JPH0121621B2 - - Google Patents
Info
- Publication number
- JPH0121621B2 JPH0121621B2 JP56155873A JP15587381A JPH0121621B2 JP H0121621 B2 JPH0121621 B2 JP H0121621B2 JP 56155873 A JP56155873 A JP 56155873A JP 15587381 A JP15587381 A JP 15587381A JP H0121621 B2 JPH0121621 B2 JP H0121621B2
- Authority
- JP
- Japan
- Prior art keywords
- sealing
- electrode
- jig
- sealing hole
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56155873A JPS5856351A (ja) | 1981-09-29 | 1981-09-29 | 半導体装置の検査方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56155873A JPS5856351A (ja) | 1981-09-29 | 1981-09-29 | 半導体装置の検査方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5856351A JPS5856351A (ja) | 1983-04-04 |
| JPH0121621B2 true JPH0121621B2 (2) | 1989-04-21 |
Family
ID=15615364
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56155873A Granted JPS5856351A (ja) | 1981-09-29 | 1981-09-29 | 半導体装置の検査方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5856351A (2) |
-
1981
- 1981-09-29 JP JP56155873A patent/JPS5856351A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5856351A (ja) | 1983-04-04 |
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