JPH01163365U - - Google Patents

Info

Publication number
JPH01163365U
JPH01163365U JP1988058758U JP5875888U JPH01163365U JP H01163365 U JPH01163365 U JP H01163365U JP 1988058758 U JP1988058758 U JP 1988058758U JP 5875888 U JP5875888 U JP 5875888U JP H01163365 U JPH01163365 U JP H01163365U
Authority
JP
Japan
Prior art keywords
pattern
wire bonding
reinforcing
bonding position
wiring pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1988058758U
Other languages
Japanese (ja)
Other versions
JPH0739255Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988058758U priority Critical patent/JPH0739255Y2/en
Publication of JPH01163365U publication Critical patent/JPH01163365U/ja
Application granted granted Critical
Publication of JPH0739255Y2 publication Critical patent/JPH0739255Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structure Of Printed Boards (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は実施例の両面フレキシブル基板の要部
断面図、第２図は第１図に対応するＩＣ周辺の上
面図、第３図は別実施例の要部拡大図、第４図は
第３図に対応するＩＣ周辺の上面図である。 ２……配線パターン、４……補強パターン、５
……ＩＣ、７……ワイヤ。 Figure 1 is a cross-sectional view of the main parts of the double-sided flexible board of the embodiment, Figure 2 is a top view of the vicinity of the IC corresponding to Figure 1, Figure 3 is an enlarged view of the main parts of another embodiment, and Figure 4 is the main part of the double-sided flexible board of the embodiment. 3 is a top view of the vicinity of the IC corresponding to FIG. 3; FIG. 2... Wiring pattern, 4... Reinforcement pattern, 5
...IC, 7...Wire.

Claims (1)

【実用新案登録請求の範囲】 １ ＩＣをワイヤボンデイングによつて接続する
両面フレキシブルプリント基板において、ＩＣ搭
載面と反対側の面に配線パターンの各ワイヤボン
デイング位置を囲む大きさの補強パターンをＩＣ
搭載部に対応する位置に備え、この補強パターン
が多角形からかどをおとした形状であることを特
徴とするパターン構造。 ２ 補強パターンの形状が、配線パターンの各ワ
イヤボンデイング位置を中心とする所定距離を半
径とするすべての円の接線包絡線で示される形状
である請求第１項記載のパターン構造。[Claims for Utility Model Registration] 1. In a double-sided flexible printed circuit board on which ICs are connected by wire bonding, a reinforcing pattern of a size surrounding each wire bonding position of the wiring pattern is provided on the surface opposite to the IC mounting surface.
A pattern structure characterized in that the reinforcing pattern is provided at a position corresponding to the mounting part and has a polygonal shape with cut corners. 2. The pattern structure according to claim 1, wherein the reinforcing pattern has a shape represented by tangential envelopes of all circles whose radius is a predetermined distance from each wire bonding position of the wiring pattern.
JP1988058758U 1988-04-30 1988-04-30 Double-sided flexible board structure for wire bonding Expired - Lifetime JPH0739255Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988058758U JPH0739255Y2 (en) 1988-04-30 1988-04-30 Double-sided flexible board structure for wire bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988058758U JPH0739255Y2 (en) 1988-04-30 1988-04-30 Double-sided flexible board structure for wire bonding

Publications (2)

Publication Number Publication Date
JPH01163365U true JPH01163365U (en) 1989-11-14
JPH0739255Y2 JPH0739255Y2 (en) 1995-09-06

Family

ID=31284556

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988058758U Expired - Lifetime JPH0739255Y2 (en) 1988-04-30 1988-04-30 Double-sided flexible board structure for wire bonding

Country Status (1)

Country Link
JP (1) JPH0739255Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05118936A (en) * 1991-10-25 1993-05-14 Yamatake Honeywell Co Ltd Thin film diaphragm

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002033347A (en) * 2000-07-17 2002-01-31 Rohm Co Ltd Semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6020058A (en) * 1983-07-13 1985-02-01 Hitachi Chem Co Ltd Treatment method for heat collecting surface

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6020058A (en) * 1983-07-13 1985-02-01 Hitachi Chem Co Ltd Treatment method for heat collecting surface

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05118936A (en) * 1991-10-25 1993-05-14 Yamatake Honeywell Co Ltd Thin film diaphragm

Also Published As

Publication number Publication date
JPH0739255Y2 (en) 1995-09-06

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