JPH01160835U - - Google Patents
Info
- Publication number
- JPH01160835U JPH01160835U JP1988048629U JP4862988U JPH01160835U JP H01160835 U JPH01160835 U JP H01160835U JP 1988048629 U JP1988048629 U JP 1988048629U JP 4862988 U JP4862988 U JP 4862988U JP H01160835 U JPH01160835 U JP H01160835U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- length
- input
- microwave semiconductor
- basic unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
- H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
Description
第１図はこの考案の一実施例であるマイクロ波
半導体装置の概略構成を示す平面図、第２図は第
１図の電気的等価回路の回路図、第３図は第１図
または第２図の各部の出力波形図、第４図、第５
図は従来のマイクロ波半導体装置の平面図および
その電気的等価回路図、第６図は従来の第４図ま
たは第５図の各部の出力波形図である。 図において、１は半導体能動素子、２〜６は基
本単位セル、７〜１１は入力側接続ワイヤ、１２
〜１６は出力側接続ワイヤ、１７は入力側信号線
、１８は出力側信号線、１９，２０は入出力に対
する電気的基準点を示す。なお、図中、同一符号
は同一、または相当部分を示す。
半導体装置の概略構成を示す平面図、第２図は第
１図の電気的等価回路の回路図、第３図は第１図
または第２図の各部の出力波形図、第４図、第５
図は従来のマイクロ波半導体装置の平面図および
その電気的等価回路図、第６図は従来の第４図ま
たは第５図の各部の出力波形図である。 図において、１は半導体能動素子、２〜６は基
本単位セル、７〜１１は入力側接続ワイヤ、１２
〜１６は出力側接続ワイヤ、１７は入力側信号線
、１８は出力側信号線、１９，２０は入出力に対
する電気的基準点を示す。なお、図中、同一符号
は同一、または相当部分を示す。
Claims (1)
- 大電力を得るために基本単位セルを並列動作さ
せた能動素子の各セルの入力端もしくは出力端と
、給電点もしくは負荷点の電気長が目的の周波数
でそれぞれ等しくなるように能動素子と回路を接
続するワイヤの長さを決定したことを特徴とする
マイクロ波半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988048629U JPH01160835U (ja) | 1988-04-11 | 1988-04-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988048629U JPH01160835U (ja) | 1988-04-11 | 1988-04-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01160835U true JPH01160835U (ja) | 1989-11-08 |
Family
ID=31274769
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988048629U Pending JPH01160835U (ja) | 1988-04-11 | 1988-04-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01160835U (ja) |
-
1988
- 1988-04-11 JP JP1988048629U patent/JPH01160835U/ja active Pending