JPH0158936U - - Google Patents
Info
- Publication number
- JPH0158936U JPH0158936U JP15437587U JP15437587U JPH0158936U JP H0158936 U JPH0158936 U JP H0158936U JP 15437587 U JP15437587 U JP 15437587U JP 15437587 U JP15437587 U JP 15437587U JP H0158936 U JPH0158936 U JP H0158936U
- Authority
- JP
- Japan
- Prior art keywords
- curing
- resin
- kneading
- filler
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 claims description 2
- 229920001187 thermosetting polymer Polymers 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 238000005538 encapsulation Methods 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 claims 1
- 239000000945 filler Substances 0.000 claims 1
- 238000004898 kneading Methods 0.000 claims 1
- 239000002075 main ingredient Substances 0.000 claims 1
- 239000008188 pellet Substances 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例を示す断面図、第２
図、第４図は本考案に係る樹脂タブレツトを製造
する装置を示す構成図、第３図は従来の樹脂タブ
レツトを示す断面図である。 １……タブレツト、２……熱硬化性樹脂配合物
。
図、第４図は本考案に係る樹脂タブレツトを製造
する装置を示す構成図、第３図は従来の樹脂タブ
レツトを示す断面図である。 １……タブレツト、２……熱硬化性樹脂配合物
。
Claims (1)
- エポキシ樹脂、硬化剤、充填剤を主成分とし、
これらを加熱混練して硬化させてなる熱硬化性樹
脂配合物を主体としてペレツト状に成形したこと
を特徴とする半導体封止用樹脂タブレツト。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15437587U JPH0158936U (ja) | 1987-10-08 | 1987-10-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15437587U JPH0158936U (ja) | 1987-10-08 | 1987-10-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0158936U true JPH0158936U (ja) | 1989-04-13 |
Family
ID=31431044
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15437587U Pending JPH0158936U (ja) | 1987-10-08 | 1987-10-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0158936U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH035103A (ja) * | 1989-06-01 | 1991-01-10 | Hitachi Ltd | タブレットの製造装置 |
-
1987
- 1987-10-08 JP JP15437587U patent/JPH0158936U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH035103A (ja) * | 1989-06-01 | 1991-01-10 | Hitachi Ltd | タブレットの製造装置 |