JPH01169055U - - Google Patents
Info
- Publication number
- JPH01169055U JPH01169055U JP6528488U JP6528488U JPH01169055U JP H01169055 U JPH01169055 U JP H01169055U JP 6528488 U JP6528488 U JP 6528488U JP 6528488 U JP6528488 U JP 6528488U JP H01169055 U JPH01169055 U JP H01169055U
- Authority
- JP
- Japan
- Prior art keywords
- light
- emitting diode
- semiconductor device
- optically coupled
- receiving element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Description
第１図は本考案の一実施例の一部切欠き斜視図
、第２図は第１図の実施例に用いる発光ダイオー
ドの斜視図、第３図は従来の光結合半導体装置の
一例の一部切欠き斜視図、第４図は第３図の光結
合半導体装置に用いる発光ダイオードの斜視図で
ある。 １，１ａ…発光ダイオード、２…受光素子、３
…リード、４…ＦＥＴ、５…ボンデイングワイヤ
、６…外装樹脂、１１，１１ａ…電極面、１２…
長辺、１３…短辺。
、第２図は第１図の実施例に用いる発光ダイオー
ドの斜視図、第３図は従来の光結合半導体装置の
一例の一部切欠き斜視図、第４図は第３図の光結
合半導体装置に用いる発光ダイオードの斜視図で
ある。 １，１ａ…発光ダイオード、２…受光素子、３
…リード、４…ＦＥＴ、５…ボンデイングワイヤ
、６…外装樹脂、１１，１１ａ…電極面、１２…
長辺、１３…短辺。
Claims (1)
- 一対の入力端子間に加えられる入力信号により
動作する発光ダイオードと、該発光ダイオードの
発光エネルギを受光する受光素子とを備える光結
合半導体装置において、前記発光ダイオードは電
極面の長辺と短辺の比が少くとも５：３の長方形
である直方体をなし、前記発光ダイオードの前記
長辺側の面を前記受光素子と対向して配置するこ
とを特徴とする光結合半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6528488U JPH01169055U (ja) | 1988-05-17 | 1988-05-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6528488U JPH01169055U (ja) | 1988-05-17 | 1988-05-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01169055U true JPH01169055U (ja) | 1989-11-29 |
Family
ID=31290725
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6528488U Pending JPH01169055U (ja) | 1988-05-17 | 1988-05-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01169055U (ja) |
-
1988
- 1988-05-17 JP JP6528488U patent/JPH01169055U/ja active Pending