JPH09314353A - Resistance welding method and construction of body to be welded - Google Patents
Resistance welding method and construction of body to be weldedInfo
- Publication number
- JPH09314353A JPH09314353A JP12839996A JP12839996A JPH09314353A JP H09314353 A JPH09314353 A JP H09314353A JP 12839996 A JP12839996 A JP 12839996A JP 12839996 A JP12839996 A JP 12839996A JP H09314353 A JPH09314353 A JP H09314353A
- Authority
- JP
- Japan
- Prior art keywords
- welded
- resistance welding
- insulating material
- contact
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by welding
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、例えば電子部品の
実装のため互いに溶接される電子部品側の端子と、基板
母材側の端子とのように、互いに溶接される2つの被溶
接体を抵抗溶接により溶接する抵抗溶接方法及び被溶接
体の構造に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to two objects to be welded which are welded to each other, such as a terminal on an electronic component side and a terminal on a substrate base material side which are welded to each other for mounting an electronic component. The present invention relates to a resistance welding method for welding by resistance welding and a structure of an object to be welded.
【0002】[0002]
【従来の技術】従来、電子部品の実装基板への組付け
は、基板側に設けられた端子(ターミナル)に対し、実
装する電子部品に設けられた端子(リード)を、マイク
ロ抵抗溶接の手法により溶接接合することにより行われ
る場合がある。2. Description of the Related Art Conventionally, assembling of electronic parts to a mounting board is carried out by a micro resistance welding method in which terminals (leads) provided on electronic parts to be mounted are mounted on terminals (terminals) provided on the board side. May be performed by welding.
【0003】通常、マイクロ抵抗溶接では、ターミナル
とリードとの接触面積を小さくして通電時の電流を収束
させて発熱を促すため、ターミナルに突起(エンボス)
が形成されていた。Usually, in micro resistance welding, the contact area between the terminal and the lead is made small to converge the current during energization to promote heat generation, so that a protrusion (emboss) is formed on the terminal.
Had been formed.
【0004】例えば図7(a)に示すように、平リード
51と接合されるターミナル52にには略円柱状のエン
ボス53が突出形成されており、平リード51とターミ
ナル52とをエンボス53にて接触させた状態で、一対
の抵抗溶接用電極(プラス電極とマイナス電極)54
a,54bにより外側から狭持し、一定時間通電保持し
てエンボス53を発熱溶融させた後、溶融部の固化によ
り両者を接合させていた。For example, as shown in FIG. 7A, a terminal 52 joined to the flat lead 51 is formed with a substantially cylindrical emboss 53 so that the flat lead 51 and the terminal 52 are connected to the emboss 53. Pair of electrodes for resistance welding (plus electrode and minus electrode) 54 in contact with each other
The embossment 53 is sandwiched by a and 54b from the outside, and the emboss 53 is exothermicly melted by keeping energization for a certain period of time, and then the two are joined by solidification of the melted portion.
【0005】また、図7(b)に示すように、丸リード
55と接合されるターミナル56にには凸条のエンボス
57が突出形成されていた。ターミナル56に対する丸
リード55の接触位置が多少上下にずれても、エンボス
57が丸リード55の向きと直交する方向に延びている
ことから、常に両者に一定の接触面積が確保される。そ
して、この場合も同様に、ターミナル56と丸リード5
5とをエンボス57にて接触させた状態で、一対の抵抗
溶接用電極54a,54bにより外側から狭持し、一定
時間通電保持することにより両者をその接触部にて接合
させていた。Further, as shown in FIG. 7B, a projecting emboss 57 is formed on the terminal 56 joined to the round lead 55. Even if the contact position of the round lead 55 with respect to the terminal 56 is slightly shifted up and down, the embossment 57 extends in the direction orthogonal to the direction of the round lead 55, so that a constant contact area is always secured between the two. Also in this case, similarly, the terminal 56 and the round lead 5
In a state in which 5 and 5 are in contact with each other by the emboss 57, they are sandwiched by a pair of resistance welding electrodes 54a and 54b from the outside, and are energized and held for a certain period of time to join the two at their contact portions.
【0006】[0006]
【発明が解決しようとする課題】しかし、図8(a)に
示すように、平リード51を接合する場合、エンボス5
3との対応位置から外れた部位でターミナル52と平リ
ード51とが抵抗溶接用電極54a,54bにより挟持
されると、エンボス53の突起のために平リード51が
ターミナル52に対して傾いて挟持され、エンボス53
部以外の部位でも両者が接触することになる。この場
合、接触点が2箇所となるため抵抗溶接時の通電電流が
分流することになって十分な発熱が得られないため接合
が巧くいかなくなる。However, as shown in FIG. 8A, when the flat lead 51 is joined, the embossment 5 is used.
When the terminal 52 and the flat lead 51 are sandwiched by the resistance welding electrodes 54a and 54b at a position deviated from the position corresponding to 3, the flat lead 51 is inclined and sandwiched with respect to the terminal 52 due to the protrusion of the emboss 53. Embossed 53
Both parts will come into contact with each other. In this case, since there are two contact points, the energizing current at the time of resistance welding is shunted, and sufficient heat generation cannot be obtained, so that the joining becomes unsuccessful.
【0007】また、図8(b)に示すように、丸リード
55を接合する場合も、丸リード55が折れ曲がりなど
変形していると、エンボス57部以外の部位との2箇所
で両者が接触することになる。そのため、この場合も抵
抗溶接時の通電電流が分流し、十分な接合強度が得られ
なくなる。Also, as shown in FIG. 8B, when the round leads 55 are joined together, if the round leads 55 are deformed such as bent, they will come into contact with each other at two locations other than the embossed portion 57. Will be done. Therefore, in this case as well, the current flow during resistance welding is shunted, and sufficient joint strength cannot be obtained.
【0008】このような不具合を解消する方法として、
例えば特開昭57−190786号公報には図9に示す
ような抵抗溶接方法が開示されている。同図に示すよう
に、母材61に溶接する被溶接材62の接合面には複数
個の突起部63が形成されており、この接合面に軟質塩
化ビニルなどの絶縁層64が薄くコーティングされてい
る。この絶縁層64は抵抗溶接用電極65a,65bの
一方で突起部63を加圧することで局部的に破壊され
る。そのため、通電されると、絶縁層64が破壊された
突起部63と母材61間だけに電流が流れるため、母材
61と他の突起部63とが接触しても、回り込み電流を
防止でき、その接合部を所定電流値で必要強度に溶接で
きる。As a method for solving such a problem,
For example, Japanese Patent Application Laid-Open No. 57-190786 discloses a resistance welding method as shown in FIG. As shown in the figure, a plurality of projections 63 are formed on the joint surface of the material 62 to be welded to the base material 61, and the joint surface is thinly coated with an insulating layer 64 such as soft vinyl chloride. ing. The insulating layer 64 is locally destroyed by pressing the protrusion 63 on one of the resistance welding electrodes 65a and 65b. Therefore, when energized, a current flows only between the protrusion 63 where the insulating layer 64 is destroyed and the base material 61, so that even if the base material 61 and another protrusion 63 come into contact with each other, the sneak current can be prevented. The welded portion can be welded to a required strength with a predetermined current value.
【0009】しかし、この抵抗溶接方法によると、抵抗
溶接用電極65aを加圧したときに突起部63の絶縁層
64が破壊されなかったり、その破壊が十分でなかった
ときには、必要な接合強度が得られず溶接不良となる。
また、破壊した絶縁層64の破片が異物として接合部に
残存すると、見かけ上は接合していても、引っ張るとす
ぐに外れてしまうような接合強度の弱いものとなる恐れ
があった。However, according to this resistance welding method, when the insulating layer 64 of the projection 63 is not destroyed when the resistance welding electrode 65a is pressed, or when the destruction is not sufficient, the necessary bonding strength is obtained. Not obtained, resulting in poor welding.
Further, if the broken pieces of the insulating layer 64 remain in the joint portion as foreign matter, there is a possibility that the joint strength may be weak such that the joint is apparently joined but is immediately detached when pulled.
【0010】本発明は前記の問題点に鑑みてなされたも
のであって、その目的は、抵抗溶接時の通電電流の分流
を招かないように2つの被溶接体を突起だけで接触さ
せ、しかも接合強度の低下を招くような接合部への異物
の残存を防止することにより、ばらつきなく常に高い接
合強度を確保することができる抵抗溶接方法及び被溶接
体の構造を提供することにある。The present invention has been made in view of the above problems, and an object thereof is to bring two objects to be welded into contact with each other only by a protrusion so as not to cause a shunt of a current flowing during resistance welding. It is an object of the present invention to provide a resistance welding method and a structure of a body to be welded, by which it is possible to always maintain a high joint strength without variation by preventing foreign matter from remaining in a joint portion which causes a decrease in joint strength.
【0011】[0011]
【課題を解決するための手段】上記問題点を解決するた
め請求項1に記載の発明では、2つの被溶接体の一方に
突起を形成し、該突起にて両被溶接体を接触させた状態
で抵抗溶接通電を行って、抵抗溶接時の電流を発熱を促
すべく集中させるようにした抵抗溶接方法であって、前
記被溶接体に少なくとも前記突起の先端を露出させた状
態に絶縁材を被覆する絶縁材被覆工程と、前記両被溶接
体を前記突起形成面側で接触させた状態で、少なくとも
前記絶縁材被覆後に両被溶接体間に抵抗溶接用電極を用
いた通電を行う通電溶接工程とを備えている。In order to solve the above problems, in the invention according to claim 1, a protrusion is formed on one of the two objects to be welded, and the objects to be welded are contacted by the protrusion. Resistance welding energization is carried out in a state, and is a resistance welding method for concentrating the current during resistance welding so as to promote heat generation, wherein at least the tip of the protrusion is exposed on the body to be welded with an insulating material. Insulation material coating step for coating, and current welding in which electricity is applied between the objects to be welded at least after the insulating material is covered in a state where the objects to be welded are in contact with each other on the side where the projections are formed. And the process.
【0012】請求項2に記載の発明では、抵抗溶接時の
電流を集中させるための突起が形成された被溶接体であ
って、前記被溶接体には絶縁材が少なくとも前記突起の
先端を露出させるように被覆されている。According to a second aspect of the present invention, there is provided a body to be welded in which a projection for concentrating a current during resistance welding is formed, and an insulating material exposes at least the tip of the projection to the body to be welded. It is coated so that
【0013】請求項3に記載の発明では、請求項2記載
の被溶接体の構造において、前記絶縁材は、前記突起の
先端部だけを露出させるように該突起の突出長より少し
短い被覆厚で被覆されている。According to a third aspect of the present invention, in the structure of the body to be welded according to the second aspect, the insulating material has a coating thickness slightly shorter than the protruding length of the protrusion so that only the tip end portion of the protrusion is exposed. It is covered with.
【0014】請求項4に記載の発明では、請求項2又は
請求項3に記載の前記被溶接体の構造において、前記絶
縁材は熱可塑性樹脂である。従って、請求項1に記載の
発明によれば、絶縁材被覆工程において、抵抗溶接され
る2つの被溶接体のうち突起が形成された方の被溶接体
の突起形成面に少なくとも該突起の先端を露出させた状
態で絶縁材が被覆される。通電溶接工程においては、両
被溶接体を突起形成面を接触させた状態で、少なくとも
絶縁材被覆後に、両被溶接体間に抵抗溶接用電極を用い
た通電が行われる。従って、両被溶接体はその相対位置
に拘わらず突起の先端だけで接触した状態にあるため、
通電電流の分流が確実に回避され、その突起接触部だけ
に電流が集中する。その結果、その突起接触部が十分に
発熱溶融するため、両者は常に必要な強度で接合され
る。また、突起の先端が絶縁材から露出していることか
ら、絶縁材が接合部に異物として残存することも回避さ
れ、接合部に残存する異物に起因する接合強度の低下を
招くこともない。According to the invention of claim 4, in the structure of the object to be welded according to claim 2 or 3, the insulating material is a thermoplastic resin. Therefore, according to the invention described in claim 1, in the insulating material coating step, at least the tip of the projection is formed on the projection forming surface of the one of the two objects to be welded to be resistance-welded having the projection. The insulating material is covered with the exposed portion. In the energization welding step, energization using a resistance welding electrode is performed between the objects to be welded at least after covering the insulating material with the objects to be welded in contact with the projection forming surface. Therefore, the two objects to be welded are in contact with each other only at the tips of the protrusions regardless of their relative positions.
The shunt of the energizing current is surely avoided, and the current concentrates only on the protrusion contact portion. As a result, the protrusion contact portion is sufficiently heated and melted, so that the both are always bonded with required strength. Further, since the tips of the protrusions are exposed from the insulating material, it is possible to prevent the insulating material from remaining as foreign matter in the joint portion, and to prevent the reduction of the joint strength due to the foreign matter remaining in the joint portion.
【0015】請求項2に記載の発明によれば、被溶接体
の突起は、少なくともその先端が露出するように被覆材
で被覆されているため、この被溶接体を溶接相手部材に
接触させてたときには、両者はその相対位置に拘わらず
常に突起の先端だけで接触した状態となる。そのため、
抵抗溶接通電時の電流の分流が回避され、その突起接触
部に電流が集中して十分に発熱溶融するため、常に必要
な接合強度で接合される。また、突起の先端部が絶縁材
から露出していることから、接合部に絶縁材が異物とし
て残存することが回避され、異物に起因する接合強度の
低下も招かない。According to the second aspect of the present invention, since the projection of the object to be welded is covered with the coating material so that at least the tip thereof is exposed, the object to be welded is brought into contact with the member to be welded. In such a case, the two are always in contact with each other only by the tips of the protrusions regardless of their relative positions. for that reason,
The shunting of the current during resistance welding energization is avoided, and the current concentrates on the contact portion of the protrusion and sufficiently heats and melts, so that the welding is always performed with the necessary joining strength. In addition, since the tip end of the protrusion is exposed from the insulating material, it is possible to prevent the insulating material from remaining as a foreign matter in the joint portion, and the joint strength is not reduced due to the foreign matter.
【0016】請求項3に記載の発明によれば、絶縁材
は、突起の先端部だけを露出させるように突起の突出長
より少し短い被覆厚で被覆されているため、両被溶接体
が突起以外の部位で抵抗溶接用電極にて挟持されても、
両被溶接体が傾いて接触することが防止される。According to the third aspect of the present invention, the insulating material is coated with a coating thickness slightly shorter than the projection length of the projection so that only the tip of the projection is exposed. Even if it is sandwiched by the resistance welding electrodes in other parts,
Both the objects to be welded are prevented from inclining and coming into contact with each other.
【0017】請求項4に記載の発明によれば、絶縁材が
熱可塑性の樹脂であるため、抵抗溶接時の発熱により溶
融(軟化)した突起回り絶縁材が接合強度の増強に寄与
する。従って、一層高い接合強度の確保が可能となる。According to the fourth aspect of the invention, since the insulating material is a thermoplastic resin, the insulating material around the protrusions that is melted (softened) by the heat generated during resistance welding contributes to the enhancement of the bonding strength. Therefore, it is possible to secure higher bonding strength.
【0018】[0018]
【発明の実施の形態】以下、本発明を具体化した一実施
形態を図1〜図5に従って説明する。図5に示すよう
に、電子部品実装製品1は、ベース部品2に電子部品
3,4を実装することにより構成されている。ベース部
品2は例えばアルミ製の枠部5と、枠部5に収容状態に
固着されたベース6とを備えている。ベース6は、枠部
5に基板(図示せず)を収容状態で金型にセットして行
うインサート成形により、樹脂でモールドされた状態に
形成されている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to FIGS. As shown in FIG. 5, the electronic component-mounted product 1 is configured by mounting the electronic components 3 and 4 on the base component 2. The base component 2 includes, for example, a frame part 5 made of aluminum and a base 6 fixed to the frame part 5 in a housed state. The base 6 is formed in a resin-molded state by insert molding performed by setting a substrate (not shown) in the frame portion 5 in a housed state and setting it in a mold.
【0019】ベース6には、電子部品を実装するための
被溶接体及び端子としての板状のターミナル7,8が延
出している。電子部品にはその基板から被溶接体として
の平リード3aを延出させた電子部品3や、被溶接体と
しての丸リード4aを延出させたコイルやコンデサ等の
電子部品4がある。電子部品3,4はその各リード3
a,4aをターミナル7,8に溶接することによりベー
ス6上に実装される。本実施形態では、ターミナル7,
8には、平リード3aを備える電子部品3を実装するた
めのターミナル7と、丸リード4aを備える電子部品4
を実装するためのターミナル8との2種類がある。Plate-shaped terminals 7 and 8 as terminals to be welded and terminals for mounting electronic parts are extended on the base 6. The electronic components include an electronic component 3 in which a flat lead 3a as a welded object is extended from the substrate, and an electronic component 4 such as a coil or a capacitor in which a round lead 4a as a welded object is extended. The electronic components 3 and 4 have their respective leads 3
It is mounted on the base 6 by welding the terminals a and 4a to the terminals 7 and 8. In the present embodiment, the terminal 7,
8 includes a terminal 7 for mounting the electronic component 3 having the flat lead 3a, and an electronic component 4 having the round lead 4a.
There are two types, namely, a terminal 8 for mounting the.
【0020】図1,図2に示すように、ターミナル7
は、ベース6から略四角板状に延出するとともに、平リ
ード3aと溶接される側の面に突起としての円柱状のエ
ンボス9aが突出形成された、被溶接体を構成する銅合
金製(例えば黄銅)の金属板部9を備えている。金属板
部9のエンボス9a形成面側にはエンボス9aの先端部
を露出させた状態で絶縁材10が被覆されている。As shown in FIGS. 1 and 2, the terminal 7
Is made of a copper alloy that forms a body to be welded, which extends from the base 6 in a substantially rectangular plate shape and has a cylindrical embossment 9a as a protrusion formed on the surface to be welded to the flat lead 3a. For example, a metal plate portion 9 made of brass) is provided. The surface of the metal plate portion 9 on which the embossment 9a is formed is covered with an insulating material 10 with the tip of the embossment 9a exposed.
【0021】また、図3,図4に示すように、ターミナ
ル8は、ベース6から略四角板状に延出するとともに、
丸リード4aと溶接される側の面に突起としての凸条の
エンボス11aが突出形成された、被溶接体を構成する
銅合金製(例えば黄銅)の金属板部11を備えている。
凸条のエンボス11aは、金属板部11を折り曲げ成形
することにより突出状態に形成されている。金属板部1
1のエンボス11a形成面側にはエンボス11aの先端
部をその凸条の延びた方向に沿って露出させた状態で絶
縁材12が被覆されている。Further, as shown in FIGS. 3 and 4, the terminal 8 extends from the base 6 into a substantially square plate shape, and
A metal plate portion 11 made of a copper alloy (for example, brass) constituting a body to be welded is provided with a protruding embossment 11a as a protrusion formed on a surface to be welded to the round lead 4a.
The ridged embossment 11a is formed in a protruding state by bending the metal plate portion 11. Metal plate part 1
The first embossing 11a forming surface side is covered with an insulating material 12 in a state in which the tip end portion of the embossing 11a is exposed along the extending direction of the ridge.
【0022】絶縁材10,12は、ポリブチレンテレフ
タレート(PBT)あるいはポリカボネート(PC)な
どの熱可塑性樹脂からなる。絶縁材10,12はベース
6を覆う樹脂モールドのためのインサート成形時に一緒
に被覆形成されている。例えばインサート成形用の金型
内壁面に絶縁材10,12を被覆しない部位を当ててマ
スクした状態で、金型に樹脂を注入することにより、エ
ンボス9a,11aの先端部だけを露出させた状態に絶
縁材10を被覆させている。絶縁材10,12はPB
T,PC以外にも絶縁性能が比較的高いものを使用する
ことができる。特に本実施形態では、溶接通電時におけ
るエンボス9a,11a回りの加熱温度であろう約20
0〜300℃に融点をもつものを使用している(PBT
は融点224℃、PCは融点240℃)。なお、各リー
ド3a,4aの材質は、銅系金属(例えば黄銅等)から
なる。The insulating materials 10 and 12 are made of a thermoplastic resin such as polybutylene terephthalate (PBT) or polycarbonate (PC). The insulating materials 10 and 12 are coated together during insert molding for resin molding covering the base 6. For example, a state in which only the tips of the embosses 9a and 11a are exposed by injecting a resin into the mold while masking the inner wall surface of the mold for insert molding that does not cover the insulating materials 10 and 12. Is covered with an insulating material 10. Insulation materials 10 and 12 are PB
Other than T and PC, those having relatively high insulation performance can be used. Particularly, in this embodiment, the heating temperature around the embossments 9a and 11a during welding energization may be about 20.
It has a melting point of 0 to 300 ° C (PBT
Has a melting point of 224 ° C. and PC has a melting point of 240 ° C.). The materials of the leads 3a and 4a are made of copper-based metal (for example, brass).
【0023】マイクロ抵抗溶接時には、ターミナル7,
8の絶縁層10側に露出したエンボス9a,11aの先
端に、リード3a,4aを接触させた状態で、その外側
から一対の抵抗溶接用電極(プラス電極とマイナス電
極)13,14により挟持し、電圧を印加することによ
り行われる。During micro resistance welding, the terminal 7,
8, the leads 3a and 4a are in contact with the tips of the embosses 9a and 11a exposed on the insulating layer 10 side, and sandwiched by a pair of resistance welding electrodes (plus and minus electrodes) 13 and 14 from the outside. , By applying a voltage.
【0024】次に、上記のように構成されたターミナル
7,8の作用を説明する。ベース部品2を構成する枠部
5内のベース6は、金属板部9,11を延出する基板
(図示せず)をインサート成形により枠部5内に樹脂モ
ールドすることにより形成される。金属板部9,11は
予めエンボス9a,11aを形成する加工が施されてか
ら基板に取付けられており、このインサート成形は金属
板部9,11をベース6から延出させた状態とするよう
にインサート成形用金型を用いて行われる。このインサ
ート成形時に金属板部9,11の一側面にエンボス9
a,11aの先端部を露出させた状態で樹脂が被覆され
る。インサート成形用樹脂としてPBTやPCなどの絶
縁性の熱可塑性樹脂が使用される。そのため、ベース6
から延出するターミナル7,8は、PBTやPCなどか
らなる絶縁材10,12が、エンボス9a,11aの先
端部を露出させた状態で被覆された状態に形成されてい
る。Next, the operation of the terminals 7 and 8 configured as described above will be described. The base 6 in the frame portion 5 that constitutes the base component 2 is formed by resin-molding a substrate (not shown) that extends the metal plate portions 9 and 11 into the frame portion 5 by insert molding. The metal plate portions 9 and 11 are attached to the substrate after being processed to form the embossments 9a and 11a in advance, and this insert molding is performed so that the metal plate portions 9 and 11 are extended from the base 6. Is performed using an insert molding die. At the time of this insert molding, the embossing 9 is applied to one side surface of the metal plate portions 9, 11.
The resin is coated with the tips of a and 11a exposed. An insulating thermoplastic resin such as PBT or PC is used as the insert molding resin. Therefore, base 6
The terminals 7 and 8 extending from are formed in a state in which the insulating materials 10 and 12 made of PBT, PC, or the like are covered with the tips of the embosses 9a and 11a exposed.
【0025】次に、電子部品3,4をマイクロ抵抗溶接
する手順について説明する。まず、実装すべき電子部品
3,4のリード3a,4aを、溶接先となるターミナル
7,8に対しエンボス9a,11a形成面(露出面)側
を接触状態としてセットする。そして、ターミナル7,
8とリード3a,4aとをその外側から2本の抵抗溶接
用電極13,14により狭持する。Next, a procedure for micro resistance welding the electronic components 3 and 4 will be described. First, the leads 3a and 4a of the electronic components 3 and 4 to be mounted are set with the embossed surfaces 9a and 11a forming surface (exposed surface) in contact with the terminals 7 and 8 to be welded. And terminal 7,
8 and the leads 3a, 4a are sandwiched from the outside by two resistance welding electrodes 13, 14.
【0026】例えば抵抗溶接用電極13,14がターミ
ナル7及び平リード3aをエンボス9a以外の部位で挟
持しても、平リード3aは絶縁材10の被覆表面に当た
るだけで、金属板部9と平リード3aとはエンボス9a
の先端部だけで点接触する。また、折れ曲がった丸リー
ド4aも絶縁材12の被覆表面に当たるだけなので、金
属板部11と丸リード3aとはエンボス11aの先端部
だけで点接触する。特に、本実施形態では、絶縁材1
0,12の被覆厚がエンボス9a,11aの先端部だけ
を露出させるようにエンボス9a,11aの突出長より
若干小さな値に設定されているため、溶接電極13,1
4によりエンボス9a,11a以外の部位で挟持されて
も、ターミナル7,8とリード3a,4aはさほど傾か
ずにほぼ平行な姿勢で接触する。For example, even if the resistance welding electrodes 13 and 14 sandwich the terminal 7 and the flat lead 3a at a portion other than the embossment 9a, the flat lead 3a only contacts the surface of the insulating material 10 so that the flat plate 3a and the flat plate 3a are flat. Embossed 9a with lead 3a
Point contact only at the tip of. Further, since the bent round lead 4a only hits the covering surface of the insulating material 12, the metal plate portion 11 and the round lead 3a make point contact only at the tip of the emboss 11a. Particularly, in this embodiment, the insulating material 1
Since the coating thickness of 0, 12 is set to a value slightly smaller than the projecting length of the embossments 9a, 11a so that only the tips of the embossments 9a, 11a are exposed, the welding electrodes 13, 1
Even if the terminals 7 and 8 are sandwiched by the parts 4 other than the embosses 9a and 11a, the terminals 7 and 8 and the leads 3a and 4a contact each other in a substantially parallel posture without being tilted so much.
【0027】そして、ターミナル7,8とリード3a,
4aとを接触させた状態で、抵抗溶接用電極13,14
間に所定電圧が印加され、抵抗溶接が実施される。通電
されると、エンボス9a,11aの先端部の点接触部だ
けに電流が集中して流れる。そのため、通電時の電流が
分流することはない。そのため、点接触部のみに電流が
集中して流れることにより、その所定電流により十分な
発熱が起こる。The terminals 7 and 8 and the leads 3a,
4a in contact with the electrodes 13 and 14 for resistance welding
A predetermined voltage is applied between them and resistance welding is performed. When energized, the electric current concentrates and flows only on the point contact portions at the tips of the embosses 9a and 11a. Therefore, the current when energized does not flow. As a result, the current concentrates only on the point contact portion, causing sufficient heat generation due to the predetermined current.
【0028】金属板部9,11やリード3a,4aの材
質である銅合金が溶ける約800°C以上の温度に発熱
すると、その点接触部の金属が溶融し始める。これに前
後してエンボス9a,11a回りの絶縁材10,12も
その融点(例えばPBTは224℃、PCは240℃)
となった部分から徐々に溶融し始める。そして、抵抗溶
接用電極13,14により荷重が加えられているため、
エンボス9a,11aの溶融部位はその荷重によりその
回りの溶融樹脂を外側に追いやりなら押し広げられてい
く。こうして溶接面積が確保される。When heat is generated at a temperature of about 800 ° C. or higher at which the copper alloys, which are the materials of the metal plate portions 9 and 11 and the leads 3a and 4a, melt, the metal at the point contact portions begins to melt. Before and after this, the melting points of the insulating materials 10 and 12 around the embossments 9a and 11a (for example, 224 ° C for PBT and 240 ° C for PC)
It begins to melt gradually from the part that became. Since the load is applied by the resistance welding electrodes 13 and 14,
The molten portions of the embosses 9a and 11a are spread by the load, if the molten resin around them is forced outward. In this way, the welding area is secured.
【0029】このとき、エンボス9a,11a先端部の
点接触部の溶融金属と、絶縁材10,12の溶融樹脂と
は相溶性が低いうえ、比重差もかなりあるため、混じり
合うことはない。そして、エンボス9a,11aの溶融
が進んでターミナル7,8とリード3a,4aとが抵抗
溶接用電極13,14からの荷重によりある程度接近す
ると、絶縁材10,12の溶融樹脂がリード3a,4a
に接触するようになる。At this time, the molten metal at the point contact portions at the tips of the embosses 9a and 11a and the molten resin of the insulating materials 10 and 12 have low compatibility and also have a considerable difference in specific gravity, so that they do not mix with each other. When the embosses 9a and 11a are melted and the terminals 7 and 8 and the leads 3a and 4a come close to each other to some extent due to the load from the resistance welding electrodes 13 and 14, the molten resin of the insulating materials 10 and 12 causes the leads 3a and 4a to melt.
Come into contact with.
【0030】所定時間(実際には1秒以下)経過後、電
流の通電が停止されると、点接触付近の溶融部は、ター
ミナル7,8及びリード3a,4aの材料が混じり合っ
た状態で冷えて固化する。このとき、絶縁材10,12
の溶融樹脂も冷えて硬化し、この硬化した樹脂がターミ
ナル7,8とリード3a,4aとの接合にも寄与する。After a predetermined time (actually 1 second or less) has passed, when the current supply is stopped, the molten portion near the point contact is in a state where the materials of the terminals 7 and 8 and the leads 3a and 4a are mixed. It cools and solidifies. At this time, the insulating materials 10 and 12
The molten resin is also cooled and hardened, and the hardened resin also contributes to the joining between the terminals 7 and 8 and the leads 3a and 4a.
【0031】ターミナル7,8に対してリード3a,4
aは、露出したエンボス9a,11aの先端部で直接金
属同士が接触する状態で点接触しており、この状態から
マイクロ抵抗溶接の通電が実施される。また、この通電
過程において、エンボス9a,11a先端の点接触部の
溶融金属と、絶縁材10,12の溶融樹脂は互いの相溶
性が低いうえ、比重差もかなりあることから、混じり合
うことなく、樹脂が外側に追いやられるだけとなる。そ
のため、溶融樹脂等が接合部に異物として残存すること
がない。そのため、常にばらつきのない高い接合強度が
得られる。Leads 3a and 4 for terminals 7 and 8
A is point-contacted in a state where the metals directly contact with each other at the exposed tips of the embossments 9a and 11a, and from this state, energization for micro resistance welding is performed. Further, in this energization process, the molten metal at the point contact portions at the tips of the embosses 9a and 11a and the molten resin of the insulating materials 10 and 12 have low mutual compatibility and also have a large difference in specific gravity, so that they do not mix with each other. , The resin is only driven to the outside. Therefore, the molten resin and the like do not remain as foreign matter at the joint. Therefore, consistent high bonding strength can be obtained.
【0032】こうしてベース6の各ターミナル7,8に
電子部品3,4がマイクロ抵抗溶接により実装され、電
子部品実装製品1が製造される。なお、必要に応じて枠
部2内に電子部品3,4間の高い絶縁性を確保する目的
からシリコンゲルが注入される。In this way, the electronic components 3 and 4 are mounted on the terminals 7 and 8 of the base 6 by micro resistance welding, and the electronic component mounted product 1 is manufactured. If necessary, silicon gel is injected into the frame 2 for the purpose of ensuring high insulation between the electronic components 3 and 4.
【0033】以上詳述したように本実施形態によれば、
以下に示す効果を得る。 (a)エンボス9a,11aの先端を露出させた状態で
金属板部9,11を絶縁材10,12で被覆することに
よりターミナル7,8を形成したので、ターミナル7,
8とリード3a,4aとの位置関係に依らず、常にター
ミナル7,8とリード3a,4aとをエンボス9a,1
1aの先端部だけで点接触させることができる。その結
果、マイクロ抵抗溶接時の通電電流を、分流することな
くそのエンボス9a,11a先端の接触部に集中して流
すことができる。従って、常に必要接合強度が得られる
ようにエンボス9a,11aを十分溶融させることがで
き、いつも接合強度をばらつきなく十分確保することが
できる。As described in detail above, according to the present embodiment,
The following effects are obtained. (A) The terminals 7 and 8 are formed by covering the metal plate portions 9 and 11 with the insulating materials 10 and 12 in a state where the tips of the embosses 9a and 11a are exposed.
8 and the leads 3a and 4a, the terminals 7 and 8 and the leads 3a and 4a are always embossed 9a and 1a.
It is possible to make point contact only with the tip of 1a. As a result, the energization current during micro resistance welding can be concentrated and flown to the contact portions at the tips of the embossments 9a and 11a without being divided. Therefore, the embossments 9a and 11a can be sufficiently melted so that the required bonding strength can always be obtained, and the bonding strength can always be sufficiently secured without variation.
【0034】(b)確実に点接触または線接触させ、分
流が起きないようにできることにより、電流を集中させ
ることができ、抵抗溶接時の電極間の通電を低電力にす
ることができる。(B) By making sure the point contact or the line contact so that the shunt current does not occur, the electric current can be concentrated and the electric power supply between the electrodes at the time of resistance welding can be made low power.
【0035】(c)エンボス9a,11aの先端を露出
させた状態で絶縁材10,12を被覆させたので、従来
技術で述べた図9の抵抗溶接方法のように、その接合部
に破った被覆層の破片が異物として残存したために起こ
る接合強度の低下を回避することができる。従って、接
合強度のばらつきの発生を一層抑えることができる。(C) Since the insulating materials 10 and 12 were coated with the tips of the embosses 9a and 11a exposed, the joints were broken as in the resistance welding method of FIG. 9 described in the prior art. It is possible to avoid a decrease in the bonding strength caused by the fragments of the coating layer remaining as foreign matter. Therefore, it is possible to further suppress the occurrence of variations in the bonding strength.
【0036】(d)エンボス9a,11aの先端部だけ
を絶縁材10,12から露出させるような被覆厚に設定
したので、エンボス9a,11aに対応する部位以外で
ターミナル7,8とリード3a,4aを抵抗溶接用電極
13,14により挟持しても、ターミナル7,8とリー
ド3a,4aとをさほど傾かずほぼ平行に接触した状態
にセットすることができる。その結果、マイクロ抵抗溶
接がターミナル7,8とリード3a,4aとが正しい姿
勢でセットされた状態で行われるので、溶接部に無理な
応力をかけないようにすることができる。(D) Since the coating thickness is set so that only the tips of the embosses 9a and 11a are exposed from the insulating materials 10 and 12, the terminals 7 and 8 and the leads 3a, except the portions corresponding to the embosses 9a and 11a, Even if 4a is sandwiched by the resistance welding electrodes 13 and 14, the terminals 7 and 8 and the leads 3a and 4a can be set in a state in which they are in contact with each other in a substantially parallel manner without being tilted so much. As a result, the micro resistance welding is performed with the terminals 7 and 8 and the leads 3a and 4a set in the correct postures, so that it is possible to prevent excessive stress from being applied to the welded portions.
【0037】(e)絶縁材10,12を被覆したことに
よりターミナル7,8の絶縁耐量の向上を図ることがで
き、例えば実装された電子部品3,4間に発生した静電
気等による放電を打ち消すことができる。また、絶縁材
10,12で被覆された部位の金属腐食を抑えることが
でき、ターミナル7,8の耐環境性の向上を図ることも
できる。(E) The insulation resistance of the terminals 7 and 8 can be improved by coating the insulating materials 10 and 12, for example, the discharge caused by static electricity generated between the mounted electronic components 3 and 4 can be canceled. be able to. Further, it is possible to suppress the metal corrosion of the portions covered with the insulating materials 10 and 12, and to improve the environment resistance of the terminals 7 and 8.
【0038】尚、本発明は上記実施例に限定されるもの
ではなく、発明の趣旨を逸脱しない範囲で例えば次のよ
うに変更することができる。 (1)図6に示すように、ターミナル21を構成する金
属板部22に対して突起としてのエンボス22aの先端
を露出させた状態で被覆する絶縁材23を、抵抗溶接用
電極13,14の挟持エリアを除いたエンボス22aの
形成面の裏面側まで被覆した構成としてもよい。この構
成によれば、絶縁材23による被覆面積が増すため、タ
ーミナル21の絶縁耐量及び耐環境性の向上を一層図る
ことができる。The present invention is not limited to the above embodiments, but can be modified as follows without departing from the gist of the invention. (1) As shown in FIG. 6, an insulating material 23 for covering the metal plate portion 22 constituting the terminal 21 in a state where the tip of the embossing 22a as a projection is exposed is provided on the electrodes 13 and 14 for resistance welding. A configuration may be adopted in which the back surface side of the surface on which the emboss 22a is formed excluding the sandwiching area is covered. According to this configuration, the area covered by the insulating material 23 is increased, so that it is possible to further improve the dielectric strength and environment resistance of the terminal 21.
【0039】(2)絶縁材10,12,23の被覆厚
は、エンボスの先端部だけを露出させる程度の値に限定
されない。絶縁性が確保されれば絶縁材の被覆厚は適宜
変更できる。例えばエンボスの突出長に比較して十分小
さな値の被覆厚としてもよい。この構成によれば、マイ
クロ抵抗溶接時の通電電流の分流を確実に抑えることが
できるうえ、絶縁材を使用量を少量で済ませることがで
きる。また、被溶接体が傾いて接触することがあって
も、エンボスでの点接触はするので、溶接後に必要な接
合強度は得られる。(2) The coating thickness of the insulating material 10, 12, 23 is not limited to a value such that only the tip of the emboss is exposed. If insulation is secured, the coating thickness of the insulating material can be changed as appropriate. For example, the coating thickness may be a sufficiently small value as compared with the protruding length of the emboss. With this configuration, it is possible to reliably suppress the shunt of the energizing current during micro resistance welding, and to use a small amount of the insulating material. Further, even if the objects to be welded are inclined and come into contact with each other, the point contact is made at the embossing, so that the necessary joining strength can be obtained after welding.
【0040】(3)絶縁材は常温で硬化状態となる樹脂
に限定されない。例えばゲル状樹脂を絶縁材として用い
て本発明を適用してもよい。例えばシリコンゲルを用い
てもよい。シリコンゲルのような絶縁性ゲルは、ある程
度低い粘度であれば、毛細管現象によりターミナル(こ
の場合は金属板部)を、エンボス(突起)の先端を露出
させた状態ではい上がりターミナルを被覆することがで
きる。そのため、絶縁材の被覆作業を簡単にすることが
できる。また、シリコンゲルは粘着性を有するのみで接
合強度を増強させることはないが、その高い絶縁性によ
り、絶縁耐量及び耐環境性の向上にも寄与する。また、
ターミナルのエンボスとリードとを接触させた状態でシ
リコンゲルをはい上がらせる手順を採ってもよい。例え
ばリードがエンボス以外の部位でターミナルの金属板部
と軽く接触していても、その接触を遮るようにシリコン
ゲルがその接触部に毛細管現象で浸透すれば、抵抗溶接
時の通電電流の分流は抑えられる。(3) The insulating material is not limited to the resin that is cured at room temperature. For example, the present invention may be applied using a gel resin as an insulating material. For example, silicon gel may be used. If the viscosity of insulating gel such as silicon gel is low to some extent, the terminal (metal plate in this case) should be lifted up by capillarity and the terminal should be covered with the tip of the emboss (projection) exposed. You can Therefore, the work of covering the insulating material can be simplified. Further, although silicon gel has only adhesiveness and does not enhance the bonding strength, its high insulating property also contributes to the improvement of dielectric strength and environmental resistance. Also,
A procedure may be adopted in which the silicon gel is raised with the embossment of the terminal and the lead in contact with each other. For example, even if the lead is in light contact with the metal plate of the terminal at a part other than the embossing, if the silicon gel penetrates into the contact part by capillary action so as to block the contact, the shunting of the energizing current during resistance welding will occur. It can be suppressed.
【0041】(4)本発明における突起(エンボス)が
形成された被溶接体は、電子部品を実装するベース部品
側のターミナルに限定されない。例えば、電子部品3の
平リード3aにエンボスを加工し、平リード3aにその
エンボスの先端を露出させた状態で絶縁材を被覆した構
成としてもよい。この構成によっても、ターミナルと平
リードとを接触時の位置関係に依らず点接触させること
ができるため、前記実施形態と同様の効果を得ることが
できる。(4) The object to be welded on which the projection (emboss) is formed in the present invention is not limited to the terminal on the base component side on which the electronic component is mounted. For example, the flat lead 3a of the electronic component 3 may be embossed, and the flat lead 3a may be covered with an insulating material with the tip of the emboss exposed. With this configuration as well, the terminal and the flat lead can be brought into point contact with each other regardless of the positional relationship at the time of contact, so that the same effect as in the above embodiment can be obtained.
【0042】(5)丸リード4aを溶接するためのター
ミナル8に形成するエンボス11aの向きはその接合す
る向きに応じて適宜変更することができる。例えばター
ミナルの延出方向に対して直交する方向に凸条のエンボ
スが形成された構成としてもよい。(5) The direction of the embossing 11a formed on the terminal 8 for welding the round lead 4a can be appropriately changed according to the joining direction. For example, a configuration in which a convex strip emboss is formed in a direction orthogonal to the extending direction of the terminal may be adopted.
【0043】(6)絶縁材の材質は熱可塑性樹脂に限定
されない。例えば熱硬化性樹脂でも、完全に硬化してい
ないBステージという状態で使用すれば、溶融金属によ
り絶縁材を押し広げて接合面積を確保することはでき
る。また、単に絶縁性のみを期待して完全硬化させた熱
硬化性樹脂を使用してもよい。この構成によっても、被
溶接体の接触を常に突起(エンボス)先端だけとするこ
とができる。(6) The material of the insulating material is not limited to the thermoplastic resin. For example, if a thermosetting resin is used in a state where the B stage is not completely cured, the insulating material can be spread by the molten metal to secure the bonding area. Alternatively, a thermosetting resin that is completely cured may be used, expecting only insulation. Also with this configuration, it is possible to always contact the object to be welded only with the projection (emboss) tip.
【0044】(7)ターミナルやリードなどの被溶接体
の材質は、銅系金属(例えば黄銅等の銅合金)に限定さ
れない。 (8)被溶接体は、ターミナルやリード等のような実装
基板や電子部品に設けられた端子に限定されない。例え
ば自動車等の組み立て溶接(スポット溶接)に本発明を
適用してもよい。(7) The material of the objects to be welded such as terminals and leads is not limited to copper-based metals (for example, copper alloys such as brass). (8) The object to be welded is not limited to a mounting board such as a terminal or lead, or a terminal provided on an electronic component. For example, the present invention may be applied to assembly welding (spot welding) of an automobile or the like.
【0045】前記実施例から把握され、特許請求の範囲
に記載されていない発明を、その効果とともに以下に記
載する。 (イ)請求項2〜請求項4のいずれか一項において、前
記抵抗溶接用電極が当たる部位を少なくとも残して前記
突起が形成された面の裏面側まで前記絶縁材が被覆され
ている。この構成によれば、絶縁材で被覆されることに
より、被溶接体の絶縁耐量及び耐環境性の向上を図るこ
とができる。The invention grasped from the above embodiment and not described in the scope of the claims will be described below together with the effect thereof. (A) In any one of claims 2 to 4, the insulating material is covered up to the back surface side of the surface on which the projection is formed, leaving at least a portion where the resistance welding electrode abuts. According to this structure, the insulation resistance and the environment resistance of the object to be welded can be improved by being covered with the insulating material.
【0046】(ロ)請求項2〜請求項4のいずれか一項
において、請求項2〜請求項4のいずれか一項に記載の
前記被溶接体を端子として備えている基板部品。この構
成によれば、基板部品に、請求項2〜請求項4のいずれ
か一項に記載の被溶接体を端子として備えたので、抵抗
溶接により実装すべき電子部品を基板部品に十分な強度
でばらつきなく実装することができる。(B) A substrate part according to any one of claims 2 to 4, wherein the object to be welded according to any one of claims 2 to 4 is provided as a terminal. According to this configuration, the board component includes the welded body according to any one of claims 2 to 4 as a terminal, so that the electronic component to be mounted by resistance welding has sufficient strength for the board component. It can be mounted without variation.
【0047】(ハ)前記(ロ)に記載の前記基板部品に
設けられた前記端子に電子部品が抵抗溶接にて実装され
ている電子部品組付製品。この構成によれば、電子部品
実装製品は、請求項5の基板部品に設けられた端子に電
子部品が抵抗溶接にて実装されて構成されているため、
電子部品の実装強度をばらつきなく高いものとすること
ができる。(C) An electronic component assembled product in which an electronic component is mounted by resistance welding on the terminal provided on the board component described in (B). According to this configuration, since the electronic component-mounted product is configured by mounting the electronic component by resistance welding on the terminal provided on the board component according to claim 5,
The mounting strength of the electronic component can be made high without variation.
【0048】[0048]
【発明の効果】従って、請求項1に記載の発明によれ
ば、被溶接体の突起形成面に少なくとも該突起の先端を
露出させた状態に絶縁材を被覆する絶縁材被覆工程と、
両被溶接体を突起形成面にて接触させた状態で、少なく
とも絶縁材被覆後に抵抗溶接用電極を用いた通電を行う
通電溶接工程とを備えたので、両被溶接体の位置関係に
依らず溶接通電時に電流の分流を招かないようにその突
起先端部だけで両被溶接体を接触させることができ、し
かも接合部に絶縁材が異物として残存することを回避で
きるため、十分な接合強度をばらつきなく確保すること
ができる。Therefore, according to the invention described in claim 1, an insulating material coating step of coating the insulating material on the projection forming surface of the object to be welded with at least the tips of the projections exposed.
Since both of the objects to be welded are in contact with each other on the projection forming surface and at least an electric current welding step of energizing using the resistance welding electrode after covering the insulating material is provided, it does not depend on the positional relationship between the objects to be welded. Both welding objects can be brought into contact with each other only by the tips of the protrusions so as not to cause shunting of current when welding current is applied, and it is possible to prevent the insulating material from remaining as foreign matter at the joints. It can be secured without variation.
【0049】請求項2に記載の発明によれば、被溶接体
の突起を、少なくともその先端部が露出するように絶縁
材で被覆したので、両被溶接体を溶接通電時に分流を招
かないようにその突起先端部だけで接触させることがで
きるうえ、接合部に絶縁材が異物として残存することも
回避できるため、十分な接合強度をばらつきなく確保す
ることができる。According to the second aspect of the present invention, since the projection of the object to be welded is covered with the insulating material so that at least the tip of the object is exposed, the two objects to be welded do not cause shunt when welding current is applied. In addition, since it is possible to make contact with only the tip of the protrusion and to prevent the insulating material from remaining as foreign matter at the joint, it is possible to secure sufficient joint strength without variation.
【0050】請求項3に記載の発明によれば、絶縁材
を、突起の先端だけを露出させる被覆厚に被溶接体に被
覆させたので、両被溶接体が突起の接触部以外の部位に
て抵抗溶接用電極にて挟持されても、両被溶接体が傾い
て接触することを回避することができる。According to the third aspect of the present invention, since the insulating material is coated on the object to be welded with a coating thickness that exposes only the tips of the projections, both the objects to be welded are provided on the parts other than the contact parts of the projections. Even if the electrodes are sandwiched by the resistance welding electrodes, it is possible to prevent both the objects to be welded from inclining and contacting each other.
【0051】請求項4に記載の発明によれば、絶縁材を
熱可塑性樹脂としたので、通電発熱時に溶融(軟化)し
た突起回りの絶縁材を接合強度の増強に寄与させること
ができ、一層高い接合強度を確保することができる。According to the fourth aspect of the invention, since the insulating material is a thermoplastic resin, the insulating material around the protrusions that has been melted (softened) at the time of heat generation by electric current can contribute to the enhancement of the bonding strength. High bonding strength can be secured.
【図1】一実施形態におけるターミナルと平リードの抵
抗溶接時の状態を示す斜視図。FIG. 1 is a perspective view showing a state during resistance welding of a terminal and a flat lead according to an embodiment.
【図2】図1のA−A線断面図。FIG. 2 is a sectional view taken along line AA of FIG.
【図3】ターミナルと丸リードの抵抗溶接時の状態を示
す斜視図。FIG. 3 is a perspective view showing a state during resistance welding of a terminal and a round lead.
【図4】図3のB−B線断面図。FIG. 4 is a sectional view taken along line BB of FIG.
【図5】電子部品実装用の基板部品を示す斜視図。FIG. 5 is a perspective view showing a board component for mounting electronic components.
【図6】別例のターミナルを示す平断面図。FIG. 6 is a plan sectional view showing a terminal of another example.
【図7】従来技術におけるターミナルとリードを示す斜
視図。FIG. 7 is a perspective view showing a terminal and a lead according to a conventional technique.
【図8】同じく平断面図。FIG. 8 is a plan sectional view of the same.
【図9】従来技術の抵抗溶接方法を示す側断面図。FIG. 9 is a side sectional view showing a conventional resistance welding method.
3a…被溶接体としての平リード、4a…被溶接体とし
ての丸リード、7,8,21…被溶接体及び端子として
のターミナル、9,11,22…被溶接体を構成する金
属板部、9a,11a,22a…突起としてのエンボ
ス、13,14…抵抗溶接用電極。3a ... Flat lead as a welded object, 4a ... Round lead as a welded object, 7, 8, 21 ... Terminals as a welded object and terminals, 9, 11, 22 ... Metal plate parts constituting the welded object , 9a, 11a, 22a ... Embossing as a protrusion, 13, 14 ... Electrodes for resistance welding.
Claims (4)
該突起にて両被溶接体を接触させた状態で抵抗溶接通電
を行って、抵抗溶接時の電流を発熱を促すべく集中させ
るようにした抵抗溶接方法であって、 前記被溶接体に少なくとも前記突起の先端を露出させた
状態に絶縁材を被覆する絶縁材被覆工程と、 前記両被溶接体を前記突起形成面側で接触させた状態
で、少なくとも前記絶縁材被覆後に両被溶接体間に抵抗
溶接用電極を用いた通電を行う通電溶接工程とを備えた
抵抗溶接方法。1. A projection is formed on one of two objects to be welded,
A resistance welding method in which resistance welding energization is performed in a state in which both objects to be welded are in contact with each other by the projections, and a current at the time of resistance welding is concentrated to promote heat generation, which is at least the object to be welded. An insulating material coating step of coating an insulating material in a state where the tips of the projections are exposed; A resistance welding method comprising: a current welding step of conducting current using a resistance welding electrode.
起が形成された被溶接体であって、 前記被溶接体には絶縁材が少なくとも前記突起の先端を
露出させるように被覆されている被溶接体の構造。2. A body to be welded having a projection for concentrating a current during resistance welding, wherein the body to be welded is covered with an insulating material so as to expose at least the tip of the projection. The structure of the work piece.
露出させるように該突起の突出長より少し短い被覆厚で
被覆されている請求項2記載の被溶接体の構造。3. The structure of the object to be welded according to claim 2, wherein the insulating material is coated with a coating thickness slightly shorter than the protruding length of the projection so as to expose only the tip portion of the projection.
2又は請求項3に記載の被溶接体の構造。4. The structure of the object to be welded according to claim 2, wherein the insulating material is a thermoplastic resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12839996A JPH09314353A (en) | 1996-05-23 | 1996-05-23 | Resistance welding method and construction of body to be welded |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12839996A JPH09314353A (en) | 1996-05-23 | 1996-05-23 | Resistance welding method and construction of body to be welded |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09314353A true JPH09314353A (en) | 1997-12-09 |
Family
ID=14983844
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12839996A Pending JPH09314353A (en) | 1996-05-23 | 1996-05-23 | Resistance welding method and construction of body to be welded |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09314353A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11187623A (en) * | 1997-12-17 | 1999-07-09 | Matsushita Electric Works Ltd | Commutator for motor and method of manufacturing the same |
| JPH11221678A (en) * | 1998-02-03 | 1999-08-17 | Anden | Electromagnetic relay |
| JP2003069198A (en) * | 2001-08-08 | 2003-03-07 | Three M Innovative Properties Co | Sheet for collective electrical connection |
| JP2007121109A (en) * | 2005-10-27 | 2007-05-17 | Aisin Seiki Co Ltd | Sensor device |
| JP2008110357A (en) * | 2006-10-30 | 2008-05-15 | Omron Corp | Conductive terminal welding method and conductive terminal structure |
| JP2015213938A (en) * | 2014-05-09 | 2015-12-03 | 株式会社デンソー | Resistance welding method |
| JP2018537287A (en) * | 2015-10-05 | 2018-12-20 | オウトクンプ オサケイティオ ユルキネンOutokumpu Oyj | Manufacturing method of welded member and use of member |
| US12057603B2 (en) | 2021-06-03 | 2024-08-06 | Prime Planet Energy & Solutions, Inc. | Terminal component, secondary battery, and method for manufacturing terminal component |
| WO2024252574A1 (en) * | 2023-06-07 | 2024-12-12 | 株式会社オートネットワーク技術研究所 | Circuit device |
-
1996
- 1996-05-23 JP JP12839996A patent/JPH09314353A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11187623A (en) * | 1997-12-17 | 1999-07-09 | Matsushita Electric Works Ltd | Commutator for motor and method of manufacturing the same |
| JPH11221678A (en) * | 1998-02-03 | 1999-08-17 | Anden | Electromagnetic relay |
| JP2003069198A (en) * | 2001-08-08 | 2003-03-07 | Three M Innovative Properties Co | Sheet for collective electrical connection |
| JP2007121109A (en) * | 2005-10-27 | 2007-05-17 | Aisin Seiki Co Ltd | Sensor device |
| JP2008110357A (en) * | 2006-10-30 | 2008-05-15 | Omron Corp | Conductive terminal welding method and conductive terminal structure |
| JP2015213938A (en) * | 2014-05-09 | 2015-12-03 | 株式会社デンソー | Resistance welding method |
| JP2018537287A (en) * | 2015-10-05 | 2018-12-20 | オウトクンプ オサケイティオ ユルキネンOutokumpu Oyj | Manufacturing method of welded member and use of member |
| US12057603B2 (en) | 2021-06-03 | 2024-08-06 | Prime Planet Energy & Solutions, Inc. | Terminal component, secondary battery, and method for manufacturing terminal component |
| WO2024252574A1 (en) * | 2023-06-07 | 2024-12-12 | 株式会社オートネットワーク技術研究所 | Circuit device |
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