconductor device in which lead pins extending from a semiconductor package are bent toward the inside of the back surface of the semiconductor package, the semiconductor package located inside the lead pin bent portion is bent along the bent shape of the lead pins. A semiconductor device characterized in that a protrusion is provided on the lead pin, at least one minute protrusion is provided on the protrusion, and a hole is formed at a position corresponding to the minute protrusion of the lead pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4651588U JPH01157448U (en) | 1988-04-06 | 1988-04-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4651588U JPH01157448U (en) | 1988-04-06 | 1988-04-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01157448U true JPH01157448U (en) | 1989-10-30 |
Family
ID=31272784
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4651588U Pending JPH01157448U (en) | 1988-04-06 | 1988-04-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01157448U (en) |
-
1988
- 1988-04-06 JP JP4651588U patent/JPH01157448U/ja active Pending