JPH01163339U - - Google Patents

Info

Publication number
JPH01163339U
JPH01163339U JP1988059136U JP5913688U JPH01163339U JP H01163339 U JPH01163339 U JP H01163339U JP 1988059136 U JP1988059136 U JP 1988059136U JP 5913688 U JP5913688 U JP 5913688U JP H01163339 U JPH01163339 U JP H01163339U
Authority
JP
Japan
Prior art keywords
filler
integrated circuit
net
cooling structure
mesh
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1988059136U
Other languages
Japanese (ja)
Other versions
JPH0621250Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988059136U priority Critical patent/JPH0621250Y2/en
Publication of JPH01163339U publication Critical patent/JPH01163339U/ja
Application granted granted Critical
Publication of JPH0621250Y2 publication Critical patent/JPH0621250Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図ａは本考案の集積回路素子の冷却構造の
実施例を示す断面図、ｂは網体部分の平面図、第
２図ａ，ｂは従来のベローズ方式とピストン方式
を示す断面図である。 図において、２は集積回路素子、３はプリント
板、４はコールドプレート、６はベローズ、１１
はピストン、８は熱伝導性充填材、１５は網体、
１６は取付金具である。 Fig. 1a is a sectional view showing an embodiment of the cooling structure for integrated circuit elements of the present invention, b is a plan view of the mesh portion, and Figs. 2a and b are sectional views showing the conventional bellows type and piston type. be. In the figure, 2 is an integrated circuit element, 3 is a printed board, 4 is a cold plate, 6 is a bellows, 11
is a piston, 8 is a thermally conductive filler, 15 is a mesh body,
16 is a mounting bracket.

Claims (1)

【実用新案登録請求の範囲】 (1) プリント板３側の集積回路素子２とコール
ドプレート４側の伸縮可能な冷却部材（６又は１
１）の間に、熱伝導性充填材８を充填する熱伝導
冷却構造において、 コールドプレート４側に網体１５を取付金具１
６により装着し、 該網体１５を充填材８の間に介装することを特
徴とする集積回路素子の冷却構造。 (2) 上記網体１５は絶縁性を有し、目の粗さは
充填材８の熱抵抗を大きくしない程度である請求
項１記載の集積回路素子の冷却構造。[Claims for Utility Model Registration] (1) The integrated circuit element 2 on the printed board 3 side and the expandable cooling member (6 or 1
1) In a heat conduction cooling structure in which a heat conductive filler 8 is filled between
6, and the net 15 is interposed between the filler 8. (2) The cooling structure for an integrated circuit device according to claim 1, wherein the net (15) has an insulating property, and the mesh has a roughness that does not increase the thermal resistance of the filler (8).
JP1988059136U 1988-04-30 1988-04-30 Cooling structure for integrated circuit devices Expired - Lifetime JPH0621250Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988059136U JPH0621250Y2 (en) 1988-04-30 1988-04-30 Cooling structure for integrated circuit devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988059136U JPH0621250Y2 (en) 1988-04-30 1988-04-30 Cooling structure for integrated circuit devices

Publications (2)

Publication Number Publication Date
JPH01163339U true JPH01163339U (en) 1989-11-14
JPH0621250Y2 JPH0621250Y2 (en) 1994-06-01

Family

ID=31284922

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988059136U Expired - Lifetime JPH0621250Y2 (en) 1988-04-30 1988-04-30 Cooling structure for integrated circuit devices

Country Status (1)

Country Link
JP (1) JPH0621250Y2 (en)

Also Published As

Publication number Publication date
JPH0621250Y2 (en) 1994-06-01

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