JPH01165247U - - Google Patents

Info

Publication number
JPH01165247U
JPH01165247U JP1988061387U JP6138788U JPH01165247U JP H01165247 U JPH01165247 U JP H01165247U JP 1988061387 U JP1988061387 U JP 1988061387U JP 6138788 U JP6138788 U JP 6138788U JP H01165247 U JPH01165247 U JP H01165247U
Authority
JP
Japan
Prior art keywords
chip
printing elements
connection pad
insulating substrate
measurement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1988061387U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0711984Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988061387U priority Critical patent/JPH0711984Y2/ja
Publication of JPH01165247U publication Critical patent/JPH01165247U/ja
Application granted granted Critical
Publication of JPH0711984Y2 publication Critical patent/JPH0711984Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Electronic Switches (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP1988061387U 1988-05-10 1988-05-10 印字ヘッド Expired - Lifetime JPH0711984Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988061387U JPH0711984Y2 (ja) 1988-05-10 1988-05-10 印字ヘッド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988061387U JPH0711984Y2 (ja) 1988-05-10 1988-05-10 印字ヘッド

Publications (2)

Publication Number Publication Date
JPH01165247U true JPH01165247U (it) 1989-11-17
JPH0711984Y2 JPH0711984Y2 (ja) 1995-03-22

Family

ID=31287059

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988061387U Expired - Lifetime JPH0711984Y2 (ja) 1988-05-10 1988-05-10 印字ヘッド

Country Status (1)

Country Link
JP (1) JPH0711984Y2 (it)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH048556A (ja) * 1990-04-26 1992-01-13 Matsushita Electric Ind Co Ltd サーマルヘッドおよびその抵抗値トリミング法
JP2001301219A (ja) * 2000-04-19 2001-10-30 Rohm Co Ltd サーマルプリントヘッド

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH048556A (ja) * 1990-04-26 1992-01-13 Matsushita Electric Ind Co Ltd サーマルヘッドおよびその抵抗値トリミング法
JP2001301219A (ja) * 2000-04-19 2001-10-30 Rohm Co Ltd サーマルプリントヘッド

Also Published As

Publication number Publication date
JPH0711984Y2 (ja) 1995-03-22

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