JPH01163111U - - Google Patents
Info
- Publication number
- JPH01163111U JPH01163111U JP5896888U JP5896888U JPH01163111U JP H01163111 U JPH01163111 U JP H01163111U JP 5896888 U JP5896888 U JP 5896888U JP 5896888 U JP5896888 U JP 5896888U JP H01163111 U JPH01163111 U JP H01163111U
- Authority
- JP
- Japan
- Prior art keywords
- plunger
- pot
- resin molding
- molding device
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 238000000465 moulding Methods 0.000 claims description 4
- 238000004891 communication Methods 0.000 claims description 2
- 238000007796 conventional method Methods 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例にかかる樹脂モール
ド装置の一部破断斜視図、第２図イ，ロはそれぞ
れ同実施例の樹脂モールド装置の動作を説明図、
第３図は従来の樹脂モールド装置の金型を断面で
示す側面図、第４図は従来の問題点を示す半導体
ペレツトの断面図である。１……上金型、２……
下金型、７……ポツト、８……樹脂タブレツト、
９……プランジヤ、１１……テーパ溝（連通部）
、１２……開閉体（開閉手段）。
FIG. 1 is a partially cutaway perspective view of a resin molding device according to an embodiment of the present invention, and FIGS.
FIG. 3 is a side view showing a cross section of a mold of a conventional resin molding apparatus, and FIG. 4 is a cross sectional view of a semiconductor pellet showing problems of the conventional method. 1... Upper mold, 2...
Lower mold, 7...pot, 8...resin tablet,
9... Plunger, 11... Taper groove (communication part)
, 12...Opening/closing body (opening/closing means).
Claims (1)
樹脂タブレツトをプランジヤにて押圧してキヤビ
テイに圧送する樹脂モールド装置において、 上記プランジヤにプランジヤの両端を連通する
連通部を設けると共に、プランジヤの外端側に連
通部の開閉手段を設けたことを特徴とする樹脂モ
ールド装置。[Scope of Claim for Utility Model Registration] In a resin molding device in which a pot is formed in a mold and a resin tablet placed in the pot is pressed by a plunger to be force-fed to a cavity, a communication line that communicates both ends of the plunger with the plunger. What is claimed is: 1. A resin molding device, characterized in that a plunger is provided with a connecting portion and an opening/closing means for a communicating portion is provided on an outer end side of a plunger.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5896888U JPH01163111U (en) | 1988-04-30 | 1988-04-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5896888U JPH01163111U (en) | 1988-04-30 | 1988-04-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01163111U true JPH01163111U (en) | 1989-11-14 |
Family
ID=31284759
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5896888U Pending JPH01163111U (en) | 1988-04-30 | 1988-04-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01163111U (en) |
-
1988
- 1988-04-30 JP JP5896888U patent/JPH01163111U/ja active Pending