JPH0351849U - - Google Patents

Info

Publication number
JPH0351849U
JPH0351849U JP1989112645U JP11264589U JPH0351849U JP H0351849 U JPH0351849 U JP H0351849U JP 1989112645 U JP1989112645 U JP 1989112645U JP 11264589 U JP11264589 U JP 11264589U JP H0351849 U JPH0351849 U JP H0351849U
Authority
JP
Japan
Prior art keywords
semiconductor device
land portion
arrangement
pellet
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989112645U
Other languages
English (en)
Other versions
JPH0741164Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989112645U priority Critical patent/JPH0741164Y2/ja
Publication of JPH0351849U publication Critical patent/JPH0351849U/ja
Application granted granted Critical
Publication of JPH0741164Y2 publication Critical patent/JPH0741164Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図は、本考案の一実施例に係るトランジス
タアレイの部分断面斜視図、第２図は、同じくト
ランジスタアレイにおけるリードフレームの配置
を示す平面図、第３図は、従来例のトランジスタ
アレイの部分断面斜視図、第４図は、同じく従来
例のトランジスタアレイにおけるリードフレーム
の配置を示す平面図である。 １……ペレツト、２……リードフレーム、２ａ
……ランド部、５……パツケージ。

Claims (1)

  1. 【実用新案登録請求の範囲】 独立した半導体素子を構成するペレツトを複数
    一組としてパツケージに封止した半導体装置にお
    いて、 各ペレツトをダイボンデイングするリードフレ
    ームのランド部が、配置中央側のものが端部のラ
    ンド部に比べて熱容量の大きい形状に形成された
    ことを特徴とする半導体装置。
JP1989112645U 1989-09-26 1989-09-26 半導体装置 Expired - Lifetime JPH0741164Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989112645U JPH0741164Y2 (ja) 1989-09-26 1989-09-26 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989112645U JPH0741164Y2 (ja) 1989-09-26 1989-09-26 半導体装置

Publications (2)

Publication Number Publication Date
JPH0351849U true JPH0351849U (ja) 1991-05-20
JPH0741164Y2 JPH0741164Y2 (ja) 1995-09-20

Family

ID=31661088

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989112645U Expired - Lifetime JPH0741164Y2 (ja) 1989-09-26 1989-09-26 半導体装置

Country Status (1)

Country Link
JP (1) JPH0741164Y2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012108011A1 (ja) * 2011-02-09 2012-08-16 三菱電機株式会社 パワー半導体モジュール

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2637285B1 (en) 2010-11-02 2020-04-01 Mitsubishi Electric Corporation Electric power steering power module and electric power steering drive control device employing same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63151055A (ja) * 1986-12-16 1988-06-23 Matsushita Electronics Corp 複合型半導体装置
JPS63255953A (ja) * 1987-04-13 1988-10-24 Sanken Electric Co Ltd 絶縁物封止型回路装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63151055A (ja) * 1986-12-16 1988-06-23 Matsushita Electronics Corp 複合型半導体装置
JPS63255953A (ja) * 1987-04-13 1988-10-24 Sanken Electric Co Ltd 絶縁物封止型回路装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012108011A1 (ja) * 2011-02-09 2012-08-16 三菱電機株式会社 パワー半導体モジュール
JP5669866B2 (ja) * 2011-02-09 2015-02-18 三菱電機株式会社 パワー半導体モジュール
US9129949B2 (en) 2011-02-09 2015-09-08 Mitsubishi Electric Corporation Power semiconductor module

Also Published As

Publication number Publication date
JPH0741164Y2 (ja) 1995-09-20

Similar Documents

Publication Publication Date Title
JPH0369248U (ja)
JPH0477261U (ja)
JPS61144650U (ja)
JPH01129849U (ja)
JPS61190146U (ja)
JPS6336052U (ja)
JPH01113346U (ja)
JPH0468528U (ja)
JPH0341942U (ja)
JPH0224547U (ja)
JPS6361149U (ja)
JPS6270449U (ja)
JPH01129851U (ja)
JPH044767U (ja)
JPH0267640U (ja)
JPH01104721U (ja)
JPH03124662U (ja)
JPH0252456U (ja)
JPS6387838U (ja)
JPS63201342U (ja)
JPS6450442U (ja)
JPH0482862U (ja)
JPS6373943U (ja)
JPS6343432U (ja)
JPH0217856U (ja)