JPH01169072U - - Google Patents
Info
- Publication number
- JPH01169072U JPH01169072U JP1988065667U JP6566788U JPH01169072U JP H01169072 U JPH01169072 U JP H01169072U JP 1988065667 U JP1988065667 U JP 1988065667U JP 6566788 U JP6566788 U JP 6566788U JP H01169072 U JPH01169072 U JP H01169072U
- Authority
- JP
- Japan
- Prior art keywords
- layers
- multilayer wiring
- wiring structure
- insulating layers
- electrode layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
Description
第１図は本考案の多層配線構造の一実施例が適
用された密着形イメージセンサＳの平面図、第２
図は第１図の―線断面図、第３図は本考案の
多層配線構造の一実施例を示す図で第１図の―
線断面図、第４図は本考案の多層配線構造の第
２実施例を示す図、である。
１２，１６…配線層、１３，１５…絶縁層、１
４…アース電極層。
FIG. 1 is a plan view of a contact type image sensor S to which an embodiment of the multilayer wiring structure of the present invention is applied;
The figure is a cross-sectional view taken along the line ``-'' in FIG. 1, and FIG.
FIG. 4 is a cross-sectional view showing a second embodiment of the multilayer wiring structure of the present invention. 12, 16... Wiring layer, 13, 15... Insulating layer, 1
4...Earth electrode layer.
Claims (1)
に形成された多層配線構造において、上下に隣接
する配線層１２，１６の間に絶縁層１３，１５に
よつて挟まれたアース電極層１４が設けられてい
る多層配線構造。 In a multilayer wiring structure in which a plurality of wiring layers 12 and 16 are formed in multiple layers with insulating layers in between, a ground electrode layer 14 is sandwiched between vertically adjacent wiring layers 12 and 16 by insulating layers 13 and 15. A multilayer wiring structure with
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988065667U JPH01169072U (en) | 1988-05-18 | 1988-05-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988065667U JPH01169072U (en) | 1988-05-18 | 1988-05-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01169072U true JPH01169072U (en) | 1989-11-29 |
Family
ID=31291097
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988065667U Pending JPH01169072U (en) | 1988-05-18 | 1988-05-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01169072U (en) |
-
1988
- 1988-05-18 JP JP1988065667U patent/JPH01169072U/ja active Pending