JPH01163334U - - Google Patents
Info
- Publication number
- JPH01163334U JPH01163334U JP1988060199U JP6019988U JPH01163334U JP H01163334 U JPH01163334 U JP H01163334U JP 1988060199 U JP1988060199 U JP 1988060199U JP 6019988 U JP6019988 U JP 6019988U JP H01163334 U JPH01163334 U JP H01163334U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- chip
- electronic component
- type electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Wire Bonding (AREA)
Description
第１図は本考案の一実施例を示す断面図、第２
図は従来の混成集積回路装置を示す断面図である
。
１１，２１……セラミツク基板、１２，２２…
…Ａｇ―Ｐｄ厚膜パターン、１３，２３……Ａｇ
ペースト、１４，２４……半導体チツプ、１５，
２５……セラミツクチツプコンデンサ、１５ｅ１
，１５ｅ２……電極、１６，２６……ボンデイン
グ線、１７，２７……シリコーン樹脂、１８，２
８……外部リード端子、１９，２９……エポキシ
樹脂、３０……はんだ。
Fig. 1 is a sectional view showing one embodiment of the present invention;
The figure is a sectional view showing a conventional hybrid integrated circuit device. 11, 21... Ceramic substrate, 12, 22...
...Ag-Pd thick film pattern, 13,23...Ag
Paste, 14, 24...Semiconductor chip, 15,
25... Ceramic chip capacitor, 15e1
, 15e2... Electrode, 16, 26... Bonding wire, 17, 27... Silicone resin, 18, 2
8...External lead terminal, 19, 29...Epoxy resin, 30...Solder.
Claims (1)
電子部品が搭載されてなる混成集積回路装置にお
いて、前記チツプ型電子部品の少なくとも一つの
電極は前記混成集積回路基板から離れた方の表面
に亘つて導電体を有し、その導電体と半導体チツ
プの外部端子とがボンデイング線で接続されてい
ることを特徴とする混成集積回路装置。 In a hybrid integrated circuit device in which a semiconductor chip and a chip-type electronic component are mounted on a hybrid integrated circuit board, at least one electrode of the chip-type electronic component is a conductor over a surface remote from the hybrid integrated circuit board. 1. A hybrid integrated circuit device having a conductor and an external terminal of a semiconductor chip connected by a bonding wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988060199U JPH01163334U (en) | 1988-05-06 | 1988-05-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988060199U JPH01163334U (en) | 1988-05-06 | 1988-05-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01163334U true JPH01163334U (en) | 1989-11-14 |
Family
ID=31285918
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988060199U Pending JPH01163334U (en) | 1988-05-06 | 1988-05-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01163334U (en) |
-
1988
- 1988-05-06 JP JP1988060199U patent/JPH01163334U/ja active Pending
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