JPH01157463U - - Google Patents
Info
- Publication number
- JPH01157463U JPH01157463U JP4706688U JP4706688U JPH01157463U JP H01157463 U JPH01157463 U JP H01157463U JP 4706688 U JP4706688 U JP 4706688U JP 4706688 U JP4706688 U JP 4706688U JP H01157463 U JPH01157463 U JP H01157463U
- Authority
- JP
- Japan
- Prior art keywords
- thermally conductive
- conductive pattern
- hybrid
- generating component
- heat generating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図は本考案ハイブリツドＩＣの一実施例を
示す斜視図、第２図は第１図の−線に沿う断
面図、第３図は従来の放熱構造の一例を示す断面
図である。
１０はハイブリツドＩＣ、１１は親基板、１４
は発熱部品、１５は足ピン、１６は銅箔パターン
である。
FIG. 1 is a perspective view showing an embodiment of the hybrid IC of the present invention, FIG. 2 is a sectional view taken along the line -- in FIG. 1, and FIG. 3 is a sectional view showing an example of a conventional heat dissipation structure. 10 is a hybrid IC, 11 is a parent board, 14
15 is a heat generating component, 15 is a leg pin, and 16 is a copper foil pattern.
Claims (1)
熱伝導性パターンを形成すると共に該熱伝導性パ
ターンを足ピンに接続し、上記発熱部品の熱を上
記熱伝導性パターン及び足ピンを介して放熱する
様にしたことを特徴とするハイブリツドＩＣ。 A thermally conductive pattern is formed at the heat generating component mounting position on the hybrid IC board, and the thermally conductive pattern is connected to the foot pin, so that the heat of the heat generating component is radiated through the thermally conductive pattern and the foot pin. A hybrid IC characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4706688U JPH01157463U (en) | 1988-04-07 | 1988-04-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4706688U JPH01157463U (en) | 1988-04-07 | 1988-04-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01157463U true JPH01157463U (en) | 1989-10-30 |
Family
ID=31273297
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4706688U Pending JPH01157463U (en) | 1988-04-07 | 1988-04-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01157463U (en) |
-
1988
- 1988-04-07 JP JP4706688U patent/JPH01157463U/ja active Pending