JPH01169072U - - Google Patents

Info

Publication number
JPH01169072U
JPH01169072U JP1988065667U JP6566788U JPH01169072U JP H01169072 U JPH01169072 U JP H01169072U JP 1988065667 U JP1988065667 U JP 1988065667U JP 6566788 U JP6566788 U JP 6566788U JP H01169072 U JPH01169072 U JP H01169072U
Authority
JP
Japan
Prior art keywords
layers
multilayer wiring
wiring structure
insulating layers
electrode layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988065667U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988065667U priority Critical patent/JPH01169072U/ja
Publication of JPH01169072U publication Critical patent/JPH01169072U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/851Dispositions of multiple connectors or interconnections
    • H10W72/874On different surfaces
    • H10W72/884Die-attach connectors and bond wires
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings

Description

【図面の簡単な説明】
第1図は本考案の多層配線構造の一実施例が適
用された密着形イメージセンサSの平面図、第2
図は第1図の―線断面図、第3図は本考案の
多層配線構造の一実施例を示す図で第1図の―
線断面図、第4図は本考案の多層配線構造の第
2実施例を示す図、である。 12,16…配線層、13,15…絶縁層、1
4…アース電極層。

Claims (1)

    【実用新案登録請求の範囲】
  1. 複数の配線層12,16が絶縁層を介して多層
    に形成された多層配線構造において、上下に隣接
    する配線層12,16の間に絶縁層13,15に
    よつて挟まれたアース電極層14が設けられてい
    る多層配線構造。
JP1988065667U 1988-05-18 1988-05-18 Pending JPH01169072U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988065667U JPH01169072U (ja) 1988-05-18 1988-05-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988065667U JPH01169072U (ja) 1988-05-18 1988-05-18

Publications (1)

Publication Number Publication Date
JPH01169072U true JPH01169072U (ja) 1989-11-29

Family

ID=31291097

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988065667U Pending JPH01169072U (ja) 1988-05-18 1988-05-18

Country Status (1)

Country Link
JP (1) JPH01169072U (ja)

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