JPH01200638A - Connection of electronic component - Google Patents

Abstract

PURPOSE:To easily and simply connect an electronic component to a connection terminal even with a small electronic component by connecting an element to the connection terminal by Joule heat generated at the connection terminal itself. CONSTITUTION:An element is connected to connection terminals by means of the Joule heat to be generated at the connection terminals 24a, 24b when an electric current flows to the connection terminals. That is to say, when the electric current flows to the connection terminals, Joule heat is generated at the connection terminals due to resistance of the connection terminals; for example, one part of the connection terminals is melted, or a bonding agent which has been applied in advance acts; the connection terminals and connection electrodes of the element are connected electrically and fixed mechanically. By this setup, a margin width for a special operation or an attachment which is relatively large as compared with an electronic component, such as a welding electrode, is not required; also a large-scale apparatus for a connection method by melting a conductive paste or the like by using a laser or a furnace is not required.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of connecting electronic components, and particularly to a method of connecting a small electronic component molded in a case and a connecting terminal.

[Prior art]

Conventionally, small electronic components and connection terminals have been connected by soldering, welding, caulking, or the like.

(Problems to be solved by the invention) In the conventional connection method, as electronic components become smaller, there is not enough margin for connection work, and attachments such as welding electrodes and soldering irons are more expensive than electronic components. This results in a relatively large size, making connection work difficult.

There is also a method of using conductive paste or solder paste, but with this method, it is difficult to control the amount applied, and it is necessary to use a heat source such as a laser beam or a furnace, so new equipment must be installed. Furthermore, there are limitations on the amount of heat, irradiation position, and angle of the laser beam.

Therefore, the conventional connection method is not suitable for connecting small and inexpensive electronic components.

Therefore, the main object of the present invention is to provide a method for connecting electronic components, which can easily and simply connect electronic components and connecting terminals, even if the electronic components are small.

[Means for solving problems]

To put it simply, this invention is a method for connecting electronic components, in which an element and a connecting terminal are connected using Joule heat generated by passing a current through the connecting terminal.

[Effect]

When a current is passed through the connection terminal, Joule heat is generated in the connection terminal due to the resistance of the connection terminal.

Then, for example, a part of the connection terminal melts, or the connection terminal and the connection electrode of the element are electrically connected and mechanically fixed by the action of the bonding agent applied in advance.

[Effects of the Invention] According to the present invention, since the element and the connection terminal are connected by Joule heat generated in the connection terminal itself, there is no margin for special work or electronic components such as welding electrodes. There is no need for a relatively large axotiment compared to the conventional method, and there is no need for costly equipment such as the method of melting conductive paste or the like using a laser or furnace to make connections. Therefore, according to the present invention, it is possible to simplify processes and equipment, and a large cost reduction can be expected.

The above objects, other features, and advantages of the present invention will become more apparent from the following detailed description of embodiments with reference to the drawings.

[Embodiment] FIG. 1 is an exploded perspective view for explaining an embodiment of the present invention. Below, an example in which the present invention is applied to a piezoelectric vibrating element using Niremen I will be explained.
It should be pointed out in advance that the present invention is applicable not only to piezoelectric vibrating elements but also to methods of connecting other elements, such as integrated circuit components and lead terminals.

Referring to FIG. 1, the piezoelectric vibrator 10 is a piezoelectric vibrating element 12
The terminal frame 20 is formed by welding the upper case 36 and the lower case 38 to enclose them in a state where the terminal frame 20 and the terminal frame 20 are connected, and then cutting unnecessary parts of the terminal frame 20 and bending the lead terminals.

The piezoelectric vibrator 12 includes a rectangular vibrator portion 14 formed into an island shape by press molding or etching a plate of a constant elastic material such as Erinba, and a support frame 16 formed to surround the vibrator portion 14. including. Vibrator part 1
4 is a connecting portion 1 that communicates with the short side portion of the support frame 16;
7a and 1, 7b.

A piezoelectric film (not shown) is formed on the upper surface of the vibrator portion 14 by sputtering, and this piezoelectric film is further formed to extend to the upper surface of the connecting portion 17a and the upper surface of the short side of the support frame 16 in the vicinity, An electrode film is further formed on these piezoelectric films by vacuum evaporation or the like. The electrode film on one short side of the support frame 16 acts as one connection electrode 18a. On the other hand, the other electrode film is formed on the other short side of the support frame 16 in the vicinity of the connecting portion 17b where the piezoelectric film is not formed, also by vacuum deposition. This electrode film acts as the other connection electrode 18b. These electrode films, that is, the connection electrodes 18a and 18b are connected to a joint formed on the terminal frame 20, as described later.

The terminal frame 20 is formed by punching out a sheet of metal, such as phosphor bronze. At the punched stage,
The terminal flaps 1 and 20 are connected to the strip body 22 through current-carrying terminals 24a and 24b.

The terminal frame 20 is punched into a substantially rectangular frame shape, and lead terminals 26a, 28a, and 26b are provided on both sides of the current-carrying terminals 24a and 24b, respectively.

28b is formed to protrude outward from the terminal frame 20. The lead terminals 26a to 28b therefore protrude from both sides of the case even after the terminal frame 20 is fixed by the upper case 36 and the lower case 38, respectively.

The current-carrying terminals 24a and 24b are formed with oval-shaped notches 32a and 32b, respectively, in the direction in which the current-carrying terminals extend from the space 30 side of the terminal frame 20. By cutting the portions where the notches 32a and 32b are formed along the vicinity of the frame, the lead terminals 26a and 28a and the lead terminals 26b and 28b, which were previously integral, are electrically insulated. . That is, the current-carrying terminals 24a and 24b are connected to the notches 32a and 32
In portion b, approximately U-shaped curved portions 3da and 34b are formed at opposing positions on the side of the terminal frame 20 that is cut after energization, on which the lead terminal is not formed. The tip portions 34c and 34d of the curved portions 34a and 34b are connected to the connection electrode 18 of the piezoelectric vibrating element 12.
This is the part connected to a and 18b. therefore,
The curved portions 34a and 34b are partially bent slightly so that their tip portions 34c and 34d protrude slightly downward.

Preferably, the cross-sectional areas of the curved portions 34a and 34b are set to be slightly smaller than the other cross-sectional areas of the terminal frame 20. The reason is that the electrical resistance is inversely proportional to the cross-sectional area -It, so by reducing the cross-sectional area, the Joule heat is maximized at the tips 34C and 34d.

The second case 36 and the lower case 38 are made of, for example, polycarbonate, polyacetal, PBT and Pl)S.
It is formed into a box shape from thermoplastic resin such as. Then, the upper case 36 and the lower case 38 are assembled so that the rectangular terminal frame 20 is sandwiched between the joint surface 36a of the upper case 36 and the joint surface 38a of the lower case 38. Therefore, the width of the joint surfaces 36a and 38a is
It is formed wider than the frame width of the terminal frame 20.

At the bottom of the lower case 38, there are support frames 40a to 40d in the form of truncated cones on which the top surface of the piezoelectric vibrator 12 is placed flush with the two surfaces of the joint surfaces 38a of both cases. 16, each corresponding to a portion of the four corners of the frame.

When assembling, first, as shown in FIG. 2, the piezoelectric vibrating element 12 is placed on the support parts 40a to 40d of the lower case. Thereafter, the terminal frame 20 is placed on the joint surface 38a'' of the lower case 38.

Then, the tip portions 34c and 3 of the terminal frame 20
4d are in contact with connection electrodes 18a and 18b on the support frame 16 of the piezoelectric vibrator 12, respectively. The state in which the distal end portion 34d of one curved portion 34b is in contact with the connection electrode 18b on the support frame 16 is illustrated in an enlarged scale.

When the terminal frame 20 is placed in this manner, the tips 34c and 34d are placed on the connection electrodes 18a and 18b of the piezoelectric vibrating element 12.

On the other hand, when the terminal frame 20 is placed, its substantially rectangular frame is supported on the joint surface 38a of the lower case 38;
Lead terminals 26a to 28b protrude from bonding surface 38a. Cuts 32a and 32b formed in the current-carrying terminals 24a and 24b also protrude from the joint surface 38a. In this state, place the upper case 3 on the terminal frame 20.
Place 6.

After the terminal frame 20 and the piezoelectric vibrating element 12 are sandwiched between the upper case 36 and the lower case 38 in this way,
Now fix these parts together.

First, a relatively large current is applied to the terminal frame 20 through the current-carrying terminals 24a and 24b. Then, Joule heat is generated in the terminal frame 20 due to the electrical resistance that the terminal frame 20 has. As described above, by reducing the cross-sectional area of the curved portions 34a and 34b that cross the tip portions 34c and 34d, respectively, the generated Joule heat can be particularly increased in the curved portions 34a and 34b. In this way, when the current is passed for a predetermined time, the tips 34C and 3 of the curved portions 34a and 34b
4(I) is melted. When the current is cut off at the melted stage, its tips 34c and 34d are fixed to the connection electrodes 18a and 18b formed on the support frame 16.

Note that in this embodiment, the connection electrode 1 on the support frame 16
8a and 18b and the tip portions 34c and 34d are joined to the tip portions 34c and 34d of the curved portions 34a and 34b.
4d material) was achieved by melting.

However, the tips 34 of the curved portions 34a and 34b
a bonding material that is easily melted in advance in c and 34d, respectively;
For example, solder paste may be applied or semi-temporal plating may be preliminarily applied. In this case, the connection electrode 1 is coated with molten solder paste or solder plating.
8a and 18b and tip portions 34c and 34d are joined.

Note that these bonding aids have relatively low melting points, so
When using it, the current flowing through the current-carrying terminals 24a and 24b may be small.

On the other hand, when current is applied from the current-carrying terminals 24a and 24b, the contact portions of the upper case 36 and the lower case joint surfaces 36a and 38a that sandwich the terminal frame 20 are melted by the Joule heat generated in the terminal frame 20. . Therefore, if the current flowing through the contact part is cut off when the contact part is melted, the melted part becomes HA fi'i7 and the joint surface 36
a and 38a are solidified together so as to wrap around the terminal frame 20. Therefore, at the stage of hardening again, the terminal frame 20 is integrally fixed by the first case 36 and the lower case 38.

After fixing the terminal frame 20, it is time to attach the current-carrying terminal 24a.
and 24b are cut out. The cutting part is the upper case 36
and a portion protruding from the lower case 38, and when these protruding portions are cut out, the cut portions are the notches 32a, respectively.
and 32b, the lead terminal 26
a, 26b and lead terminals 28a, 28b are insulated.

Thereafter, the lead ends 7-26a to 28b protruding from the sides of the second case 36 and the lower case 38 are bent downward.

In this way, the piezoelectric vibrator 10 encapsulating the piezoelectric vibrating element 12 is completed.

[Brief explanation of the drawing]

FIG. 1 is an exploded perspective view showing an embodiment of the present invention. FIG. 2 is an illustrative plan view showing a state in which the piezoelectric vibrator and the terminal frame are placed on the lower case. FIG. 3 is a partially enlarged perspective view showing the arrangement of the support frame and the curved portion of the piezoelectric vibrator. In the figure, 12 is a piezoelectric vibrating element, 20 is a terminal frame, 24a and 24b are current-carrying terminals, 26a to 28b are lead terminals, 36 is an upper case, and 38 is a lower case. Patent applicant Mura D1 Seisakusho Co., Ltd. Agent Patent attorney Yama 1) Yoshihito Figure 1

Claims (1)

[Scope of Claims] 1. A method for connecting electronic components, in which an element and the connecting terminal are connected by Joule heat generated by passing a current through the connecting terminal. 2. The method for connecting electronic components according to claim 1, wherein the element and the connecting terminal are connected by applying a bonding agent to the connecting portion of the connecting terminal in advance to bond them together by heating. 3. The method for connecting electronic components according to claim 2, wherein the bonding agent includes solder paste, solder plating, and the like. 4. The method for connecting electronic components according to claim 1, wherein the element and the connection terminal are connected by welding.