JPH01246852A - Ceramic package for semiconductor device - Google Patents

Ceramic package for semiconductor device

Info

Publication number
JPH01246852A
JPH01246852A JP7538088A JP7538088A JPH01246852A JP H01246852 A JPH01246852 A JP H01246852A JP 7538088 A JP7538088 A JP 7538088A JP 7538088 A JP7538088 A JP 7538088A JP H01246852 A JPH01246852 A JP H01246852A
Authority
JP
Japan
Prior art keywords
cap
base
ceramic package
semiconductor device
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7538088A
Other languages
Japanese (ja)
Inventor
Hiromori Tobase
鳥羽瀬　浩守
Hiroshi Ogi
小木　博志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HARA SEIKI SANGYO KK
NEC Kyushu Ltd
Original Assignee
HARA SEIKI SANGYO KK
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HARA SEIKI SANGYO KK, NEC Kyushu Ltd filed Critical HARA SEIKI SANGYO KK
Priority to JP7538088A priority Critical patent/JPH01246852A/en
Publication of JPH01246852A publication Critical patent/JPH01246852A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To prevent the shift of a cap in a package consisting of a base, on which a semiconductor chip is fixed, and the cap for sealing this base by a method wherein the base and the cap are respectively provided with a plurality of protruding parts and a plurality of recessed parts, in which the protruding parts are fitted. CONSTITUTION:In a ceramic package for a semiconductor device, 2 pieces of protruding parts 4 are provided on a base 1 having a cavity, on which a semiconductor pellet is fixed. On the other hand, a cap 2 for sealing the base 1 is provided with recessed parts 5, in which these protruding parts 4 are fitted. In case the base 1 is sealed with the cap 2, the protruding parts 4 of the base 1 are fitted in the recessed parts 5 of the cap 2. Thereby, in the case of sealing, the shift of the cap 2 is eliminated.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は半導体装置用セラミックパッケージに関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a ceramic package for semiconductor devices.

〔従来の技術〕[Conventional technology]

従来、この種の半導体装置用セラミックパッケージは、
半導体チップを固着するための凹部からなるキャビティ
を有するベースと、このベースを封止するキャップとか
ら構成され、ベースとキャップとは低融点ガラス等によ
り封止されていた。Conventionally, this type of ceramic package for semiconductor devices was
It consists of a base having a cavity made of a recess for fixing a semiconductor chip, and a cap that seals the base, and the base and the cap are sealed with low melting point glass or the like.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

上述した従来の半導体装置用セラミックパッケージは、
封止する際にキャップがずれやすいという欠点がある。The conventional ceramic package for semiconductor devices mentioned above is
The drawback is that the cap tends to shift during sealing.

本発明の目的は、封止する際にキャップずれが生じるこ
とのない半導体装置用セラミックパッケージを提供する
ことにある。An object of the present invention is to provide a ceramic package for a semiconductor device that does not cause cap displacement during sealing.

〔課題を解決するための手段〕[Means to solve the problem]

本発明の半導体装置用セラミックパッケージは、半導体
チップを固着するベースと該ベースを封止するキャップ
とからなる半導体装置用セラミックパッケージであって
、前記ベース及びキャップにはそれぞれ互に嵌合する複
数の凹部及び凸部を有するものである。The ceramic package for a semiconductor device of the present invention is a ceramic package for a semiconductor device comprising a base for fixing a semiconductor chip and a cap for sealing the base, and the base and the cap each have a plurality of It has a concave portion and a convex portion.

〔実施例〕〔Example〕

次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.

第１図（ａ）〜（ｄ）は本発明の一実施例の平面図及び
断面図であり、第１図（ａ）、（ｂ）はキャップの平面
図及びＡ−Ａ’轢断面図、第１図（ｃ）、（ｄ）はベー
スの平面図及びＢ−Ｂ’線断面図である。FIGS. 1(a) to 1(d) are a plan view and a cross-sectional view of an embodiment of the present invention, and FIGS. 1(a) and (b) are a plan view and an A-A' cross-sectional view of the cap, FIGS. 1(c) and 1(d) are a plan view and a sectional view taken along the line BB' of the base.

第１図（ａ）〜（ｄ）において、半導体ベレットを固着
するキャビティ３を有するベース１には２個の凸部４が
形成されている。そしてこのベース１を封止するキャッ
プ２には、この凸部４に嵌合する凹部５が設けられてい
る。尚、第１図（Ｃ）において６はリードである。In FIGS. 1(a) to 1(d), two convex portions 4 are formed on a base 1 having a cavity 3 for fixing a semiconductor pellet. A cap 2 that seals the base 1 is provided with a recess 5 that fits into the projection 4. In addition, in FIG. 1(C), 6 is a lead.

このように構成された本実施例においては、ベース１を
キャップ２で封止する際に、ベース１の凸部４とキャッ
プ２の凹部５とを嵌合させることにより、キャップがず
れることはなくなる。In this embodiment configured as described above, when the base 1 is sealed with the cap 2, the convex part 4 of the base 1 and the concave part 5 of the cap 2 are fitted, so that the cap does not shift. .

上記実施例においては２個の凹部及び凸部を設けた場合
について説明したが、３個以上であってもよい。また、
ベースに凸部をそしてキャップに凹部をそれぞれ設けた
場合について説明したが、ベースに凹部をそしてキャッ
プに凸部を設けてもよいことは勿論である。In the above embodiment, the case where two concave portions and two convex portions are provided has been described, but the number may be three or more. Also,
Although a case has been described in which the base has a convex portion and the cap has a concave portion, it is of course possible to provide a concave portion on the base and a convex portion on the cap.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明は、半導体装置用セラミック
パッケージのベース及びキャップにそれぞれ互に嵌合す
る複数の凹部及び凸部を設けることにより、封止する際
にキャップずれを生じることがないという効果がある。As explained above, the present invention has the advantage that by providing a plurality of concave portions and convex portions that fit into each other in the base and cap of a ceramic package for a semiconductor device, the cap does not shift during sealing. There is.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図（ａ）〜（ｄ）は本発明の一実施例の平面図及び
断面図である。 １・・・ベース、２・・・キャップ、３キヤビテイ、４
・・・凸部、５・・・凹部、６・・・リード。 代理人　弁理士　　内　原　　音 （α） 第 １図FIGS. 1(a) to 1(d) are a plan view and a sectional view of an embodiment of the present invention. 1...Base, 2...Cap, 3 Cavity, 4
...Convex portion, 5...Concave portion, 6...Lead. Agent Patent Attorney Uchihara Oto (α) Figure 1

Claims (1)

【特許請求の範囲】[Claims] 　半導体チップを固着するベースと該ベースを封止する
キャップとからなる半導体装置用セラミックパッケージ
において、前記ベース及びキャップにはそれぞれ互に嵌
合する複数の凹部及び凸部を有することを特徴とする半
導体装置用セラミックパッケージ。A ceramic package for a semiconductor device comprising a base for fixing a semiconductor chip and a cap for sealing the base, wherein the base and the cap each have a plurality of recesses and projections that fit into each other. Ceramic package for equipment.
JP7538088A 1988-03-28 1988-03-28 Ceramic package for semiconductor device Pending JPH01246852A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7538088A JPH01246852A (en) 1988-03-28 1988-03-28 Ceramic package for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7538088A JPH01246852A (en) 1988-03-28 1988-03-28 Ceramic package for semiconductor device

Publications (1)

Publication Number Publication Date
JPH01246852A true JPH01246852A (en) 1989-10-02

Family

ID=13574532

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7538088A Pending JPH01246852A (en) 1988-03-28 1988-03-28 Ceramic package for semiconductor device

Country Status (1)

Country Link
JP (1) JPH01246852A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104795364A (en) * 2015-04-17 2015-07-22 苏州晶方半导体科技股份有限公司 Package assembling structure, forming method thereof and package assembling method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104795364A (en) * 2015-04-17 2015-07-22 苏州晶方半导体科技股份有限公司 Package assembling structure, forming method thereof and package assembling method
CN104795364B (en) * 2015-04-17 2018-05-18 苏州晶方半导体科技股份有限公司 Packaging part package assembly and forming method thereof and packaging part assemble method

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