JPH01162244U - - Google Patents

Info

Publication number
JPH01162244U
JPH01162244U JP1988055508U JP5550888U JPH01162244U JP H01162244 U JPH01162244 U JP H01162244U JP 1988055508 U JP1988055508 U JP 1988055508U JP 5550888 U JP5550888 U JP 5550888U JP H01162244 U JPH01162244 U JP H01162244U
Authority
JP
Japan
Prior art keywords
semiconductor wafer
cutting body
semiconductor
cutting
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988055508U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988055508U priority Critical patent/JPH01162244U/ja
Publication of JPH01162244U publication Critical patent/JPH01162244U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages

Landscapes

  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Description

【図面の簡単な説明】
第１図はこの考案の一実施例の半導体製造装置
の正面図、第２図はその動作説明用の側面図、第
３図は切削加工によつて得られた半導体ペレツト
の断面図、第４図は上記半導体ペレツトを用いて
組み立てたＤＨＤ型ダイオードの断面図、第５図
は同じくリードレス型ダイオードの断面図である
。第６図は従来のＤＨＤ型ダイオードの断面図、
第７図はその半導体ペレツトの断面図である。 １３……水平動作台、１４……昇降台、１５…
…半導体ウエーハ、１６……切削体。

Claims (1)

    【実用新案登録請求の範囲】
  1. バンプ電極が形成された半導体ウエーハを載置
    固定する台の上方に、周囲に切削刃を備えた切削
    体を配置し、前記半導体ウエーハと切削体とを相
    対的に水平方向および上下方向に移動可能に構成
    してなる半導体製造装置。
JP1988055508U 1988-04-25 1988-04-25 Pending JPH01162244U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988055508U JPH01162244U (ja) 1988-04-25 1988-04-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988055508U JPH01162244U (ja) 1988-04-25 1988-04-25

Publications (1)

Publication Number Publication Date
JPH01162244U true JPH01162244U (ja) 1989-11-10

Family

ID=31281410

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988055508U Pending JPH01162244U (ja) 1988-04-25 1988-04-25

Country Status (1)

Country Link
JP (1) JPH01162244U (ja)

Similar Documents

Publication Publication Date Title
JPH01162244U (ja)
JPS6333907U (ja)
JPS54128274A (en) Resin-sealed semiconductor device
JPS6251742U (ja)
JPS61106038U (ja)
JPH0468528U (ja)
JPS6373931U (ja)
JPS62140741U (ja)
JPS6166947U (ja)
JPH0351849U (ja)
JPS6361149U (ja)
JPH0173947U (ja)
JPS5240974A (en) Package for semiconductor chips
JPS62122359U (ja)
JPS62178531U (ja)
JPH02122068U (ja)
JPS62131389U (ja)
JPH0392040U (ja)
JPS61195055U (ja)
JPH0158936U (ja)
JPS61102045U (ja)
JPH045637U (ja)
JPS6195715U (ja)
JPS62177048U (ja)
JPH0291356U (ja)