JPH01174923U - - Google Patents
Info
- Publication number
- JPH01174923U JPH01174923U JP1988071969U JP7196988U JPH01174923U JP H01174923 U JPH01174923 U JP H01174923U JP 1988071969 U JP1988071969 U JP 1988071969U JP 7196988 U JP7196988 U JP 7196988U JP H01174923 U JPH01174923 U JP H01174923U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- integrated circuit
- copper header
- eutectic solder
- metal die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
- H10W72/381—Auxiliary members
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988071969U JPH01174923U (cs) | 1988-05-31 | 1988-05-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988071969U JPH01174923U (cs) | 1988-05-31 | 1988-05-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01174923U true JPH01174923U (cs) | 1989-12-13 |
Family
ID=31297151
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988071969U Pending JPH01174923U (cs) | 1988-05-31 | 1988-05-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01174923U (cs) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5852892A (ja) * | 1981-09-25 | 1983-03-29 | Hitachi Ltd | 化合物半導体素子の取付構造 |
-
1988
- 1988-05-31 JP JP1988071969U patent/JPH01174923U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5852892A (ja) * | 1981-09-25 | 1983-03-29 | Hitachi Ltd | 化合物半導体素子の取付構造 |