JPH01157464U - - Google Patents
Info
- Publication number
- JPH01157464U JPH01157464U JP4708288U JP4708288U JPH01157464U JP H01157464 U JPH01157464 U JP H01157464U JP 4708288 U JP4708288 U JP 4708288U JP 4708288 U JP4708288 U JP 4708288U JP H01157464 U JPH01157464 U JP H01157464U
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- notch
- corner
- molded
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000004020 conductor Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図ａ及びｂはそれぞれ本考案の一実施例の
平面図及び断面図、第２図は従来例の平面図であ
る。 １……絶縁性基板、２……切欠き、３……導体
パターン、４……半導体部品、５……クリツプ端
子、６……樹脂封止体、７……傾斜部。
平面図及び断面図、第２図は従来例の平面図であ
る。 １……絶縁性基板、２……切欠き、３……導体
パターン、４……半導体部品、５……クリツプ端
子、６……樹脂封止体、７……傾斜部。
Claims (1)
- 絶縁性基板とその両面に搭載された電子部品を
樹脂でモールドしてなる混成集積回路装置におい
て、前記絶縁性基板の一角に切欠きを有すること
を特徴とする混成集積回路。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4708288U JPH01157464U (ja) | 1988-04-06 | 1988-04-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4708288U JPH01157464U (ja) | 1988-04-06 | 1988-04-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01157464U true JPH01157464U (ja) | 1989-10-30 |
Family
ID=31273312
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4708288U Pending JPH01157464U (ja) | 1988-04-06 | 1988-04-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01157464U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003078222A (ja) * | 2001-08-31 | 2003-03-14 | Mitsumi Electric Co Ltd | 電子機器 |
-
1988
- 1988-04-06 JP JP4708288U patent/JPH01157464U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003078222A (ja) * | 2001-08-31 | 2003-03-14 | Mitsumi Electric Co Ltd | 電子機器 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH01157464U (ja) | ||
| JPS6186970U (ja) | ||
| JPS62170646U (ja) | ||
| JPS59127212U (ja) | 電気部品の端子取付装置 | |
| JPS5952665U (ja) | 混成集積回路 | |
| JPS6052656U (ja) | 回路基板 | |
| JPH03106758U (ja) | ||
| JPH0231149U (ja) | ||
| JPS6416640U (ja) | ||
| JPS60144272U (ja) | 混成集積回路装置 | |
| JPS6355445U (ja) | ||
| JPH01140899U (ja) | ||
| JPH03102753U (ja) | ||
| JPS63152272U (ja) | ||
| JPS60174253U (ja) | 混成集積回路装置 | |
| JPS647770U (ja) | ||
| JPS61146977U (ja) | ||
| JPH0379444U (ja) | ||
| JPS63136378U (ja) | ||
| JPS58182438U (ja) | 半導体装置 | |
| JPH0442743U (ja) | ||
| JPS5817726U (ja) | キ−回路基板 | |
| JPS6138943U (ja) | 混成集積回路 | |
| JPH0320448U (ja) | ||
| JPS63180936U (ja) |