JPH01163334U - - Google Patents

Info

Publication number
JPH01163334U
JPH01163334U JP1988060199U JP6019988U JPH01163334U JP H01163334 U JPH01163334 U JP H01163334U JP 1988060199 U JP1988060199 U JP 1988060199U JP 6019988 U JP6019988 U JP 6019988U JP H01163334 U JPH01163334 U JP H01163334U
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
chip
electronic component
type electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988060199U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988060199U priority Critical patent/JPH01163334U/ja
Publication of JPH01163334U publication Critical patent/JPH01163334U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例を示す断面図、第２
図は従来の混成集積回路装置を示す断面図である
。 １１，２１……セラミツク基板、１２，２２…
…Ａｇ―Ｐｄ厚膜パターン、１３，２３……Ａｇ
ペースト、１４，２４……半導体チツプ、１５，
２５……セラミツクチツプコンデンサ、１５ｅ１
，１５ｅ２……電極、１６，２６……ボンデイン
グ線、１７，２７……シリコーン樹脂、１８，２
８……外部リード端子、１９，２９……エポキシ
樹脂、３０……はんだ。

Claims (1)

    【実用新案登録請求の範囲】
  1. 混成集積回路基板に半導体チツプ及びチツプ型
    電子部品が搭載されてなる混成集積回路装置にお
    いて、前記チツプ型電子部品の少なくとも一つの
    電極は前記混成集積回路基板から離れた方の表面
    に亘つて導電体を有し、その導電体と半導体チツ
    プの外部端子とがボンデイング線で接続されてい
    ることを特徴とする混成集積回路装置。
JP1988060199U 1988-05-06 1988-05-06 Pending JPH01163334U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988060199U JPH01163334U (ja) 1988-05-06 1988-05-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988060199U JPH01163334U (ja) 1988-05-06 1988-05-06

Publications (1)

Publication Number Publication Date
JPH01163334U true JPH01163334U (ja) 1989-11-14

Family

ID=31285918

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988060199U Pending JPH01163334U (ja) 1988-05-06 1988-05-06

Country Status (1)

Country Link
JP (1) JPH01163334U (ja)

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