JPH0124074B2 - - Google Patents
Info
- Publication number
- JPH0124074B2 JPH0124074B2 JP58148637A JP14863783A JPH0124074B2 JP H0124074 B2 JPH0124074 B2 JP H0124074B2 JP 58148637 A JP58148637 A JP 58148637A JP 14863783 A JP14863783 A JP 14863783A JP H0124074 B2 JPH0124074 B2 JP H0124074B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- heat sink
- protective member
- printing head
- heating element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/325—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads by selective transfer of ink from ink carrier, e.g. from ink ribbon or sheet
Landscapes
- Accessory Devices And Overall Control Thereof (AREA)
- Electronic Switches (AREA)
Description
【発明の詳細な説明】 本発明は熱印字ヘツドに関する。[Detailed description of the invention] The present invention relates to thermal print heads.
従来例の熱印字ヘツド１には、第１図に示すよ
うに、セラミツクなどでできた絶縁性の基板２を
備え、この基板２の表面に発熱体４を、また、そ
の裏面にアルミニウムなどでできた放熱板６を設
けたものがある。８はローラプラテンである。 As shown in FIG. 1, a conventional thermal printing head 1 includes an insulating substrate 2 made of ceramic or the like, a heating element 4 on the front surface of the substrate 2, and a heating element 4 made of aluminum or the like on the back surface of the substrate 2. Some are equipped with a heat dissipation plate 6. 8 is a roller platen.
ところで、このような従来の熱印字ヘツド１は
印字の際、感熱紙１０やまた熱転写式のものでは
転写リボンに基板２の周側部の上縁２ａが接触す
る。この上縁２ａはばりが出たりしてエツジ状を
なしておりこのため感熱紙や転写リボンに傷が付
くという不具合がある。この不具合を解消するた
め、第２図に示すように、基板２の上縁１２を面
取りしたり、また、放熱板６に基板２の厚さとほ
ぼ同じ高さを有する突出部１６，１６を形成した
りして基板２の周側部に感熱紙１０や転写リボン
が直接接触しないようにすることも試みられてい
る。しかしながら、前者の場合には、基板２が硬
いので面取り作業が容易でない。しかも、面取り
した分だけ発熱体４を形成する側の表面の有効面
積が少なくなる。また後者の場合には放熱板６の
加工形状が複雑となり、加工に手数がかかり高価
になる。しかも基板２の厚さにばらつきがある場
合には放熱板６の突出部１６，１６の高さも調整
せねばならず煩雑である。 By the way, when such a conventional thermal printing head 1 prints, the upper edge 2a of the circumferential side of the substrate 2 comes into contact with the thermal paper 10 or, in the case of a thermal transfer type, with the transfer ribbon. The upper edge 2a has an edge shape with burrs, which causes a problem of damaging the thermal paper or the transfer ribbon. In order to solve this problem, as shown in FIG. 2, the upper edge 12 of the substrate 2 is chamfered, and protrusions 16, 16 having almost the same height as the thickness of the substrate 2 are formed on the heat sink 6. Attempts have also been made to prevent the thermal paper 10 or the transfer ribbon from coming into direct contact with the peripheral side of the substrate 2. However, in the former case, since the substrate 2 is hard, chamfering is not easy. Furthermore, the effective area of the surface on which the heating element 4 is formed is reduced by the amount of chamfering. Moreover, in the latter case, the processed shape of the heat sink 6 becomes complicated, and the processing becomes labor-intensive and expensive. Moreover, if there are variations in the thickness of the substrate 2, the heights of the protrusions 16, 16 of the heat sink 6 must also be adjusted, which is complicated.
本発明は上述の問題点に鑑みてなされたもので
あつて、従来の問題点を解消し、感熱紙や転写リ
ボンに傷が付かないようにすることを目的とす
る。 The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to solve the conventional problems and to prevent thermal paper and transfer ribbon from being damaged.
以下、本発明を第４図および第５図に示す一実
施例に基づいて詳細に説明する。 Hereinafter, the present invention will be explained in detail based on an embodiment shown in FIGS. 4 and 5.
第４図はこの実施例の熱印字ヘツドの斜視図、
第５図は第４図の―線に沿う断面図である。
この実施例の熱印字ヘツド２０はセラミツクでで
きた絶縁性の基板２２を備える。基板２２の表面
２２ａには発熱体２４と、この発熱体２４を通電
制御する回路部品へ接続するための導体２６，２
６…とがパターン上に形成されている。 FIG. 4 is a perspective view of the thermal printing head of this embodiment;
FIG. 5 is a sectional view taken along the line -- in FIG. 4.
The thermal print head 20 of this embodiment includes an insulating substrate 22 made of ceramic. On the surface 22a of the board 22, there are a heating element 24 and conductors 26, 2 for connecting the heating element 24 to circuit components that control energization.
6... are formed on the pattern.
一方、この基板２２の裏面２２ｂには、その四
方に張り出す大きさで、かつ、アルミニウムなど
の金属からなる放熱板２８がエポキシ系樹脂から
なる接着剤を介して固着されている。 On the other hand, on the back surface 22b of the substrate 22, a heat dissipation plate 28 made of a metal such as aluminum and having a size that protrudes in all directions is fixed to the back surface 22b of the substrate 22 via an adhesive made of epoxy resin.
そして、この基板２２の側面２２ｃと放熱板２
８の表面２８ａとで挟まれた隅部には、前記接着
剤と同じエポキシ系樹脂からなる保護部材３２が
設けられている。なお、この保護部材３２は、基
板２２と放熱板２８とを接着剤で接着する際もし
くは接着した後、前記隅部に充填して硬化させた
ものである。そして、この保護部材３２の厚みＷ
は基板２２の表面２２ａから放熱板２８の表面２
８ａまでの高さと同じになつており、その表面形
状は基板２２の表面２２ａ、すなわち、上縁２２
ｄから放熱板２８の表面２８ａにまで至り、か
つ、外方に向かつて湾曲した曲面状に形成されて
いる。なお２９はローラプラテンである。 Then, the side surface 22c of this board 22 and the heat sink 2
A protective member 32 made of the same epoxy resin as the adhesive is provided at the corner sandwiched between the surface 28a and the surface 28a of the adhesive. Note that this protective member 32 is filled into the corner portion and hardened when or after bonding the substrate 22 and the heat sink plate 28 with an adhesive. The thickness W of this protective member 32
is from the surface 22a of the substrate 22 to the surface 2 of the heat sink 28.
8a, and its surface shape is the surface 22a of the substrate 22, that is, the upper edge 22.
d to the surface 28a of the heat sink 28, and is formed in a curved shape that curves outward. Note that 29 is a roller platen.
従つて、印字の際は感熱紙３０や転写リボンに
基板２２の上縁２２ｄが直接接触せず、代りに保
護部材３２が接触することになる。保護部材３２
は樹脂でできているので感熱紙１０や転写リボン
が傷付くことがない。 Therefore, during printing, the upper edge 22d of the substrate 22 does not come into direct contact with the thermal paper 30 or the transfer ribbon, but instead comes into contact with the protective member 32. Protective member 32
Since it is made of resin, the thermal paper 10 and the transfer ribbon will not be damaged.
以上のように、本発明によれば、基板の側面と
放熱板の表面とで挟まれた隅部に樹脂が充填され
てなる保護部材を設けるとともに、この保護部材
の表面形状を前記基板の表面から前記放熱板の表
面にまで至り、かつ、外方に向かつて湾曲した曲
面状に形成しているので、印字に際して感熱紙や
転写リボンが基板の上縁のエツジに直接接触する
ことがなくなり、これらの傷付きが有効に防止さ
れることになる。しかも、この保護部材は充填樹
脂からなるものであるから、この樹脂の接着力に
よつて基板と放熱板との結合力が強化されること
になるばかりか、この保護部材と接着材とが同質
の材料であることから、互いに一体化して基板と
放熱板との接合面から基板の周囲までの隙間を連
続して埋めることになる結果、基板の周辺をみす
封止する効果が生じ、基板と放熱板との間に湿気
などが侵入することを確実に防止し、湿気による
結合力の低下をなくすことができる。また、基板
の面取りが不要となり、かつ、発熱体の形成面の
有効面積を広くとれる。さらに、基板の厚さにば
らつきがあつてもその対応が容易である。また、
基板に放熱板を接着する際同時に保護部材を形成
することも可能なため作業が簡単で、しかも、加
工も容易なため価格を低減できるという優れた効
果が発揮される。 As described above, according to the present invention, a protective member filled with resin is provided in the corner sandwiched between the side surface of the substrate and the surface of the heat sink, and the surface shape of the protective member is adjusted to the surface of the substrate. Since it is formed into a curved surface that extends from the top to the surface of the heat sink and curves outward, the thermal paper or transfer ribbon does not come into direct contact with the upper edge of the substrate during printing. These scratches can be effectively prevented. Moreover, since this protective member is made of filled resin, not only does the adhesive force of this resin strengthen the bonding force between the board and the heat sink, but also the protective member and adhesive are of the same quality. Because these materials are integrated with each other, they continuously fill the gap between the bonding surface of the substrate and the heat sink to the periphery of the substrate, resulting in the effect of partially sealing the periphery of the substrate. It is possible to reliably prevent moisture from entering between the heat dissipation plate and the heat dissipation plate, thereby eliminating a decrease in bonding strength due to moisture. Furthermore, chamfering of the substrate is not required, and the effective area of the heating element formation surface can be increased. Furthermore, it is easy to deal with variations in the thickness of the substrate. Also,
It is possible to form the protective member at the same time as bonding the heat dissipation plate to the substrate, which simplifies the work.Moreover, since it is easy to process, it has the excellent effect of reducing costs.
第１図ないし第３図は従来例を、第４図および
第５図は本発明の実施例をそれぞれ示すもので、
第１図ないし第３図は熱印字ヘツドの断面図、第
４図は熱印字ヘツドの斜視図、第５図は第４図の
―線に沿う断面図である。
２０……熱印字ヘツド、２２……基板、２４…
…発熱体、２８……放熱板、３２……保護部材。
FIGS. 1 to 3 show a conventional example, and FIGS. 4 and 5 show an embodiment of the present invention, respectively.
1 to 3 are sectional views of the thermal printing head, FIG. 4 is a perspective view of the thermal printing head, and FIG. 5 is a sectional view taken along the line -- in FIG. 4. 20...Thermal printing head, 22...Substrate, 24...
...Heating element, 28... Heat sink, 32... Protective member.
Claims (1)
体を設ける一方、この基板の裏面にはその四方に
張り出す大きさの放熱板が樹脂を介して接着され
てなる熱印字ヘツドにおいて、 前記基板の側面と前記放熱板の表面とで挟まれ
た隅部に充填樹脂からなる保護部材を設けるとと
もに、この保護部材の表面形状を前記基板の表面
から前記放熱板の表面にまで至り、かつ、外方に
向かつて湾曲した曲面状に形成したことを特徴と
する熱印字ヘツド。[Claims] 1. An insulating substrate is provided, and a heating element is provided on the front surface of the substrate, while a heat dissipation plate of a size extending from all sides is bonded to the back surface of the substrate via resin. In the thermal printing head, a protective member made of filled resin is provided at a corner sandwiched between the side surface of the substrate and the surface of the heat sink, and the surface shape of the protective member is changed from the surface of the substrate to the surface of the heat sink. What is claimed is: 1. A thermal printing head characterized in that it is formed in a curved shape that extends to the top and curves outward.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58148637A JPS6038177A (en) | 1983-08-11 | 1983-08-11 | Thermal printing head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58148637A JPS6038177A (en) | 1983-08-11 | 1983-08-11 | Thermal printing head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6038177A JPS6038177A (en) | 1985-02-27 |
| JPH0124074B2 true JPH0124074B2 (en) | 1989-05-10 |
Family
ID=15457243
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58148637A Granted JPS6038177A (en) | 1983-08-11 | 1983-08-11 | Thermal printing head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6038177A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0649374B2 (en) * | 1985-06-07 | 1994-06-29 | 松下電器産業株式会社 | Thermal recording head |
| JPH051409Y2 (en) * | 1985-09-20 | 1993-01-14 | ||
| JP6427028B2 (en) * | 2015-02-16 | 2018-11-21 | 東芝ホクト電子株式会社 | Thermal head |
| CN109569616B (en) * | 2017-09-29 | 2021-11-30 | 中国石油化工股份有限公司 | Catalyst composition, preparation method and application thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58115344U (en) * | 1982-01-30 | 1983-08-06 | 日本電気株式会社 | thermal head |
-
1983
- 1983-08-11 JP JP58148637A patent/JPS6038177A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6038177A (en) | 1985-02-27 |
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